IC DGTL POT 50K 2CH 16QFN

 

MCP4241T-503E/ML

Manufacturer Part NumberMCP4241T-503E/ML
DescriptionIC DGTL POT 50K 2CH 16QFN
ManufacturerMicrochip Technology
MCP4241T-503E/ML datasheets

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Specifications of MCP4241T-503E/ML

Package / Case16-QFNTaps129
Resistance (ohms)50KNumber Of Circuits2
Temperature Coefficient150 ppm/°C TypicalMemory TypeNon-Volatile
InterfaceSPI SerialVoltage - Supply2.7 V ~ 5.5 V
Operating Temperature-40°C ~ 125°CMounting TypeSurface Mount
Resistance In Ohms50KNumber Of PotsDual
Taps Per Pot128Resistance50 KOhms
Wiper MemoryNon VolatileDigital InterfaceSerial (4-Wire, SPI)
Operating Supply Voltage2.5 V, 3.3 V, 5 VSupply Current550 uA
Maximum Operating Temperature+ 125 CMinimum Operating Temperature- 40 C
Mounting StyleSMD/SMTSupply Voltage (max)5.5 V
Supply Voltage (min)1.8 VLead Free Status / RoHS StatusLead free / RoHS Compliant
Other namesMCP4241T-503-E/ML
MCP4241T-503-E/MLTR
MCP4241T-503-E/MLTR
MCP4241T-503E/MLTR
  
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1.0
ELECTRICAL
CHARACTERISTICS
Absolute Maximum Ratings †
Voltage on V
with respect to V
............... -0.6V to +7.0V
DD
SS
Voltage on CS, SCK, SDI, SDI/SDO, WP, and
SHDN with respect to V
SS ......................................
Voltage on all other pins (PxA, PxW, PxB, and
SDO) with respect to V
-0.3V to V
SS ............................
Input clamp current, I
IK
(V
< 0, V
> V
, V
> V
HV pins) ......................±20 mA
PP ON
I
I
DD
I
Output clamp current, I
OK
(V
< 0 or V
> V
) ..................................................±20 mA
O
O
DD
Maximum output current sunk by any Output pin
......................................................................................25 mA
Maximum output current sourced by any Output pin
......................................................................................25 mA
Maximum current out of V
pin .................................100 mA
SS
Maximum current into V
pin ....................................100 mA
DD
Maximum current into P
A, P
W & P
B pins ............±2.5 mA
X
X
X
Storage temperature ....................................-65°C to +150°C
Ambient temperature with power applied
.....................................................................-40°C to +125°C
Total power dissipation (Note 1) ................................400 mW
Soldering temperature of leads (10 seconds) ............. +300°C
ESD protection on all pins .................................. ≥ 4 kV (HBM),
.......................................................................... ≥ 300V (MM)
Maximum Junction Temperature (T
) ......................... +150°C
J
Note 1: Power dissipation is calculated as follows:
- ∑ I
P
= V
x {I
dis
DD
DD
© 2008 Microchip Technology Inc.
MCP414X/416X/424X/426X
† Notice: Stresses above those listed under “Maximum
Ratings” may cause permanent damage to the device. This is
a stress rating only and functional operation of the device at
those or any other conditions above those indicated in the
operational listings of this specification is not implied.
Exposure to maximum rating conditions for extended periods
may affect device reliability.
-0.6V to 12.5V
+ 0.3V
DD
} + ∑ {(V
} + ∑(V
-V
) x I
x I
OH
DD
OH
OH
OI
OL
)
DS22059B-page 3