3-1827236-4 TE Connectivity, 3-1827236-4 Datasheet

SEMI-HARD TRAY DDR2 SODIMM SOCKET 200P 4

3-1827236-4

Manufacturer Part Number

3-1827236-4

Description

SEMI-HARD TRAY DDR2 SODIMM SOCKET 200P 4

Manufacturer

TE Connectivity

Datasheet

1.2-1827236-4.pdf (4 pages)

Specifications of 3-1827236-4

Socket Style

SO DIMM

Dram Type

Double Data Rate (DDR) II

Pcb Mount Style

Surface Mount

Module Orientation

Right Angle

Profile

Low

Keying

Standard

Dram Voltage

1.8 V

Solder Tail Contact Plating

Gold Flash over Nickel

Socket Type

Memory Card

Number Of Positions

200

Row-to-row Spacing (mm [in])

5.60 [0.220]

Centerline (mm [in])

0.60 [0.024]

Number Of Rows

Dual

Ejector Type

Locking

Ejector Location

Both Ends

Number Of Keys

Latch Material

Stainless Steel

Latch Plating

Tin

Boss

With

Mount Type

Printed Circuit Board

Contact Plating, Mating Area, Material

Gold Flash

Contact Base Material

Copper Alloy

Housing Material

High Temperature Thermoplastic

Ul Flammability Rating

UL 94V-0

Stack Height (mm [in])

4.60 [0.180]

Insertion Style

Cam-In

Center Key (mm [in])

None

Rohs/elv Compliance

RoHS compliant, ELV compliant

Lead Free Solder Processes

Reflow solder capable to 245°C, Reflow solder capable to 260°C

Rohs/elv Compliance History

Always was RoHS compliant

Application Type

DDR SDRAM

Packaging Method

Tray

Available stocks

Company

Part Number

Manufacturer

Quantity

Price

Company:

Bonase Electronics (HK) Co., Limited

Part Number:

3-1827236-4

Manufacturer:

NIHON

Quantity:

28 523

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