ICM7555CBAZ Intersil, ICM7555CBAZ Datasheet - Page 3

IC TIMER RC GEN PURP CMOS 8SOIC

ICM7555CBAZ

Manufacturer Part Number
ICM7555CBAZ
Description
IC TIMER RC GEN PURP CMOS 8SOIC
Manufacturer
Intersil
Type
555 Type, Timer/Oscillator (Single)r
Datasheet

Specifications of ICM7555CBAZ

Frequency
1MHz
Voltage - Supply
2 V ~ 18 V
Current - Supply
60µA
Operating Temperature
0°C ~ 70°C
Package / Case
8-SOIC (3.9mm Width)
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Count
-

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Absolute Maximum Ratings
Supply Voltage. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .+18V
Input Voltage
Output Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 100mA
Operating Conditions
Temperature Range
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTES:
Electrical Specifications
Static Supply Current
Monostable Timing Accuracy
Astable Timing Accuracy
Threshold Voltage
Trigger Voltage
Trigger Current
Threshold Current
Control Voltage
1. Due to the SCR structure inherent in the CMOS process used to fabricate these devices, connecting any terminal to a voltage greater than
2. θ
Trigger, Control Voltage, Threshold,
Reset (Note 1) . . . . . . . . . . . . . . . . . . . . . V+ +0.3V to GND -0.3V
ICM7555C . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0°C to +70°C
ICM7555I, ICM7556I . . . . . . . . . . . . . . . . . . . . . . -25°C to +85°C
ICM7556M . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -55°C to +125°C
Drift with Temperature
(Note 3)
Drift with Supply (Note 3)
Drift with Temperature
(Note 3)
Drift with Supply (Note 3)
V+ +0.3V or less than V- -0.3V may cause destructive latchup. For this reason it is recommended that no inputs from external sources not
operating from the same power supply be applied to the device before its power supply is established. In multiple supply systems, the supply
of the ICM7555 and ICM7556 must be turned on first.
JA
is measured with the component mounted on a low effective thermal conductivity test board in free air. See Tech Brief 379 for details.
PARAMETER
SYMBOL
3
V
I
Applies to ICM7555 and ICM7556, unless otherwise specified
V
TRIG
V
I
TRIG
I
DD
TH
TH
CV
ICM7555
ICM7556 V
R
V
V
V
V
R
V
V
V
V
V
V
V
V
V
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
DD
A
A
= 10K, C = 0.1μF, V
= R
= 5V
= 10V
= 15V
= 5V to 15V
= 5V
= 10V
= 15V
= 5V to 15V
= 15V
= 15V
= 15V
= 15V
= 15V
B
= 10K, C = 0.1μF, V
TEST CONDITIONS
V
V
V
DD
DD
DD
DD
ICM7555, ICM7556
= 5V
= 15V
= 5V
= 15V
DD
= 5V
DD
= 5V
Thermal Information
Thermal Resistance (Typical, Note 2)
Maximum Junction Temperature (Hermetic Package) . . . . . . . +175°C
Maximum Junction Temperature (Plastic Package) . . . . . . . +150°C
Maximum Storage Temperature Range . . . . . . . . -65°C to +150°C
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . +300°C
* Pb-free PDIPs can be used for through hole wave solder
processing only. They are not intended for use in Reflow solder
processing applications.
14 Lead CERDIP Package. . . . . . . . . .
14 Lead PDIP Package* . . . . . . . . . . .
8 Lead PDIP Package* . . . . . . . . . . . .
8 Lead SOIC Package . . . . . . . . . . . . .
(SOIC - Lead Tips Only)
MIN
62
28
62
T
A
= +25°C
TYP
120
0.5
0.5
40
60
80
67
32
67
2
2
MAX
200
300
400
600
71
36
10
10
71
1717
MIN
858
61
27
61
-55°C TO +125°C
(NOTE 4)
θ
TYP
150
200
250
150
200
250
0.5
0.5
JA
115
130
170
(°C/W)
80
MAX
1161
2323
300
300
600
600
72
37
50
50
72
August 24, 2006
θ
JC
ppm/°C
ppm/°C
ppm/°C
ppm/°C
ppm/°C
ppm/°C
% V
% V
% V
UNITS
N/A
N/A
N/A
FN2867.9
%/V
%/V
(°C/W)
24
μA
μA
μA
μA
nA
nA
μs
μs
%
%
DD
DD
DD

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