IC BUFFER FANOUT 1:2 DIFF 8TSSOP

MC100EP11DTR2G

Manufacturer Part NumberMC100EP11DTR2G
DescriptionIC BUFFER FANOUT 1:2 DIFF 8TSSOP
ManufacturerON Semiconductor
Series100EP
TypeFanout Buffer (Distribution)
MC100EP11DTR2G datasheet
 


Specifications of MC100EP11DTR2G

Number Of Circuits1Ratio - Input:output1:2
Differential - Input:outputYes/YesInputECL, PECL
OutputECL, PECLFrequency - Max3GHz
Voltage - Supply3 V ~ 5.5 VOperating Temperature-40°C ~ 85°C
Mounting TypeSurface MountPackage / Case8-TSSOP
Frequency-max3GHzLead Free Status / RoHS StatusLead free / RoHS Compliant
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MC10EP11, MC100EP11
3.3V / 5V ECL 1:2
Differential Fanout Buffer
Description
The MC10/100EP11 is a differential 1:2 fanout buffer. The device is
pin and functionally equivalent to the LVEL11 device. With AC
performance much faster than the LVEL11 device, the EP11 is ideal
for applications requiring the fastest AC performance available.
The 100 Series contains temperature compensation.
Features
220 ps Typical Propagation Delay
Maximum Clock Frequency > 3 GHz Typical
PECL Mode Operating Range: V
CC
with V
= 0 V
EE
NECL Mode Operating Range: V
CC
with V
= −3.0 V to −5.5 V
EE
Open Input Default State
Safety Clamp on Inputs
Q Outputs Will Default LOW with Inputs Open or at V
Pb−Free Packages are Available
© Semiconductor Components Industries, LLC, 2009
October, 2009 − Rev. 10
= 3.0 V to 5.5 V
= 0 V
EE
See detailed ordering and shipping information in the package
dimensions section on page 9 of this data sheet.
1
http://onsemi.com
MARKING DIAGRAMS*
8
8
8
HEP11
KEP11
ALYW
ALYW
1
G
SOIC−8
1
1
D SUFFIX
CASE 751
8
8
8
1
HP11
ALYWG
ALYWG
TSSOP−8
G
DT SUFFIX
1
1
CASE 948R
1
4
DFN8
MN SUFFIX
CASE 506AA
H
= MC10
A
= Assembly Location
K
= MC100
L
= Wafer Lot
5K
= MC10
Y
= Year
2Z
= MC100
W
= Work Week
M
= Date Code
G
= Pb−Free Package
(Note: Microdot may be in either location)
*For additional marking information, refer to
Application Note AND8002/D.
ORDERING INFORMATION
Publication Order Number:
MC10EP11/D
G
KP11
G

MC100EP11DTR2G Summary of contents

  • Page 1

    MC10EP11, MC100EP11 3.3V / 5V ECL 1:2 Differential Fanout Buffer Description The MC10/100EP11 is a differential 1:2 fanout buffer. The device is pin and functionally equivalent to the LVEL11 device. With AC performance much faster than the LVEL11 device, the EP11 ...

  • Page 2

    Figure 1. 8−Lead Pinout (Top View) and Logic Diagram Table 2. ATTRIBUTES Internal Input Pulldown Resistor Internal Input Pullup Resistor ESD Protection Moisture Sensitivity, Indefinite Time Out of Drypack (Note 1) Flammability ...

  • Page 3

    Table 3. MAXIMUM RATINGS Symbol Parameter V PECL Mode Power Supply CC V NECL Mode Power Supply EE V PECL Mode Input Voltage I NECL Mode Input Voltage I Output Current out T Operating Temperature Range A T Storage Temperature ...

  • Page 4

    Table 5. 10EP DC CHARACTERISTICS, PECL Symbol Characteristic I Negative Power Supply Current EE V Output HIGH Voltage (Note Output LOW Voltage (Note Input HIGH Voltage (Single−Ended Input LOW Voltage (Single−Ended) IL ...

  • Page 5

    Table 7. 100EP DC CHARACTERISTICS, PECL Symbol Characteristic I Negative Power Supply Current EE V Output HIGH Voltage (Note 13 Output LOW Voltage (Note 13 Input HIGH Voltage (Single−Ended Input LOW Voltage (Single−Ended) IL ...

  • Page 6

    Table 9. 100EP DC CHARACTERISTICS, NECL Symbol Characteristic I Negative Power Supply Current EE V Output HIGH Voltage (Note 19 Output LOW Voltage (Note 19 Input HIGH Voltage (Single−Ended Input LOW Voltage (Single−Ended) IL ...

  • Page 7

    900 800 700 600 500 400 300 200 É É É É É É É É É É É É É É É É É É 100 É É É É É É É É É É É É É ...

  • Page 8

    Driver Device Figure 4. Typical Termination for Output Driver and Device Evaluation (See Application Note AND8020/D − Termination of ECL Logic Devices.) Resource Reference of Application Notes AN1405/D ...

  • Page 9

    ... MC100EP11D MC100EP11DG MC100EP11DR2 MC100EP11DR2G MC100EP11DT MC100EP11DTG MC100EP11DGH MC100EP11DR2GH MC100EP11DTR2 MC100EP11DTR2G MC100EP11MNR4G †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. Package SOIC−8 SOIC−8 (Pb−Free) SOIC−8 SOIC− ...

  • Page 10

    ... G C SEATING PLANE −Z− 0.25 (0.010 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. PACKAGE DIMENSIONS SOIC−8 NB CASE 751−07 ISSUE 0.10 (0.004 SOLDERING FOOTPRINT* 1 ...

  • Page 11

    K 8x REF 0.10 (0.004) 0.15 (0.006 L −U− PIN 1 IDENT 0.15 (0.006 −V− C 0.10 (0.004) D −T− G SEATING PLANE PACKAGE DIMENSIONS TSSOP−8 ...

  • Page 12

    ... Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303− ...