STM32F215RET6

Manufacturer Part NumberSTM32F215RET6
DescriptionMCU ARM 512KB FLASH 64LQFP
ManufacturerSTMicroelectronics
SeriesSTM32
STM32F215RET6 datasheets

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Specifications of STM32F215RET6

Core ProcessorARM® Cortex-M3™Core Size32-Bit
Speed120MHzConnectivityCAN, I²C, IrDA, LIN, MMC, SPI, UART/USART, USB OTG
PeripheralsBrown-out Detect/Reset, DMA, I²S, LCD, POR, PWM, WDTNumber Of I /o51
Program Memory Size512KB (512K x 8)Program Memory TypeFLASH
Eeprom Size-Ram Size132K x 8
Voltage - Supply (vcc/vdd)1.8 V ~ 3.6 VData ConvertersA/D 16x12b; D/A 2x12b
Oscillator TypeInternalOperating Temperature-40°C ~ 85°C
Package / Case64-LFQFPLead Free Status / Rohs StatusLead free / RoHS Compliant
Other names497-11178  
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Page 116/158

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Electrical characteristics
5.3.24
Embedded reference voltage
The parameters given in
temperature and V
Table 66.
Embedded internal reference voltage
Symbol
V
Internal reference voltage
REFINT
ADC sampling time when
(1)
T
reading the internal reference
S_vrefint
voltage
Internal reference voltage
V
RERINT_s
spread over the temperature
(2)
range
(2)
T
Temperature coefficient
Coeff
(2)
t
Startup time
START
1. Shortest sampling time can be determined in the application by multiple iterations.
2. Guaranteed by design, not tested in production.
5.3.25
FSMC characteristics
Asynchronous waveforms and timings
Figure 53
through
Table 70
provide the corresponding timings. The results shown in these tables are obtained
with the following FSMC configuration:
AddressSetupTime = 0
AddressHoldTime = 1
DataSetupTime = 1
116/158
Table 66
are derived from tests performed under ambient
supply voltage conditions summarized in
DD
Parameter
Conditions
–40 °C < T
V
DD
Figure 56
represent asynchronous waveforms and
Doc ID 17050 Rev 4
STM32F215xx, STM32F217xx
Table
10.
Min
Max
Typ
< +105 °C 1.18
1.21
1.24
A
16
-
-
= 3 V
-
3
5
-
30
50
-
6
10
Table 67
through
Unit
V
µs
mV
ppm/°C
µs