5050863-1 TE Connectivity, 5050863-1 Datasheet
5050863-1
Manufacturer Part Number
5050863-1
Description
SOCKET,MIN-SPR SN-AU SER-2
Manufacturer
TE Connectivity
Datasheet
1.5050863-1.pdf
(1 pages)
Specifications of 5050863-1
Socket Length (mm [in])
6.60 [0.260]
Sleeve Style
Open Bottom
Sealant
Without
Sleeve Material
Copper
Recommended Hole Size (mm [in])
1.32 [0.052]
Mating Pin Dia. Range (mm [in])
0.36 – 0.66 [0.014 – 0.026]
Sleeve Material Plating
Tin
Spring Material
Beryllium Copper
Contact Spring Plating
Gold (30)
Contact Base Material
Beryllium Copper
Insertion Method
Hand/Semi-Automatic
Government/industry Qualification
No
Rohs/elv Compliance
RoHS compliant, ELV compliant
Lead Free Solder Processes
Wave solder capable to 240°C, Wave solder capable to 260°C, Wave solder capable to 265°C, Reflow solder capable to 245°C, Reflow solder capable to 260°C, Pin-in-Paste capable to 245°C, Pin-in-Paste capable to 260°C
Rohs/elv Compliance History
Always was RoHS compliant
Application
Production
Packaging Method
Loose Piece
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