MC100EP195FAG ON Semiconductor, MC100EP195FAG Datasheet - Page 20

IC PROGRAM DELAY 3.3V ECL 32LQFP

MC100EP195FAG

Manufacturer Part Number
MC100EP195FAG
Description
IC PROGRAM DELAY 3.3V ECL 32LQFP
Manufacturer
ON Semiconductor
Series
100EPr
Type
Programmable Delay Chipr
Datasheet

Specifications of MC100EP195FAG

Input
ECL, LVCMOS, LVTTL
Output
ECL
Frequency - Max
1.2GHz
Voltage - Supply
3 V ~ 3.6 V
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
32-LQFP
Frequency-max
1.2GHz
Function
Active Programmable Delay Line
Supply Voltage (min)
+/- 3 V
Maximum Operating Temperature
+ 85 C
Minimum Operating Temperature
- 40 C
Mounting Style
SMD/SMT
Supply Voltage (max)
+/- 3.6 V
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
MC100EP195FAGOS

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MC100EP195FAG
Manufacturer:
ON Semiconductor
Quantity:
10 000
Part Number:
MC100EP195FAG
Manufacturer:
ON/安森美
Quantity:
20 000
PUBLICATION ORDERING INFORMATION
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to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
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32 X
2 X
2 X
LOCATION
0.15 C
0.10 C
0.08 C
PIN ONE
0.15 C
32 X
L
32 X
0.10
0.05 C
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
b
É É
É É
8
1
C
BOTTOM VIEW
32
9
A
SIDE VIEW
TOP VIEW
B
D2
D
16
25
A1
17
(A3)
24
e
E
EXPOSED PAD
E2
A
B
32 X
K
N. American Technical Support: 800−282−9855 Toll Free
Europe, Middle East and Africa Technical Support:
Japan Customer Focus Center
PACKAGE DIMENSIONS
USA/Canada
Phone: 421 33 790 2910
Phone: 81−3−5773−3850
A
QFN32 5*5*1 0.5 P
http://onsemi.com
CASE 488AM−01
C
SEATING
PLANE
ISSUE O
*For additional information on our Pb−Free strategy and soldering
20
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
0.63
32 X
0.28
32 X
SOLDERING FOOTPRINT*
NOTES:
1. DIMENSIONS AND TOLERANCING PER
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
4. COPLANARITY APPLIES TO THE EXPOSED
ASME Y14.5M, 1994.
TERMINAL AND IS MEASURED BETWEEN
0.25 AND 0.30 MM TERMINAL
PAD AS WELL AS THE TERMINALS.
DIM
A1
A3
D2
E2
A
b
D
E
K
L
e
3.20
5.30
0.800
0.000
0.180
2.950
2.950
0.200
0.300
MIN
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
MILLIMETERS
0.500 BSC
0.200 REF
5.00 BSC
5.00 BSC
DIMENSIONS: MILLIMETERS
NOM
0.900
0.025
0.250
3.100
3.100
0.400
−−−
1.000
0.050
0.300
3.250
3.250
0.500
MAX
−−−
0.50 PITCH
28 X
3.20
MC10EP195/D
5.30

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