PCK942CBD,157 NXP Semiconductors, PCK942CBD,157 Datasheet

PCK942CBD,157

Manufacturer Part Number

PCK942CBD,157

Description

IC CLCK DISTRIBUTION 1:18 32LQFP

Manufacturer

NXP Semiconductors

Type

Fanout Buffer (Distribution)r

Datasheet

1.PCK942CBD157.pdf (11 pages)

Specifications of PCK942CBD,157

Number Of Circuits

Ratio - Input:output

1:18

Differential - Input:output

No/No

Input

LVCMOS, LVTTL

Output

LVCMOS

Frequency - Max

250MHz

Voltage - Supply

2.375 V ~ 3.465 V

Operating Temperature

0°C ~ 70°C

Mounting Type

Surface Mount

Package / Case

32-LQFP

Frequency-max

250MHz

Lead Free Status / RoHS Status

Lead free / RoHS Compliant

Other names

568-3563
935281528157
PCK942CBD

Available stocks

Company

Part Number

Manufacturer

Quantity

Price

Company:

BOSTOCK HK LIMITED

Part Number:

PCK942CBD,157

Manufacturer:

NXP Semiconductors

Quantity:

10 000

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1. General description

2. Features

The PCK942C is a 1 : 18 low voltage clock distribution chip with 2.5 V or 3.3 V LVCMOS

output capabilities. The device is offered in two versions: the PCK942C has an LVCMOS

input clock, while the PCK942P has an LVPECL input clock. The 18 outputs are 2.5 V or

3.3 V LVCMOS compatible and feature the drive strength to drive 50

terminated transmission lines. With output-to-output skews of 200 ps, the PCK942C is

ideal as a clock distribution chip for the most demanding of synchronous systems. The

2.5 V outputs also make the device ideal for supplying clocks for a higher performance

Pentium II microprocessor based design.

With a low output impedance of approximately 12 , in both the HIGH and LOW logic

states, the output buffers of the PCK942C are ideal for driving series terminated

transmission lines. With an output impedance of 12

terminated transmission lines from each output. This capability gives the PCK942C an

effective fan-out of 1 : 36. The PCK942C provides enough copies of low skew clocks for

most high performance synchronous systems.

The LVCMOS/LVTTL input of the PCK942C provides a more standard LVCMOS interface.

The OE pin will place the outputs into a high-impedance state. The OE pin has an internal

pull-up resistor.

The PCK942C is a single supply device. The V

The 32-lead LQFP package was chosen to optimize performance, board space, and cost

of the device. The 32-lead LQFP package has a 7 mm

conservative 0.8 mm pin spacing.

PCK942C

Low voltage 1 : 18 clock distribution chip

Rev. 01 — 15 February 2006

LVCMOS/LVTTL clock input

2.5 V LVCMOS outputs for Pentium II microprocessor support

150 ps maximum targeted output-to-output skew

Maximum output frequency of 250 MHz @ 3.3 V V

32-lead LQFP packaging

Single 3.3 V or 2.5 V supply voltage

power pins require either 2.5 V or 3.3 V.

the PCK942C can drive two series

7 mm body size with a

Product data sheet

series or parallel

Related parts for PCK942CBD,157

PCK942CBD,157 Summary of contents

Page 1

PCK942C Low voltage clock distribution chip Rev. 01 — 15 February 2006 1. General description The PCK942C low voltage clock distribution chip with 2 3.3 V LVCMOS output capabilities. The ...

Philips Semiconductors 3. Ordering information Table 1: Type number PCK942CBD 4. Functional diagram Fig 1. Functional diagram of PCK942C 5. Pinning information 5.1 Pinning Fig 2. Pin conﬁguration for LQFP32 PCK942C_1 Product data sheet Ordering information Package Name Description LQFP32 ...

Page 3

Philips Semiconductors 5.2 Pin description Table 2: Symbol LVCMOS_CLK Q17 n.c. GND Functional description Refer to 6.1 Function table Table Limiting values Table 4: In accordance with the Absolute ...

Page 4

Philips Semiconductors 8. Static characteristics Table + amb Symbol CC(max) Table ...

Page 5

Philips Semiconductors 9. Dynamic characteristics Table amb Symbol f oper(max) t PLH t sk(o) t sk(pr [1] Tested using standard input levels, production tested @ 133 ...

Page 6

Philips Semiconductors 10. Package outline LQFP32: plastic low profile quad flat package; 32 leads; body 1 pin 1 index DIMENSIONS (mm are the original dimensions) ...

Page 7

Philips Semiconductors 11. Soldering 11.1 Introduction to soldering surface mount packages This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our Data Handbook IC26; Integrated Circuit Packages ...

Page 8

Philips Semiconductors – smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end. • For packages with leads on four sides, ...

Page 9

Philips Semiconductors [4] These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side, ...

Page 10

Philips Semiconductors 14. Data sheet status [1] Level Data sheet status Product status I Objective data Development II Preliminary data Qualiﬁcation III Product data Production [1] Please consult the most recently issued data sheet before initiating or completing a design. ...

Page 11

Philips Semiconductors 19. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . ...

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