ADF4213BCP | |
|---|---|
| Manufacturer Part Number | ADF4213BCP |
| Description | IC PLL FREQ SYNTHESIZER 20-LFCSP |
| Manufacturer | Analog Devices Inc |
| Type | Clock/Frequency Synthesizer (RF/IF) |
| ADF4213BCP datasheets |
|
Availability: In stock
International delivery:
Warranty: 60 days
×
- We provide standard 60-days warranty for all parts. If warranty differs we always mention it beforehand. In case of return we cover shipping costs.
- If you still have any questions - please contact us
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Specifications of ADF4213BCP | |||
|---|---|---|---|
| Rohs Status | RoHS non-compliant | Pll | Yes |
| Input | CMOS | Output | Clock |
| Number Of Circuits | 1 | Ratio - Input:output | 3:1 |
| Differential - Input:output | Yes/No | Frequency - Max | 3GHz |
| Divider/multiplier | No/No | Voltage - Supply | 2.7 V ~ 5.5 V |
| Operating Temperature | -40°C ~ 85°C | Mounting Type | Surface Mount |
| Package / Case | 20-LFCSP | Frequency-max | 3GHz |
PrevNext
ADF4210/ADF4211/ADF4212/ADF4213
TIMING CHARACTERISTICS
Limit at
T
to T
MIN
MAX
Parameter
(B Version)
t
10
1
t
10
2
t
25
3
t
25
4
t
10
5
t
20
6
NOTES
Guaranteed by design but not production tested.
Specifications subject to change without notice.
CLOCK
DB20
DATA
(MSB)
LE
LE
1, 2
ABSOLUTE MAXIMUM RATINGS
(T
= 25°C unless otherwise noted)
A
3
V
1 to GND
. . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V
DD
V
1 to V
2 . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +0.3 V
DD
DD
V
1, V
2 to GND . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V
P
P
V
1, V
2 to V
1 . . . . . . . . . . . . . . . . . . . . –0.3 V to +5.5 V
P
P
DD
Digital I/O Voltage to GND . . . . . . –0.3 V to DV
Analog I/O Voltage to GND . . . . . . . . . –0.3 V to V
REF
, RF
A, RF
B,
IN
IN
IN
IF
A, IF
B to GND . . . . . . . . . . . . –0.3 V to VDD + 0.3 V
IN
IN
Operating Temperature Range
Industrial (B Version) . . . . . . . . . . . . . . . . –40°C to +85°C
Storage Temperature Range . . . . . . . . . . . . –65°C to +150°C
Maximum Junction Temperature . . . . . . . . . . . . . . . . 150°C
TSSOP θ
Thermal Impedance . . . . . . . . . . . . . 150.4°C/W
JA
CSP θ
(Paddle Soldered) . . . . . . . . . . . . . . . . . . . 122°C/W
JA
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection. Although
the ADF4210/ADF4211/ADF4212/ADF4213 features proprietary ESD protection circuitry, per-
manent damage may occur on devices subjected to high-energy electrostatic discharges. Therefore,
proper ESD precautions are recommended to avoid performance degradation or loss of functionality.
Model
Temperature Range
ADF4210BRU
–40°C to +85°C
ADF4210BCP
–40°C to +85°C
ADF4211BRU
–40°C to +85°C
ADF4211BCP
–40°C to +85°C
ADF4212BRU
–40°C to +85°C
ADF4212BCP
–40°C to +85°C
ADF4213BRU
–40°C to +85°C
ADF4213BCP
–40°C to +85°C
Contact the factory for chip availability.
(V
1 = V
2 = 3 V
10%, 5 V
10%; V
DD
DD
= AGND
= DGND
= 0 V; T
= T
to T
IF
IF
A
MIN
Unit
Test Conditions/Comments
ns min
DATA to CLOCK Set-Up Time
ns min
DATA to CLOCK Hold Time
ns min
CLOCK High Duration
ns min
CLOCK Low Duration
ns min
CLOCK to LE Set-Up Time
ns min
LE Pulsewidth
t
t
3
4
t
t
1
2
DB19
DB2
(CONTROL BIT C2)
CSP θ
(Paddle Not Soldered) . . . . . . . . . . . . . . . . 216°C/W
JA
Lead Temperature, Soldering
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . . 215°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 220°C
NOTES
+ 0.3 V
1
Stresses above those listed under Absolute Maximum Ratings may cause perma-
DD
+ 0.3 V
nent damage to the device. This is a stress rating only; functional operation of the
P
device at these or any other conditions above those listed in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
2
This device is a high-performance RF integrated circuit with an ESD rating of
< 2 kV and it is ESD sensitive. Proper precautions should be taken for handling
and assembly.
3
GND = AGND = DGND = 0 V.
TRANSISTOR COUNT
11749 (CMOS) and 522 (Bipolar).
ORDERING GUIDE
Package Description
Thin Shrink Small Outline Package (TSSOP)
Chip Scale Package
Thin Shrink Small Outline Package (TSSOP)
Chip Scale Package
Thin Shrink Small Outline Package (TSSOP)
Chip Scale Package
Thin Shrink Small Outline Package (TSSOP)
Chip Scale Package
2 ≤ V
2 ≤ 6 V
1, V
1, V
10%; AGND
DD
DD
P
P
unless otherwise noted.)
MAX
DB1
DB0 (LSB)
(CONTROL BIT C1)
t
6
t
5
WARNING!
ESD SENSITIVE DEVICE
Package Option
RU-20
CP-20
RU-20
CP-20
RU-20
CP-20
RU-20
CP-20
= DGND
RF
RF
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