ICM7555ID/01,118 NXP Semiconductors, ICM7555ID/01,118 Datasheet - Page 17

IC CMOS TIMER GEN-PURPOSE 8-SOIC

ICM7555ID/01,118

Manufacturer Part Number
ICM7555ID/01,118
Description
IC CMOS TIMER GEN-PURPOSE 8-SOIC
Manufacturer
NXP Semiconductors
Type
555 Type, Timer/Oscillator (Single)r
Datasheets

Specifications of ICM7555ID/01,118

Package / Case
8-SOIC (3.9mm Width)
Frequency
500kHz
Voltage - Supply
3 V ~ 16 V
Current - Supply
180µA
Operating Temperature
-40°C ~ 85°C
Number Of Internal Timers
1
Supply Voltage (max)
16 V
Supply Voltage (min)
3 V
Maximum Power Dissipation
780 mW
Maximum Operating Temperature
+ 85 C
Minimum Operating Temperature
- 40 C
Mounting Style
SMD/SMT
Supply Current
80 uA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Count
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
568-1820-2
935274819118
ICM7555ID/01-T
NXP Semiconductors
ICM7555_2
Product data sheet
13.4 Reflow soldering
Key characteristics in reflow soldering are:
Table 6.
Table 7.
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see
Package thickness (mm)
< 2.5
Package thickness (mm)
< 1.6
1.6 to 2.5
> 2.5
2.5
Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see
reducing the process window
Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 6
SnPb eutectic process (from J-STD-020C)
Lead-free process (from J-STD-020C)
and
Figure
7
19.
Rev. 02 — 3 August 2009
Package reflow temperature ( C)
Volume (mm
< 350
235
220
Package reflow temperature ( C)
Volume (mm
< 350
260
260
250
3
3
)
)
Figure
350 to 2000
260
250
245
19) than a SnPb process, thus
General purpose CMOS timer
220
220
350
> 2000
260
245
245
© NXP B.V. 2009. All rights reserved.
ICM7555
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