AD7782BRU Analog Devices Inc, AD7782BRU Datasheet - Page 5

• Manufacturer Part Number: AD7782BRU
• Description: IC ADC 24BIT 2CH 16-TSSOP
• Manufacturer: Analog Devices Inc

Specifications of AD7782BRU

• Rohs Status: RoHS non-compliant
• Number Of Bits: 24
• Sampling Rate (per Second): 19.79
• Data Interface: DSP, MICROWIRE™, QSPI™, Serial, SPI™
• Number Of Converters: 1
• Power Dissipation (max): 3.9mW
• Voltage Supply Source: Single Supply
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 16-TSSOP (0.173", 4.40mm Width)

ABSOLUTE MAXIMUM RATINGS
(T
V
Analog Input Voltage to GND . . . . . . . . –0.3 V to V
Reference Input Voltage to GND . . . . . –0.3 V to V
Total AIN/REFIN Current (Indefinite) . . . . . . . . . . . . . 30 mA
Digital Input Voltage to GND . . . . . . . . –0.3 V to V
Digital Output Voltage to GND . . . . . . –0.3 V to V
Operating Temperature Range . . . . . . . . . . . . –40°C to +85°C
Storage Temperature Range . . . . . . . . . . . . . –65°C to +150°C
Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . 150°C
CAUTION
ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily
accumulate on the human body and test equipment and can discharge without detection. Although
the AD7782 features proprietary ESD protection circuitry, permanent damage may occur on
devices subjected to high-energy electrostatic discharges. Therefore, proper ESD precautions are
recommended to avoid performance degradation or loss of functionality.
DD
A
= 25°C unless otherwise noted)
MASTER MODE
I = INPUT TO AD7782, O = OUTPUT FROM AD7782
SLAVE MODE IS SELECTED BY TYING THE MODE PIN LOW, WHILE MASTER MODE IS SELECTED BY TYING THE MODE PIN HIGH.
to GND . . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +7 V
SLAVE MODE
CH1/CH2 (I)
DOUT/RDY
SCLK (O)
SCLK (I)
CS (I)
Model
AD7782BRU
EVAL-AD7782EB
t
2
t
3
t
4
t
11
t
t
Temperature Range
–40°C to +85°C
5
5
MSB
t
t
6
6
t
t
DD
DD
DD
DD
7
7
ORDERING GUIDE
+ 0.3 V
+ 0.3 V
+ 0.3 V
+ 0.3 V
LSB
t
10
TSSOP Package
Lead Temperature, Soldering
Package Description
TSSOP
Evaluation Board
Stresses above those listed under Absolute Maximum Ratings may cause per-
manent damage to the device. This is a stress rating only; functional operation of
the device at these or any other conditions above those listed in the operational
sections of this specification is not implied. Exposure to absolute maximum rating
conditions for extended periods may affect device reliability.
θ
θ
Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . . . 215°C
Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . . . 220°C
JA
JC
Thermal Impedance . . . . . . . . . . . . . . . . . . . . .97.9°C/W
Thermal Impedance . . . . . . . . . . . . . . . . . . . . . . 14°C/W
MSB
Package Option
RU-16
WARNING!
LSB
t
9
ESD SENSITIVE DEVICE
AD7782
t
8