PCK942PBD,128 NXP Semiconductors, PCK942PBD,128 Datasheet

PCK942PBD,128

Manufacturer Part Number

PCK942PBD,128

Description

IC CLOCK DIST CHIP 1:18 32LQFP

Manufacturer

NXP Semiconductors

Type

Fanout Buffer (Distribution)r

Datasheet

1.PCK942PBD157.pdf (11 pages)

Specifications of PCK942PBD,128

Number Of Circuits

Ratio - Input:output

1:18

Differential - Input:output

Yes/No

Input

LVPECL

Output

LVCMOS

Frequency - Max

250MHz

Voltage - Supply

2.375 V ~ 3.465 V

Operating Temperature

0°C ~ 70°C

Mounting Type

Surface Mount

Package / Case

32-LQFP

Frequency-max

250MHz

Lead Free Status / RoHS Status

Lead free / RoHS Compliant

Other names

935281251128
PCK942PBD-F
PCK942PBD-F

Available stocks

Company

Part Number

Manufacturer

Quantity

Price

Company:

BOSTOCK HK LIMITED

Part Number:

PCK942PBD,128

Manufacturer:

NXP Semiconductors

Quantity:

10 000

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1. General description

2. Features

The PCK942P is a 1 : 18 low voltage clock distribution chip with 2.5 V or 3.3 V LVCMOS

output capabilities. The device is offered in two versions: the PCK942C has an LVCMOS

input clock, while the PCK942P has a LVPECL input clock. The 18 outputs are 2.5 V or

3.3 V LVCMOS compatible and feature the drive strength to drive 50

transmission lines. With output-to-output skews of 200 ps, the PCK942P is ideal as a

clock distribution chip for the most demanding of synchronous systems. The 2.5 V output

also makes the device ideal for supplying clocks for a higher performance Pentium II

microprocessor-based design.

With a low output impedance of approximately 12 , in both the HIGH and LOW logic

states, the output buffers of the PCK942P are ideal for driving series-terminated

transmission lines. With an output impedance of 12 , the PCK942P can drive two

series-terminated transmission lines from each output. This capability gives the PCK942P

an effective fan-out of 1 : 36. The PCK942P provides enough copies of low skew clocks

for most high performance synchronous systems.

The differential LVPECL inputs of the PCK942P allow the device to interface directly with a

LVPECL fan-out buffer like the MC100EP111 to build very wide clock fan-out trees or to

couple to a high frequency clock source. The OE pin will place the outputs to a

high-impedance state. The OE pin has an internal pull-up resistor.

The PCK942P is a single supply device. The V

The 32-lead LQFP package was chosen to optimize performance, board space, and cost

of the device. The 32-lead LQFP package has a 7 mm

conservative 0.8 mm pin spacing.

PCK942P

Low voltage 1 : 18 clock distribution chip

Rev. 01 — 17 February 2006

LVPECL clock input

2.5 V LVCMOS outputs for Pentium II microprocessor support

200 ps maximum targeted output-to-output skew

Maximum output frequency of 250 MHz at 3.3 V V

32-lead LQFP packaging

Single 3.3 V or 2.5 V supply voltage

power pins require either 2.5 V or 3.3 V.

7 mm body size with a

Product data sheet

series-terminated

Related parts for PCK942PBD,128

PCK942PBD,128 Summary of contents

Page 1

PCK942P Low voltage clock distribution chip Rev. 01 — 17 February 2006 1. General description The PCK942P low voltage clock distribution chip with 2 3.3 V LVCMOS output capabilities. The ...

Philips Semiconductors 3. Ordering information Table 1: Type number PCK942PBD 4. Functional diagram Fig 1. Functional diagram of PCK942P 5. Pinning information 5.1 Pinning Fig 2. Pin conﬁguration for LQFP32 9397 750 12261 Product data sheet Ordering information Package Name ...

Page 3

Philips Semiconductors 5.2 Pin description Table 2: Symbol GND OE n.c. PECL_CLK, PECL_CLK Q[0:17 Functional description 6.1 Function table Table Limiting values Table 4: In accordance with the Absolute Maximum Rating System ...

Page 4

Philips Semiconductors 8. Static characteristics Table 5: Static characteristics 2.5 V amb CC Symbol Parameter V HIGH-state input voltage IH V LOW-state input voltage IL V peak-to-peak input voltage i(p-p) V ...

Page 5

Philips Semiconductors 9. Dynamic characteristics Table 7: Dynamic characteristics 2.5 V amb CC Symbol Parameter f maximum operating frequency oper(max) t LOW-to-HIGH propagation delay PLH t HIGH-to-LOW propagation delay PHL t ...

Page 6

Philips Semiconductors 10. Package outline LQFP32: plastic low profile quad flat package; 32 leads; body 1 pin 1 index DIMENSIONS (mm are the original dimensions) ...

Page 7

Philips Semiconductors 11. Soldering 11.1 Introduction to soldering surface mount packages This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our Data Handbook IC26; Integrated Circuit Packages ...

Page 8

Philips Semiconductors – smaller than 1.27 mm, the footprint longitudinal axis must be parallel to the transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end. • For packages with leads on four sides, ...

Page 9

Philips Semiconductors [4] These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink on the top side, ...

Page 10

Philips Semiconductors 14. Data sheet status [1] Level Data sheet status Product status I Objective data Development II Preliminary data Qualiﬁcation III Product data Production [1] Please consult the most recently issued data sheet before initiating or completing a design. ...

Page 11

Philips Semiconductors 19. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . ...

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