MC100EL11DG ON Semiconductor, MC100EL11DG Datasheet

MC100EL11DG

Manufacturer Part Number

MC100EL11DG

Description

IC BUFFER FANOUT ECL 1:2 8SOIC

Manufacturer

ON Semiconductor

Series

100ELr

Type

Fanout Buffer (Distribution)r

Datasheet

1.MC100EL11DTR2G.pdf (9 pages)

Specifications of MC100EL11DG

Number Of Circuits

Ratio - Input:output

1:2

Differential - Input:output

Yes/Yes

Input

ECL, PECL

Output

ECL, PECL

Frequency - Max

1.5GHz

Voltage - Supply

4.2 V ~ 5.7 V

Operating Temperature

-40°C ~ 85°C

Mounting Type

Surface Mount

Package / Case

8-SOIC (3.9mm Width)

Frequency-max

1.5GHz

Number Of Outputs

Max Input Freq

1500 MHz (Typ)

Propagation Delay (max)

0.34 ns @ 5V

Supply Voltage (max)

- 5.7 V or 5.7 V

Supply Voltage (min)

- 4.2 V or 4.2 V

Maximum Operating Temperature

+ 85 C

Minimum Operating Temperature

- 40 C

Mounting Style

SMD/SMT

Lead Free Status / RoHS Status

Lead free / RoHS Compliant

Other names

MC100EL11DGOS

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MC10EL11, MC100EL11

5.0 V ECL 1:2 Differential

Fanout Buffer

is functionally similar to the E111 device but with higher performance

capabilities. The within-device skew and propagation delay is

significantly improved over the E111.

maintain stability under open input conditions. If the inputs are left open

(pulled to V

Features

•

August, 2008− Rev. 10

Figure 1. Logic Diagram and Pinout Assignment

The MC10EL/100EL11 is a differential 1:2 fanout buffer. The device

The differential inputs of the EL11 employ clamping circuitry to

The 100 Series contains temperature compensation.

NECL Mode Operating Range: V

265 ps Propagation Delay

5 ps Skew Between Outputs

PECL Mode Operating Range: V

Internal Input Pulldown Resistors

Pb−Free Packages are Available

Table 1. PIN DESCRIPTION

D, D

Q0, Q0; Q1, Q1

) the Q outputs will go LOW.

FUNCTION

ECL Data Inputs

ECL Data Outputs

Positive Supply

Negative Supply

(DFN8 only) Thermal exposed pad must be

connected to a sufficient thermal conduit.

Electrically connect to the most negative

supply (GND) or leave unconnected,

floating open.

= 0 V with V

= 4.2 V to 5.7 with V

= −4.2 V to −5.7 V

= 0 V

See detailed ordering and shipping information in the package

dimensions section on page 6 of this data sheet.

CASE 506AA

H = MC10

K = MC100

4Q = MC10

2E = MC100

A = Assembly Location

CASE 948R

MN SUFFIX

DT SUFFIX

CASE 751

D SUFFIX

TSSOP−8

*For additional marking information, refer to

SOIC−8

Application Note AND8002/D.

DFN8

(Note: Microdot may be in either location)

ORDERING INFORMATION

http://onsemi.com

HEL11

ALYW

ALYWG

HL11

Publication Order Number:

DIAGRAMS*

L = Wafer Lot

Y = Year

W = Work Week

M = Date Code

G = Pb−Free Package

MARKING

MC10EL11/D

ALYWG

KEL11

ALYW

KL11

Related parts for MC100EL11DG

MC100EL11DG Summary of contents

Page 1

MC10EL11, MC100EL11 5.0 V ECL 1:2 Differential Fanout Buffer The MC10EL/100EL11 is a differential 1:2 fanout buffer. The device is functionally similar to the E111 device but with higher performance capabilities. The within-device skew and propagation delay is significantly improved over ...

Page 2

Table 2. ATTRIBUTES Internal Input Pulldown Resistor Internal Input Pullup Resistor ESD Protection Moisture Sensitivity, Indefinite Time Out of Drypack (Note 1) Flammability Rating Transistor Count Meets or Exceeds JEDEC Spec EIA/JESD78 IC Latchup Test 1. For additional information, see ...

Page 3

Table 4. 10EL SERIES PECL DC CHARACTERISTICS Symbol Characteristic I Power Supply Current EE V Output HIGH Voltage (Note Output LOW Voltage (Note Input HIGH Voltage (Single−Ended Input LOW Voltage (Single−Ended) IL ...

Page 4

Table 6. 100EL SERIES PECL DC CHARACTERISTICS Symbol Characteristic I Power Supply Current EE V Output HIGH Voltage (Note 10 Output LOW Voltage (Note 10 Input HIGH Voltage (Single−Ended Input LOW Voltage (Single−Ended) IL ...

Page 5

Table 8. AC CHARACTERISTICS V CC Symbol Characteristic f Maximum Toggle Frequency max t Propagation Delay to Output PLH t PHL t Within-Device Skew (Note 16) SKEW Duty Cycle Skew (Note 17) t Random Clock Jitter (RMS) JITTER V Input ...

Page 6

... MC10EL11DG MC10EL11DR2 MC10EL11DR2G MC10EL11DT MC10EL11DTG MC10EL11DTR2 MC10EL11DTR2G MC10EL11MNR4 MC10EL11MNR4G MC100EL11D MC100EL11DG MC100EL11DR2 MC100EL11DR2G MC100EL11DT MC100EL11DTG MC100EL11DTR2 MC100EL11DTR2G MC100EL11MNR4 MC100EL11MNR4G †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. ...

Page 7

... G C SEATING PLANE −Z− 0.25 (0.010 *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. PACKAGE DIMENSIONS SOIC−8 NB CASE 751−07 ISSUE 0.10 (0.004 SOLDERING FOOTPRINT* 1 ...

Page 8

K 8x REF 0.10 (0.004) 0.15 (0.006 L −U− PIN 1 IDENT 0.15 (0.006 −V− C 0.10 (0.004) D −T− G SEATING PLANE PACKAGE DIMENSIONS TSSOP−8 ...

Page 9

... Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303− ...

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