MC100EP11DTG ON Semiconductor, MC100EP11DTG Datasheet

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MC100EP11DTG

Manufacturer Part Number
MC100EP11DTG
Description
IC BUFFER FANOUT DIFF 1:2 8TSSOP
Manufacturer
ON Semiconductor
Series
100EPr
Type
Fanout Buffer (Distribution)r
Datasheet

Specifications of MC100EP11DTG

Number Of Circuits
1
Ratio - Input:output
1:2
Differential - Input:output
Yes/Yes
Input
ECL, PECL
Output
ECL, PECL
Frequency - Max
3GHz
Voltage - Supply
3 V ~ 5.5 V
Operating Temperature
-40°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
8-TSSOP
Frequency-max
3GHz
Number Of Outputs
4
Max Input Freq
3000 MHz
Propagation Delay (max)
0.27 ns
Supply Voltage (max)
+/- 5.5 V
Supply Voltage (min)
+/- 3 V
Maximum Operating Temperature
+ 85 C
Minimum Operating Temperature
- 40 C
Mounting Style
SMD/SMT
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
MC100EP11DTGOS
MC10EP11, MC100EP11
3.3V / 5V ECL 1:2
Differential Fanout Buffer
Description
pin and functionally equivalent to the LVEL11 device. With AC
performance much faster than the LVEL11 device, the EP11 is ideal
for applications requiring the fastest AC performance available.
Features
© Semiconductor Components Industries, LLC, 2009
October, 2009 − Rev. 10
The MC10/100EP11 is a differential 1:2 fanout buffer. The device is
The 100 Series contains temperature compensation.
with V
with V
220 ps Typical Propagation Delay
Maximum Clock Frequency > 3 GHz Typical
PECL Mode Operating Range: V
NECL Mode Operating Range: V
Open Input Default State
Safety Clamp on Inputs
Q Outputs Will Default LOW with Inputs Open or at V
Pb−Free Packages are Available
EE
EE
= 0 V
= −3.0 V to −5.5 V
CC
CC
= 3.0 V to 5.5 V
= 0 V
EE
1
See detailed ordering and shipping information in the package
dimensions section on page 9 of this data sheet.
CASE 506AA
MN SUFFIX
CASE 948R
DT SUFFIX
CASE 751
H
K
5K
2Z
M
D SUFFIX
TSSOP−8
*For additional marking information, refer to
8
(Note: Microdot may be in either location)
SOIC−8
Application Note AND8002/D.
DFN8
8
= MC10
= MC100
= MC10
= MC100
= Date Code
1
ORDERING INFORMATION
1
http://onsemi.com
8
1
8
1
MARKING DIAGRAMS*
ALYWG
HP11
A
L
Y
W
G
Publication Order Number:
HEP11
ALYW
G
G
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
1
4
8
1
MC10EP11/D
8
1
KEP11
ALYW
ALYWG
KP11
G
G

Related parts for MC100EP11DTG

MC100EP11DTG Summary of contents

Page 1

MC10EP11, MC100EP11 3.3V / 5V ECL 1:2 Differential Fanout Buffer Description The MC10/100EP11 is a differential 1:2 fanout buffer. The device is pin and functionally equivalent to the LVEL11 device. With AC performance much faster than the LVEL11 device, the EP11 ...

Page 2

Figure 1. 8−Lead Pinout (Top View) and Logic Diagram Table 2. ATTRIBUTES Internal Input Pulldown Resistor Internal Input Pullup Resistor ESD Protection Moisture Sensitivity, Indefinite Time Out of Drypack (Note 1) Flammability ...

Page 3

Table 3. MAXIMUM RATINGS Symbol Parameter V PECL Mode Power Supply CC V NECL Mode Power Supply EE V PECL Mode Input Voltage I NECL Mode Input Voltage I Output Current out T Operating Temperature Range A T Storage Temperature ...

Page 4

Table 5. 10EP DC CHARACTERISTICS, PECL Symbol Characteristic I Negative Power Supply Current EE V Output HIGH Voltage (Note Output LOW Voltage (Note Input HIGH Voltage (Single−Ended Input LOW Voltage (Single−Ended) IL ...

Page 5

Table 7. 100EP DC CHARACTERISTICS, PECL Symbol Characteristic I Negative Power Supply Current EE V Output HIGH Voltage (Note 13 Output LOW Voltage (Note 13 Input HIGH Voltage (Single−Ended Input LOW Voltage (Single−Ended) IL ...

Page 6

Table 9. 100EP DC CHARACTERISTICS, NECL Symbol Characteristic I Negative Power Supply Current EE V Output HIGH Voltage (Note 19 Output LOW Voltage (Note 19 Input HIGH Voltage (Single−Ended Input LOW Voltage (Single−Ended) IL ...

Page 7

900 800 700 600 500 400 300 200 É É É É É É É É É É É É É É É É É É 100 É É É É É É É É É É É É É ...

Page 8

Driver Device Figure 4. Typical Termination for Output Driver and Device Evaluation (See Application Note AND8020/D − Termination of ECL Logic Devices.) Resource Reference of Application Notes AN1405/D ...

Page 9

... MC10EP11DTG MC10EP11DTR2 MC10EP11DTR2G MC10EP11MNR4 MC10EP11MNR4G MC100EP11D MC100EP11DG MC100EP11DR2 MC100EP11DR2G MC100EP11DT MC100EP11DTG MC100EP11DGH MC100EP11DR2GH MC100EP11DTR2 MC100EP11DTR2G MC100EP11MNR4G †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. Package SOIC−8 SOIC− ...

Page 10

... G C SEATING PLANE −Z− 0.25 (0.010 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. PACKAGE DIMENSIONS SOIC−8 NB CASE 751−07 ISSUE 0.10 (0.004 SOLDERING FOOTPRINT* 1 ...

Page 11

K 8x REF 0.10 (0.004) 0.15 (0.006 L −U− PIN 1 IDENT 0.15 (0.006 −V− C 0.10 (0.004) D −T− G SEATING PLANE PACKAGE DIMENSIONS TSSOP−8 ...

Page 12

... Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303− ...

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