IC CMOS TIMER GEN PURPOSE 8SOIC

ICM7555ID/01,112

Manufacturer Part NumberICM7555ID/01,112
DescriptionIC CMOS TIMER GEN PURPOSE 8SOIC
ManufacturerNXP Semiconductors
Type555 Type, Timer/Oscillator (Single)
ICM7555ID/01,112 datasheets
 


Specifications of ICM7555ID/01,112

Package / Case8-SOIC (3.9mm Width)Frequency500kHz
Voltage - Supply3 V ~ 16 VCurrent - Supply180µA
Operating Temperature-40°C ~ 85°CNumber Of Internal Timers1
Supply Voltage (max)16 VSupply Voltage (min)3 V
Maximum Power Dissipation780 mWMaximum Operating Temperature+ 85 C
Minimum Operating Temperature- 40 CMounting StyleSMD/SMT
Lead Free Status / RoHS StatusLead free / RoHS CompliantCount-
Other names568-5022
935274819112
ICM7555ID/01
ICM7555ID/01,112
ICM7555ID/01
  
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ICM7555
General purpose CMOS timer
Rev. 02 — 3 August 2009
1. General description
The ICM7555 is a CMOS timer providing significantly improved performance over the
standard NE/SE555 timer, while at the same time being a direct replacement for those
devices in most applications. Improved parameters include low supply current, wide
operating supply voltage range, low THRESHOLD, TRIGGER, and RESET currents, no
crowbarring of the supply current during output transitions, higher frequency performance
and no requirement to decouple CONTROL_VOLTAGE for stable operation.
The ICM7555 is a stable controller capable of producing accurate time delays or
frequencies.
In the one-shot mode, the pulse width of each circuit is precisely controlled by one
external resistor and capacitor. For astable operation as an oscillator, the free-running
frequency and the duty cycle are both accurately controlled by two external resistors and
one capacitor. Unlike the NE/SE555 device, the CONTROL_VOLTAGE terminal need not
be decoupled with a capacitor. The TRIGGER and RESET inputs are active LOW. The
output inverter can source or sink currents large enough to drive TTL loads or provide
minimal offsets to drive CMOS loads.
2. Features
I
Exact equivalent in most applications for NE/SE555
I
Low supply current: 80 A (typical)
I
Extremely low trigger, threshold, and reset currents: 20 pA (typical)
I
High-speed operation: 500 kHz guaranteed
I
Wide operating supply voltage range guaranteed 3 V to 16 V over full automotive
temperatures
I
Normal reset function; no crowbarring of supply during output transition
I
Can be used with higher-impedance timing elements than the NE/SE555 for longer
time constants
I
Timing from microseconds through hours
I
Operates in both astable and monostable modes
I
Adjustable duty cycle
I
High output source/sink driver can drive TTL/CMOS
I
Typical temperature stability of 0.005 % / C at 25 C
I
Rail-to-rail outputs
Product data sheet

ICM7555ID/01,112 Summary of contents

  • Page 1

    ICM7555 General purpose CMOS timer Rev. 02 — 3 August 2009 1. General description The ICM7555 is a CMOS timer providing significantly improved performance over the standard NE/SE555 timer, while at the same time being a direct replacement for those ...

  • Page 2

    ... NXP Semiconductors 3. Applications I Precision timing I Pulse generation I Sequential timing I Time delay generation I Pulse width modulation I Pulse position modulation I Missing pulse detector 4. Ordering information Table 1. Ordering information Type number Temperature range ICM7555CD +70 C amb ICM7555ID +85 C amb ICM7555CN +70 C amb ICM7555IN +85 C amb 5 ...

  • Page 3

    ... NXP Semiconductors 6. Pinning information 6.1 Pinning 1 GND 2 TRIGGER ICM7555CD ICM7555ID OUTPUT 3 RESET 4 002aae400 Fig 2. Pin configuration for SO8 6.2 Pin description Table 2. Symbol GND TRIGGER OUTPUT RESET CONTROL_VOLTAGE THRESHOLD DISCHARGE Functional description Refer to 7.1 Function selection Table 3. THRESHOLD voltage don’t care 2 > ...

  • Page 4

    ... NXP Semiconductors 8. Limiting values Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter V supply voltage DD V input voltage I I output current O P power dissipation T storage temperature stg T solder point temperature sp [1] Due to the SCR structure inherent in the CMOS process used to fabricate these devices, connecting any terminal to a voltage greater than ...

  • Page 5

    ... NXP Semiconductors Table 5. Characteristics …continued unless otherwise specified. amb Sym Parameter bol I input current I V LOW-level output voltage OL V HIGH-level output voltage OH V output voltage o [4] t output rise time r(o) [4] t output fall time f(o) f oscillator frequency osc [1] The supply current value is essentially independent of the TRIGGER, THRESHOLD and RESET voltages. ...

  • Page 6

    ... NXP Semiconductors 10. Typical performance curves Fig 4. I o(source) (mA) Fig 5. I DIS (mA) Fig 6. ICM7555_2 Product data sheet 250 200 amb +25 C 150 +125 C 100 Supply current versus supply voltage +25 C. amb High output voltage drop versus output source current +25 C. amb Discharge low output voltage versus discharge sink current Rev. 02 — ...

