LPC1778FBD208,551 NXP Semiconductors, LPC1778FBD208,551 Datasheet - Page 110

MCU ARM 512K FLASH 208-LQFP

LPC1778FBD208,551

Manufacturer Part Number
LPC1778FBD208,551
Description
MCU ARM 512K FLASH 208-LQFP
Manufacturer
NXP Semiconductors
Series
LPC17xxr
Datasheets

Specifications of LPC1778FBD208,551

Core Processor
ARM® Cortex-M3™
Core Size
32-Bit
Speed
100MHz
Connectivity
CAN, EBI/EMI, Ethernet, I²C, Microwire, MMC, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals
Brown-out Detect/Reset, DMA, I²S, Motor Control PWM, POR, PWM, WDT
Number Of I /o
165
Program Memory Size
512KB (512K x 8)
Program Memory Type
FLASH
Eeprom Size
4K x 8
Ram Size
96K x 8
Voltage - Supply (vcc/vdd)
2.4 V ~ 3.6 V
Data Converters
A/D 8x12b, D/A 1x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Package / Case
208-LQFP
Processor Series
LPC177x
Core
ARM Cortex M3
Data Bus Width
32 bit
Data Ram Size
96 KB
Interface Type
SSP, I2S, USB, JTAG, Serial, UART, I2C, SD/MMC
Maximum Clock Frequency
100 MHz
Number Of Programmable I/os
165
Number Of Timers
4
Operating Supply Voltage
2.4 V to 3.6 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
Operating Temperature Range
- 40 C to + 85 C
Supply Current (max)
100 mA
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
568-6690

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
LPC1778FBD208,551
Manufacturer:
NXP Semiconductors
Quantity:
10 000
NXP Semiconductors
LPC178X_7X
Objective data sheet
Fig 47. Reflow soldering of the TFBGA180 package
Footprint information for reflow soldering of TFBGA180 package
DIMENSIONS in mm
0.80
P
0.400
SL
0.400
solder land
solder paste deposit
solder land plus solder paste
occupied area
solder resist
SP
Hy
0.550
SR
P
12.575 12.575
Hx
Refer to the package outline drawing for actual layout
Hy
P
All information provided in this document is subject to legal disclaimers.
Rev. 2 — 27 May 2011
Generic footprint pattern
Hx
32-bit ARM Cortex-M3 microcontroller
detail X
SR
SL
SP
see detail X
LPC178x/7x
© NXP B.V. 2011. All rights reserved.
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