LTC2449CUHF#TR Linear Technology, LTC2449CUHF#TR Datasheet - Page 27

• Manufacturer Part Number: LTC2449CUHF#TR
• Description: IC ADC 24BIT HI SPEED 38QFN
• Manufacturer: Linear Technology

Specifications of LTC2449CUHF#TR

• Number Of Bits: 24
• Sampling Rate (per Second): 8k
• Data Interface: MICROWIRE™, Serial, SPI™
• Number Of Converters: 1
• Power Dissipation (max): 40mW
• Voltage Supply Source: Single Supply
• Operating Temperature: 0°C ~ 70°C
• Mounting Type: Surface Mount
• Package / Case: 38-WFQFN, Exposed Pad
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

PACKAGE DESCRIPTIO
7.00 ± 0.10
0.75 ± 0.05
(2 SIDES)
NOTE:
1. DRAWING CONFORMS TO JEDEC PACKAGE
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
5.50 ± 0.05
OUTLINE M0-220 VARIATION WHKD
(2 SIDES)
4.10 ± 0.05
(2 SIDES)
PIN 1
TOP MARK
(SEE NOTE 6)
3.20 ± 0.05
(2 SIDES)
5.00 ± 0.10
(2 SIDES)
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no represen-
tation that the interconnection of its circuits as described herein will not infringe on existing patent rights.
U
RECOMMENDED SOLDER PAD LAYOUT
38-Lead Plastic QFN (5mm × 7mm)
(Reference LTC DWG # 05-08-1701)
5.20 ± 0.05 (2 SIDES)
6.10 ± 0.05 (2 SIDES)
7.50 ± 0.05 (2 SIDES)
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
0.200 REF
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.20mm ON ANY SIDE
ON THE TOP AND BOTTOM OF PACKAGE
0.50 BSC
0.25 ± 0.05
0.00 – 0.05
0.75 ± 0.05
UHF Package
5.15 ± 0.10
(2 SIDES)
0.00 – 0.05
0.200 REF
0.50 BSC
0.25 ± 0.05
BOTTOM VIEW—EXPOSED PAD
0.70 ± 0.05
LTC2444/LTC2445/
LTC2448/LTC2449
PACKAGE
OUTLINE
3.15 ± 0.10
(2 SIDES)
R = 0.115
TYP
37
38
0.40 ± 0.10
1
2
0.435
(UH) QFN 0303
0.18
0.23
27
0.18
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