PCK9446BD,151 NXP Semiconductors, PCK9446BD,151 Datasheet

PCK9446BD,151

Manufacturer Part Number

PCK9446BD,151

Description

IC FANOUT BUFFER LVCMOS 32LQFP

Manufacturer

NXP Semiconductors

Type

Fanout Buffer (Distribution), Divider, Multiplexerr

Datasheet

1.PCK9446BD151.pdf (17 pages)

Specifications of PCK9446BD,151

Number Of Circuits

Ratio - Input:output

2:10

Differential - Input:output

No/No

Input

LVCMOS

Output

LVCMOS

Frequency - Max

250MHz

Voltage - Supply

2.375 V ~ 3.465 V

Operating Temperature

-40°C ~ 85°C

Mounting Type

Surface Mount

Package / Case

32-LQFP

Frequency-max

250MHz

Lead Free Status / RoHS Status

Lead free / RoHS Compliant

Other names

568-3643-5
935280839151
PCK9446BD-S

Available stocks

Company

Part Number

Manufacturer

Quantity

Price

Company:

BOSTOCK HK LIMITED

Part Number:

PCK9446BD,151

Manufacturer:

NXP Semiconductors

Quantity:

10 000

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1. General description

2. Features

The PCK9446 is a 2.5 V and 3.3 V compatible 1 : 10 clock distribution buffer designed for

low-voltage mid-range to high-performance telecom, networking and computing

applications. Both 3.3 V, 2.5 V and dual supply voltages are supported for mixed-voltage

applications. The PCK9446 offers 10 low skew outputs and 2 selectable inputs for clock

redundancy. The outputs are conﬁgurable and support 1 : 1 and 1 : 2 output to input

frequency ratios. The PCK9446 is speciﬁed for the extended temperature range of

The PCK9446 is a full static design supporting clock frequencies up to 250 MHz. The

signals are generated and retimed on-chip to ensure minimal skew between the three

output banks. Two independent LVCMOS compatible clock inputs are available. This

feature supports redundant clock sources or the addition of a test clock into the system

design. Each of the three output banks can be individually supplied by 2.5 V or 3.3 V

supporting mixed voltage applications. The FSELx pins choose between division of the

input reference frequency by one or two. The frequency divider can be set individually for

each of the three output banks. The PCK9446 can be reset and the outputs are disabled

by deasserting the MR/OE pin (logic HIGH state). Asserting OE will enable the outputs.

All inputs accept LVCMOS signals while the outputs provide LVCMOS compatible levels

with the capability to drive terminated 50

PCK9456 speciﬁcation for a 1 : 10 mixed voltage buffer with LVPECL compatible inputs.

For series terminated transmission lines, each of the PCK9446 outputs can drive one or

two traces giving the devices an effective fan-out of 1 : 20. The device is packaged in a

32-lead LQFP package which has a 7 mm

pin spacing.

40 C to +85 C.

PCK9446

2.5 V and 3.3 V LVCMOS clock fan-out buffer

Rev. 01 — 10 April 2006

Conﬁgurable 10 outputs LVCMOS clock distribution buffer

Compatible to single, dual and mixed 3.3 V/2.5 V voltage supply

Wide range output clock frequency up to 250 MHz

Designed for mid-range to high-performance telecom, networking and computer

applications

Supports applications requiring clock redundancy

Maximum output skew of 200 ps (100 ps within one bank)

Selectable output conﬁgurations per output bank

3-stateable outputs

32-lead LQFP packaging

Ambient operating temperature range of 40 C to +85 C

transmission lines. Please refer to the

7 mm body size with a conservative 0.8 mm

Product data sheet

Related parts for PCK9446BD,151

PCK9446BD,151 Summary of contents

Page 1

PCK9446 2.5 V and 3.3 V LVCMOS clock fan-out buffer Rev. 01 — 10 April 2006 1. General description The PCK9446 is a 2.5 V and 3.3 V compatible clock distribution buffer designed for low-voltage mid-range to ...

Page 2

Philips Semiconductors 3. Ordering information Table 1. Type number PCK9446BD 4. Functional diagram Fig 1. Logic diagram of PCK9446 PCK9446_1 Product data sheet Ordering information Package Name Description LQFP32 plastic low proﬁle quad ﬂat package; 32 leads; body 7 7 ...

Page 3

Philips Semiconductors 5. Pinning information 5.1 Pinning Fig 2. Pin conﬁguration for LQFP32 5.2 Pin description Table 2. Symbol CLK_SEL CLK0, CLK1 FSELA, FSELB, FSELC MR/OE GND VCCA [1] VCCB VCCC V CC QA[0:2] QB[0:2] QC[0:3] [1] VCCB is internally ...

Page 4

Philips Semiconductors 6. Functional description Refer to 6.1 Function table Table 3. Control CLK_SEL 0 FSELA FSELB FSELC MR/OE 6.2 Supply conﬁgurations Table 4. Supply voltage conﬁguration 3.3 V mixed voltage supply 2 threshold and levels. ...

Page 5

Philips Semiconductors 7. Limiting values Table 5. In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol stg 8. Recommended operating conditions Table 6. Symbol ...

Page 6

Philips Semiconductors 9. Static characteristics Table 7. Static characteristics (3 + amb CC Symbol Parameter V HIGH-level input voltage IH V LOW-level input voltage IL V HIGH-level output voltage OH ...

Page 7

Philips Semiconductors 10. Dynamic characteristics Table 9. Dynamic characteristics (3 + amb CC Symbol Parameter f reference frequency ref f maximum output frequency o(max) reference duty cycle ref t LOW-to-HIGH ...

Page 8

Philips Semiconductors Table 10. Dynamic characteristics (2 + amb CC Symbol Parameter f reference frequency ref f maximum output frequency o(max) reference duty cycle ref t LOW-to-HIGH propagation delay PLH ...

Page 9

Philips Semiconductors 11. Application information 11.1 Driving transmission lines The PCK9446 clock driver was designed to drive high speed signals in a terminated transmission line environment. To provide the optimum ﬂexibility to the user the output drivers were designed to ...

Page 10

Philips Semiconductors The waveform plots of versus two lines. In both cases the drive capability of the PCK9446 output buffer is more than sufﬁcient to drive 50 measurements in the simulations a delta of only 43 ps exists between the ...

Page 11

Philips Semiconductors Fig 5. Optimized dual line termination 12. Test information GENERATOR Fig 6. CLK0, CLK1 PCK9446 AC test reference for (1) 2.4 V when V = 3.3 V; 1.8 V when V CC (2) ...

Page 12

Philips Semiconductors 13. Package outline LQFP32: plastic low profile quad flat package; 32 leads; body 1 pin 1 index DIMENSIONS (mm are the original dimensions) ...

Page 13

Philips Semiconductors 14. Soldering 14.1 Introduction to soldering surface mount packages This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our Data Handbook IC26; Integrated Circuit Packages ...

Page 14

Philips Semiconductors – smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end. • For packages with leads on four sides, ...

Page 15

Philips Semiconductors [4] These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side, ...

Page 16

Philips Semiconductors 17. Legal information 17.1 Data sheet status [1][2] Document status Product status Objective [short] data sheet Development Preliminary [short] data sheet Qualiﬁcation Product [short] data sheet Production [1] Please consult the most recently issued document before initiating or ...

Page 17

Philips Semiconductors 19. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . ...

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