MC100EP195MNG ON Semiconductor, MC100EP195MNG Datasheet - Page 12

• Manufacturer Part Number: MC100EP195MNG
• Description: IC PROGR DELAY CHIP 3.3V 32-QFN
• Manufacturer: ON Semiconductor
• Series: 100EPr
• Type: Programmable Delay Chipr

Specifications of MC100EP195MNG

• Input: ECL, LVCMOS, LVTTL
• Output: ECL
• Frequency - Max: 1.2GHz
• Voltage - Supply: 3 V ~ 3.6 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 32-TFQFN Exposed Pad
• Frequency-max: 1.2GHz
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

NOTE: Device will meet the specifications after thermal equilibrium has been established when mounted in a test socket or printed circuit
20. Measured using a 750 mV source, 50% duty cycle clock source. All loading with 50 W to V
21. Specification limits represent the amount of delay added with the assertion of each individual delay control pin. The various combinations
22. Duty cycle skew guaranteed only for differential operation measured from the cross point of the input to the cross point of the output.
23. This setup time defines the amount of time prior to the input signal the delay tap of the device must be set.
24. This setup time is the minimum time that EN must be asserted prior to the next transition of IN/IN to prevent an output response greater than
25. This hold time is the minimum time that EN must remain asserted after a negative going IN or positive going IN to prevent an output response
26. This release time is the minimum time that EN must be deasserted prior to the next IN/IN transition to ensure an output response that meets
27. The monotonicity indicates the increasing delay value for each binary count increment on the control inputs D[9:0].
Table 12. AC CHARACTERISTICS
Symbol
f
t
t
t
Dt
mono
t
t
t
t
t
V
t
t
max
PLH
PHL
RANGE
SKEW
s
h
R
jitter
r
f
PP
of asserted delay control inputs will typically realize D0 resolution steps across the specified programmable range.
±75 mV to that IN/IN transition.
greater than ±75 mV to that IN/IN transition.
the specified IN to Q propagation delay and transition times.
board with maintained transverse airflow greater than 500 lfpm. Electrical parameters are guaranteed only over the declared
operating temperature range. Functional operation of the device exceeding these conditions is not implied. Device specification limit
values are applied individually under normal operating conditions and not valid simultaneously.
Maximum Frequency
Propagation Delay
Programmable Range
Step Delay (Note 21)
Monotonicity (Note 27)
Duty Cycle Skew (Note 22)
Setup Time
Hold Time
Release Time
RMS Random Clock Jitter @ 1.2 GHz
IN to Q; D(0:10) = 1023 or SETMAX
Input Voltage Swing
(Differential Configuration)
Output Rise/Fall Time @ 50 MHz
IN to Q; D(0:10) = 0 or SETMIN
Characteristic
IN to Q; D(0−10) = 1023
20−80% (CASCADE)
EN to Q; D(0−10) = 0
t
IN to Q; D(0−10) = 0
PD
EN to IN (Note 24)
IN to EN (Note 25)
EN to IN (Note 26)
SET MAX to LEN
(max) − t
D0 to CASCADE
D to IN (Note 23)
SET MIN to LEN
20−80% (Q)
|t
V
PHL
D to LEN
LEN to D
CC
PD
D0 High
D1 High
D2 High
D3 High
D4 High
D5 High
D6 High
D7 High
D8 High
D9 High
−t
(min)
= 0 V; V
PLH
|
EE
1650
9500
1600
7850
Min
300
200
300
300
200
400
150
400
350
150
100
85
= −3.0 V to −3.6 V or V
http://onsemi.com
−40°C
11500
2050
2150
9450
2250
4500
1100
0.86
0.89
Typ
420
130
312
590
140
150
250
−25
200
275
800
100
140
1.2
13
27
44
90
25
60
0
12
13500
2450
2600
1200
Max
500
135
200
10000
1800
1800
8200
CC
Min
350
200
300
300
200
400
150
400
350
150
110
85
= 3.0 V to 3.6 V; V
12200
10000
25°C
2200
2300
1180
2400
4800
TBD
1.16
1.09
Typ
450
140
335
650
160
170
100
280
−75
250
200
800
150
110
1.2
14
30
47
97
25
0
CC
− 2.0 V.
14000
2600
2800
1200
Max
550
135
200
EE
= 0 V (Note 20)
10800
1950
2000
8850
Min
425
200
300
300
200
400
150
400
350
150
130
95
13300
10950
85°C
2350
2500
1300
2650
5300
1.12
1.02
Typ
525
100
145
360
690
180
180
300
−50
300
225
800
125
170
1.2
41
25
80
0
15800
2750
3000
1200
Max
625
155
220
GHz
Unit
mV
ps
ps
ps
ps
ps
ps
ps
ps
ps