LPC1778FBD208,551 NXP Semiconductors, LPC1778FBD208,551 Datasheet - Page 107

• Manufacturer Part Number: LPC1778FBD208,551
• Description: MCU ARM 512K FLASH 208-LQFP
• Manufacturer: NXP Semiconductors
• Series: LPC17xxr

Specifications of LPC1778FBD208,551

• Core Processor: ARM® Cortex-M3™
• Core Size: 32-Bit
• Speed: 100MHz
• Connectivity: CAN, EBI/EMI, Ethernet, I²C, Microwire, MMC, SPI, SSI, SSP, UART/USART, USB OTG
• Peripherals: Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT
• Number Of I /o: 165
• Program Memory Size: 512KB (512K x 8)
• Program Memory Type: FLASH
• Eeprom Size: 4K x 8
• Ram Size: 96K x 8
• Voltage - Supply (vcc/vdd): 2.4 V ~ 3.6 V
• Data Converters: A/D 8x12b, D/A 1x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 208-LQFP
• Processor Series: LPC177x
• Core: ARM Cortex M3
• Data Bus Width: 32 bit
• Data Ram Size: 96 KB
• Interface Type: SSP, I2S, USB, JTAG, Serial, UART, I2C, SD/MMC
• Maximum Clock Frequency: 100 MHz
• Number Of Programmable I/os: 165
• Number Of Timers: 4
• Operating Supply Voltage: 2.4 V to 3.6 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• Operating Temperature Range: - 40 C to + 85 C
• Supply Current (max): 100 mA
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 568-6690

NXP Semiconductors
Fig 44. TFBGA180 package
LPC178X_7X
Objective data sheet
TFBGA180: thin fine-pitch ball grid array package; 180 balls; body 12 x 12 x 0.8 mm
DIMENSIONS (mm are the original dimensions)
UNIT
mm
VERSION
OUTLINE
SOT570-2
ball A1
index area
ball A1
index area
max.
1.2
A
0.35
0.25
A
P
N
M
K
H
G
E
D
C
B
A
1
L
J
F
0.85
0.75
1
A
2
2
e
IEC
3
0.5
0.4
b
4
5
12.2
11.8
6
D
7
e
D
1
12.2
11.8
8
E
All information provided in this document is subject to legal disclaimers.
9
1/2 e
JEDEC
10
0.8
0
11
e
REFERENCES
12
b
10.4
Rev. 2 — 27 May 2011
13 14
e
1
10.4
e
1/2 e
2
JEITA
scale
B
e
5
∅ w
∅ v
0.15
e
A
v
E
2
M
M
C
C
0.08
w
A
B
0.12
y
10 mm
A
32-bit ARM Cortex-M3 microcontroller
A
0.1
y
2
1
y
1
A
C
1
PROJECTION
EUROPEAN
detail X
LPC178x/7x
C
X
y
© NXP B.V. 2011. All rights reserved.
ISSUE DATE
03-03-03
06-03-14
SOT570-2
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