PCK946BD,157 NXP Semiconductors, PCK946BD,157 Datasheet

PCK946BD,157

Manufacturer Part Number

PCK946BD,157

Description

IC CLOCK DRIVER 1:10 32-LQFP

Manufacturer

NXP Semiconductors

Type

Fanout Buffer (Distribution), Divider, Multiplexerr

Datasheet

1.PCK946BD157.pdf (13 pages)

Specifications of PCK946BD,157

Number Of Circuits

Ratio - Input:output

2:10

Differential - Input:output

No/No

Input

LVCMOS, LVTTL

Output

CMOS

Frequency - Max

150MHz

Voltage - Supply

3 V ~ 3.6 V

Operating Temperature

0°C ~ 70°C

Mounting Type

Surface Mount

Package / Case

32-LQFP

Frequency-max

150MHz

Lead Free Status / RoHS Status

Lead free / RoHS Compliant

Other names

568-3567
935281249157
PCK946BD

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Quantity

Price

Company:

BOSTOCK HK LIMITED

Part Number:

PCK946BD,157

Manufacturer:

NXP Semiconductors

Quantity:

10 000

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1. General description

2. Features

The PCK946 is a low voltage CMOS 1 : 10 clock buffer. The 10 outputs can be conﬁgured

into a standard fan-out buffer or into 1 and

designed and optimized to drive 50

With output-to-output skews of 350 ps, the PCK946 is ideal as a clock distribution chip for

synchronous systems which need a tight level of skew from a large number of outputs.

With an output impedance of approximately 7 , in both the HIGH and LOW logic states,

the output buffers of the PCK946 are ideal for driving series terminated transmission lines.

More speciﬁcally, each of the 10 PCK946 outputs can drive two series terminated

transmission lines. With this capability, the PCK946 has an effective fan-out of 1 : 20 in

applications using point-to-point distribution schemes.

The PCK946 has the capability of generating 1 and

design is fully static; the signals are generated and re-timed inside the chip to ensure

minimal skew between the 1 and

the user to select the ratio of 1 outputs to

Two independent LVCMOS/LVTTL compatible clock inputs are available. Designers can

take advantage of this feature to provide redundant clock sources or the addition of a test

clock into the system design. With the TCLK_SEL input pulled HIGH, the TCLK1 input is

selected.

All of the control inputs are LVCMOS/LVTTL compatible. The DSELn pins choose

between 1 and

MR/OE input will reset the internal ﬂip-ﬂops and 3-state the outputs when it is forced

HIGH.

The PCK946 is fully 3.3 V compatible. The 32-lead LQFP package was chosen to

optimize performance, board space, and cost of the device. The 32-lead LQFP package

has a 7 mm

PCK946

Low voltage 1 : 10 CMOS clock driver

Rev. 01 — 13 December 2005

2 selectable LVCMOS/LVTTL clock inputs

350 ps output-to-output skew

Drives up to 20 series terminated independent clock lines

Maximum input/output frequency of 150 MHz

3-stateable outputs

32-lead LQFP packaging

3.3 V V

supply voltage

7 mm body size with a conservative 0.8 mm pin spacing.

outputs. A LOW on the DSELn pins will select the 1 output. The

series or parallel terminated transmission lines.

signals. The device features selectability to allow

outputs.

combinations. The ten outputs were

signals from a 1 source. The

Product data sheet

Related parts for PCK946BD,157

PCK946BD,157 Summary of contents

Page 1

PCK946 Low voltage CMOS clock driver Rev. 01 — 13 December 2005 1. General description The PCK946 is a low voltage CMOS clock buffer. The 10 outputs can be conﬁgured into a standard fan-out ...

Philips Semiconductors 3. Ordering information Table 1: Type number PCK946BD 4. Functional diagram Fig 1. Functional diagram of PCK946 9397 750 12296 Product data sheet Ordering information Package Name Description LQFP32 plastic low proﬁle quad ﬂat package; 32 leads; body ...

Page 3

Philips Semiconductors 5. Pinning information 5.1 Pinning Fig 2. Pin conﬁguration for LQFP32 5.2 Pin description Table 2: Symbol DSELA, DSELB, DSELC GND GNDI MR/OE QA0, QA1, QA2 QB0, QB1, QB2 QC0, QC1, QC2, QC3 TCLK_SEL TCLK0, TCLK1 V CC ...

Page 4

Philips Semiconductors 6. Functional description 6.1 Function table Table 3: TCLK_SEL 0 1 Table 4: DSELn 0 1 Table 5: MR/ Limiting values Table 6: In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol V ...

Page 5

Philips Semiconductors 8. Static characteristics Table 7: Static characteristics + 3.3 V amb CC Symbol Parameter V HIGH-state input voltage IH V LOW-state input voltage IL V HIGH-state output voltage OH V ...

Page 6

Philips Semiconductors 10. Application information 10.1 Driving transmission lines The PCK946 clock driver was designed to drive high speed signals in a terminated transmission line environment. To provide the optimum ﬂexibility to the user the output drivers were designed to ...

Page 7

Philips Semiconductors At the load end the voltage will double, due to the near unity reﬂection coefﬁcient will then increment towards the quiescent 3 steps separated by one round trip delay (in this case ...

Page 8

Philips Semiconductors 11. Package outline LQFP32: plastic low profile quad flat package; 32 leads; body 1 pin 1 index DIMENSIONS (mm are the original dimensions) ...

Page 9

Philips Semiconductors 12. Soldering 12.1 Introduction to soldering surface mount packages This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our Data Handbook IC26; Integrated Circuit Packages ...

Page 10

Philips Semiconductors – smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end. • For packages with leads on four sides, ...

Page 11

Philips Semiconductors [4] These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side, ...

Page 12

Philips Semiconductors 15. Data sheet status [1] Level Data sheet status Product status I Objective data Development II Preliminary data Qualiﬁcation III Product data Production [1] Please consult the most recently issued data sheet before initiating or completing a design. ...

Page 13

Philips Semiconductors 20. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . ...

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