IC BUFFER FANOUT ECL 1:2 8SOIC

MC100EL11DG

Manufacturer Part NumberMC100EL11DG
DescriptionIC BUFFER FANOUT ECL 1:2 8SOIC
ManufacturerON Semiconductor
Series100EL
TypeFanout Buffer (Distribution)
MC100EL11DG datasheet
 


Specifications of MC100EL11DG

Number Of Circuits1Ratio - Input:output1:2
Differential - Input:outputYes/YesInputECL, PECL
OutputECL, PECLFrequency - Max1.5GHz
Voltage - Supply4.2 V ~ 5.7 VOperating Temperature-40°C ~ 85°C
Mounting TypeSurface MountPackage / Case8-SOIC (3.9mm Width)
Frequency-max1.5GHzNumber Of Outputs4
Max Input Freq1500 MHz (Typ)Propagation Delay (max)0.34 ns @ 5V
Supply Voltage (max)- 5.7 V or 5.7 VSupply Voltage (min)- 4.2 V or 4.2 V
Maximum Operating Temperature+ 85 CMinimum Operating Temperature- 40 C
Mounting StyleSMD/SMTLead Free Status / RoHS StatusLead free / RoHS Compliant
Other namesMC100EL11DGOS  
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MC10EL11, MC100EL11
5.0 V ECL 1:2 Differential
Fanout Buffer
The MC10EL/100EL11 is a differential 1:2 fanout buffer. The device
is functionally similar to the E111 device but with higher performance
capabilities. The within-device skew and propagation delay is
significantly improved over the E111.
The differential inputs of the EL11 employ clamping circuitry to
maintain stability under open input conditions. If the inputs are left open
(pulled to V
) the Q outputs will go LOW.
EE
The 100 Series contains temperature compensation.
Features
265 ps Propagation Delay
5 ps Skew Between Outputs
PECL Mode Operating Range: V
CC
NECL Mode Operating Range: V
CC
Internal Input Pulldown Resistors
Pb−Free Packages are Available
Q
1
0
Q
2
0
Q
3
1
Q
4
1
Figure 1. Logic Diagram and Pinout Assignment
Table 1. PIN DESCRIPTION
PIN
FUNCTION
D, D
ECL Data Inputs
Q0, Q0; Q1, Q1
ECL Data Outputs
V
Positive Supply
CC
V
Negative Supply
EE
EP
(DFN8 only) Thermal exposed pad must be
connected to a sufficient thermal conduit.
Electrically connect to the most negative
supply (GND) or leave unconnected,
floating open.
© Semiconductor Components Industries, LLC, 2008
August, 2008− Rev. 10
= 4.2 V to 5.7 with V
= 0 V
EE
= 0 V with V
= −4.2 V to −5.7 V
EE
8
V
CC
7
D
6
D
5
V
EE
1
http://onsemi.com
MARKING
DIAGRAMS*
8
8
8
HEL11
KEL11
1
ALYW
ALYW
G
SOIC−8
1
1
D SUFFIX
CASE 751
8
8
8
HL11
KL11
1
ALYWG
ALYWG
G
TSSOP−8
1
1
DT SUFFIX
CASE 948R
1
4
1
DFN8
MN SUFFIX
CASE 506AA
H = MC10
L = Wafer Lot
K = MC100
Y = Year
4Q = MC10
W = Work Week
2E = MC100
M = Date Code
A = Assembly Location
G = Pb−Free Package
(Note: Microdot may be in either location)
*For additional marking information, refer to
Application Note AND8002/D.
ORDERING INFORMATION
See detailed ordering and shipping information in the package
dimensions section on page 6 of this data sheet.
Publication Order Number:
MC10EL11/D
G
G
4

MC100EL11DG Summary of contents

  • Page 1

    MC10EL11, MC100EL11 5.0 V ECL 1:2 Differential Fanout Buffer The MC10EL/100EL11 is a differential 1:2 fanout buffer. The device is functionally similar to the E111 device but with higher performance capabilities. The within-device skew and propagation delay is significantly improved over ...

  • Page 2

    Table 2. ATTRIBUTES Internal Input Pulldown Resistor Internal Input Pullup Resistor ESD Protection Moisture Sensitivity, Indefinite Time Out of Drypack (Note 1) Flammability Rating Transistor Count Meets or Exceeds JEDEC Spec EIA/JESD78 IC Latchup Test 1. For additional information, see ...

  • Page 3

    Table 4. 10EL SERIES PECL DC CHARACTERISTICS Symbol Characteristic I Power Supply Current EE V Output HIGH Voltage (Note Output LOW Voltage (Note Input HIGH Voltage (Single−Ended Input LOW Voltage (Single−Ended) IL ...

  • Page 4

    Table 6. 100EL SERIES PECL DC CHARACTERISTICS Symbol Characteristic I Power Supply Current EE V Output HIGH Voltage (Note 10 Output LOW Voltage (Note 10 Input HIGH Voltage (Single−Ended Input LOW Voltage (Single−Ended) IL ...

  • Page 5

    Table 8. AC CHARACTERISTICS V CC Symbol Characteristic f Maximum Toggle Frequency max t Propagation Delay to Output PLH t PHL t Within-Device Skew (Note 16) SKEW Duty Cycle Skew (Note 17) t Random Clock Jitter (RMS) JITTER V Input ...

  • Page 6

    ... MC10EL11DG MC10EL11DR2 MC10EL11DR2G MC10EL11DT MC10EL11DTG MC10EL11DTR2 MC10EL11DTR2G MC10EL11MNR4 MC10EL11MNR4G MC100EL11D MC100EL11DG MC100EL11DR2 MC100EL11DR2G MC100EL11DT MC100EL11DTG MC100EL11DTR2 MC100EL11DTR2G MC100EL11MNR4 MC100EL11MNR4G †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. ...

  • Page 7

    ... G C SEATING PLANE −Z− 0.25 (0.010 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. PACKAGE DIMENSIONS SOIC−8 NB CASE 751−07 ISSUE 0.10 (0.004 SOLDERING FOOTPRINT* 1 ...

  • Page 8

    K 8x REF 0.10 (0.004) 0.15 (0.006 L −U− PIN 1 IDENT 0.15 (0.006 −V− C 0.10 (0.004) D −T− G SEATING PLANE PACKAGE DIMENSIONS TSSOP−8 ...

  • Page 9

    ... Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303− ...