1-1473005-4 TE Connectivity, 1-1473005-4 Datasheet

SEMI-HARD TRAY DDR2 SODIMM SOCKET 200P 5

1-1473005-4

Manufacturer Part Number
1-1473005-4
Description
SEMI-HARD TRAY DDR2 SODIMM SOCKET 200P 5
Manufacturer
TE Connectivity
Datasheets

Specifications of 1-1473005-4

Socket Style
SO DIMM
Dram Type
Double Data Rate (DDR)
Pcb Mount Style
Surface Mount
Module Orientation
Right Angle
Profile
Standard
Keying
Standard
Dram Voltage
1.8 V
Solder Tail Contact Plating
Gold Flash
Socket Type
Memory Card
Number Of Positions
200
Row-to-row Spacing (mm [in])
6.20 [0.244]
Centerline (mm [in])
0.60 [0.024]
Number Of Rows
Dual
Ejector Type
Locking
Ejector Location
Both Ends
Number Of Keys
1
Latch Material
Stainless Steel
Latch Plating
Tin
Boss
Without
Mount Type
Printed Circuit Board
Contact Plating, Mating Area, Material
Gold Flash
Contact Base Material
Copper Alloy
Housing Material
High Temperature Thermoplastic
Housing Color
Black
Ul Flammability Rating
UL 94V-0
Stack Height (mm [in])
5.20 [0.205]
Insertion Style
Cam-In
Center Key (mm [in])
None
Rohs/elv Compliance
RoHS compliant, ELV compliant
Lead Free Solder Processes
Reflow solder capable to 245°C
Rohs/elv Compliance History
Always was RoHS compliant
Application Type
DDR SDRAM
Packaging Method
Semi-Hard Tray Assembly
Packaging Quantity
20
1. Scope :
1.1 Contents
This specification covers the requirements for product performance, test methods and quality assurance provisions
of DDR S.O.DIMM Socket 200 Positions Combine to Gold Plating S.O.DIMM.
Applicable product description and part numbers are as shown in Appendix 1.
2. Applicable Documents:
The following documents form a part of this specification to the extent specified herein. In the event of conflict
between the requirements of this specification and the product drawing, the product drawing shall take precedence.
In the event of conflict between the requirements of this specification and the referenced documents, this
specification shall take precedence.
2.1 AMP Specifications :
A. 109-5000
B. 501-5361
2.2
A.
3. Requirements :
3.1 Design and Construction :
Product shall be of the design, construction and physical dimensions specified on the applicable product drawing.
3.2 Materials :
Tyco Electronics AMP K.K. (3-5-8 Hisamoto Takatsu-ku Kawasaki, 213-8535)
© Copyright 2007 Tyco Electronics AMP K.K. All international rights reserved.
A. Contact :
B.
:‘:w
Trademark
501-5431
501-5435
501-5460
501-5488
Finish:
Contact area: Gold Plated
Tine area
Underplate :Nickel Plated
Thermo plastic UL94V-0
Copper Alloy
Housing :
MIL-STD-202
Commercial Standards and Specifications :
Test Specification, General Requirements for Test Methods
Test Report (Standard profile)
Test Report (Standard profile)
Test Report (Low profile)
Test Report (6.5 Height)
Test Report (9.2 Height)
:Gold Plated
Product Specification
DDR S.O.DIMM Socket 200 Positions:w
11JUL07 Rev. F
108-5701
1 of 5

Related parts for 1-1473005-4

1-1473005-4 Summary of contents

Page 1

... This specification covers the requirements for product performance, test methods and quality assurance provisions of DDR S.O.DIMM Socket 200 Positions Combine to Gold Plating S.O.DIMM. Applicable product description and part numbers are as shown in Appendix 1. 2. Applicable Documents: The following documents form a part of this specification to the extent specified herein. In the event of conflict between the requirements of this specification and the product drawing, the product drawing shall take precedence ...

Page 2

... C. Temperature Rating :9 55 ° ° C 3.4 Performance Requirements and Test Descriptions : The product shall be designed to meet the electrical, mechanical and environmental performance requirements specified in Fig. 1. All tests shall be performed in the room temperature, unless otherwise specified. 3.5 Test Requirements and Procedures Summary Para ...

Page 3

... AMP Spec. 109-5106 ∆ Æ Subject mated connectors salt concentration for 24 hours : AMP Spec. 109-5101 ∆ Æ Mated connector SO2 Gas : 10 ppm 25° hours AMP Spec. 109-5107 108-5701 2 ( Half sine Condition B Pre-Heat150:* 180 ‘ :90 r 30sec. Heat 230 ‘ Min. :30 r 10sec. ...

Page 4

... Discontinuities shall nit take place in this test group, during tests. Rev. F Product Specification ∆ Æ Mated connector 85° C, Duration :2 days AMP Spec. 109-5104 Condition A Test Group 1 2(b) 3( Test Sequence (a) 1,7 1,5 1,5 1,3 1,5 1,3 1,3 1,5 1,5 1,5 1,5 1,5 2,4 2,4 2,4 3,6 2 FIG.2 108-5701 7 8 ...

Page 5

... Fig.3-1 Termination Resistance Mesuring Points. Soldering temperature ( =Ä ) 300 260 Max. 250 230 Min. 200 180 150 100 50 Rev. F Product Specification Peak temperature 260=˜ Max. Pre-Heating Heat 90 30 sec + - 30 10 sec + - Fig.4 Temperature Profile of Reflow Soldering 108-5701 ...

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