  • Page 7

    ... NXP Semiconductors I o(sink) (mA o(sink) (mA o(sink) (mA Fig 7. ICM7555_2 Product data sheet +125 C. amb +25 C. amb amb Low output voltage versus output sink current Rev. 02 — 3 August 2009 ICM7555 General purpose CMOS timer 002aae407 1 V (V) OL 002aae408 1 V (V) OL 002aae409 1 V (V) OL © NXP B.V. 2009. All rights reserved. ...

  • Page 8

    ... NXP Semiconductors TRIGGER pulse width (ns) Fig 8. 1000 t PD (ns) Fig 9. ICM7555_2 Product data sheet 500 V 400 300 200 100 Minimum pulse width for triggering 750 500 250 Propagation delay versus voltage level of TRIGGER pulse (V Rev. 02 — 3 August 2009 General purpose CMOS timer ...

  • Page 9

    ... NXP Semiconductors normalized frequency Fig 10. Normalized frequency stability as a function of supply voltage (astable mode) normalized frequency Fig 11. Normalized frequency stability as a function of temperature (astable mode) ICM7555_2 Product data sheet 6 (%) +25 C amb 0 (%) 0.1 F Rev. 02 — 3 August 2009 ICM7555 General purpose CMOS timer ...

  • Page 10

    ... NXP Semiconductors Fig 12. Free-running frequency as a function Fig 13. Monostable time delay versus R ICM7555_2 Product data sheet 100 + amb capacitance 100 + amb Rev. 02 — 3 August 2009 General purpose CMOS timer 002aae415 resistance and external A B 002aae416 resistance and external capacitance A © NXP B.V. 2009. All rights reserved. ...

  • Page 11

    ... NXP Semiconductors 11. Application information 11.1 General The ICM7555 device is, in most instances, a direct replacement for the NE/SE555 device. However possible to effect economies in the external component count using the ICM7555. Because the NE/SE555 device produces large crowbar currents in the output driver necessary to decouple the power supply lines with a good capacitor close to the device ...

  • Page 12

    ... NXP Semiconductors 11.4 Astable operation If the circuit is connected as shown in multivibrator. The external capacitor charges through R R only. Thus, the duty cycle ( ) may be precisely set by the ratio of these two resistors this mode of operation, the capacitor charges and discharges between Since the charge rate and the threshold levels are directly proportional to the ...

  • Page 13

    ... NXP Semiconductors Fig 16. Monostable operation 11.6 Control voltage The CONTROL_VOLTAGE terminal permits the two trip voltages for the THRESHOLD and TRIGGER internal comparators to be controlled. This provides the possibility of oscillation frequency modulation in the astable mode, or even inhibition of oscillation, depending on the applied voltage. In the monostable mode, delay times can be changed by varying the applied voltage to the CONTROL_VOLTAGE pin ...

  • Page 14

    ... NXP Semiconductors 12. Package outline SO8: plastic small outline package; 8 leads; body width 3 pin 1 index 1 DIMENSIONS (inch dimensions are derived from the original mm dimensions) A UNIT max. 0.25 1.45 mm 1.75 0.25 0.10 1.25 0.010 0.057 inches 0.069 0.01 0.004 0.049 Notes 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included. ...

  • Page 15

    ... NXP Semiconductors DIP8: plastic dual in-line package; 8 leads (300 mil pin 1 index 1 DIMENSIONS (inch dimensions are derived from the original mm dimensions UNIT max. min. max. mm 4.2 0.51 3.2 inches 0.17 0.02 0.13 Note 1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included. ...

  • Page 16

    ... NXP Semiconductors 13. Soldering of SMD packages This text provides a very brief insight into a complex technology. A more in-depth account of soldering ICs can be found in Application Note AN10365 “Surface mount reflow soldering description” . 13.1 Introduction to soldering Soldering is one of the most common methods through which packages are attached to Printed Circuit Boards (PCBs), to form electrical circuits ...

  • Page 17

    ... NXP Semiconductors 13.4 Reflow soldering Key characteristics in reflow soldering are: • Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to higher minimum peak temperatures (see reducing the process window • Solder paste printing issues including smearing, release, and adjusting the process window for a mix of large and small components on one board • ...

  • Page 18

    ... NXP Semiconductors Fig 19. Temperature profiles for large and small components For further information on temperature profiles, refer to Application Note AN10365 “Surface mount reflow soldering description” . 14. Soldering of through-hole mount packages 14.1 Introduction to soldering through-hole mount packages This text gives a very brief insight into wave, dip and manual soldering. ...

  • Page 19

    ... NXP Semiconductors 14.4 Package related soldering information Table 8. Package CPGA, HCPGA DBS, DIP, HDIP, RDBS, SDIP, SIL [2] PMFP [1] For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board. [2] For PMFP packages hot bar soldering or manual soldering is suitable. ...

  • Page 20

    ... NXP Semiconductors 16. Revision history Table 10. Revision history Document ID Release date ICM7555_2 20090803 • Modifications: The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. • Legal texts have been adapted to the new company name where appropriate. ...

  • Page 21

    ... Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice ...

  • Page 22

    ... NXP Semiconductors 19. Contents 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 3 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 4 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 5 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 6 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 6.1 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 6.2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 7 Functional description . . . . . . . . . . . . . . . . . . . 3 7.1 Function selection Limiting values Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 4 10 Typical performance curves . . . . . . . . . . . . . . . 6 11 Application information 11.1 General . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 11 ...