IC XDCP SGL 64-TAP 10K 16-SOIC

 

X9429WS16Z-2.7T1

Manufacturer Part NumberX9429WS16Z-2.7T1
DescriptionIC XDCP SGL 64-TAP 10K 16-SOIC
ManufacturerIntersil
SeriesXDCP™
X9429WS16Z-2.7T1 datasheets

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Specifications of X9429WS16Z-2.7T1

Taps64Resistance (ohms)10K
Number Of Circuits1Temperature Coefficient300 ppm/°C Typical
Memory TypeNon-VolatileInterfaceI²C, 2-Wire Serial
Voltage - Supply2.7 V ~ 5.5 VOperating Temperature0°C ~ 70°C
Mounting TypeSurface MountPackage / Case16-SOIC (0.300", 7.5mm Width)
Resistance In Ohms10KLead Free Status / RoHS StatusLead free / RoHS Compliant
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Small Outline Plastic Packages (SOIC)
N
INDEX
0.25(0.010)
H
AREA
E
-B-
1
2
3
SEATING PLANE
-A-
A
D
-C-
α
e
A1
B
0.10(0.004)
0.25(0.010)
M
C A
M
B S
NOTES:
1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of
Publication Number 95.
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate burrs.
Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006
inch) per side.
4. Dimension “E” does not include interlead flash or protrusions. Interlead
flash and protrusions shall not exceed 0.25mm (0.010 inch) per side.
5. The chamfer on the body is optional. If it is not present, a visual index
feature must be located within the crosshatched area.
6. “L” is the length of terminal for soldering to a substrate.
7. “N” is the number of terminal positions.
8. Terminal numbers are shown for reference only.
9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater above
the seating plane, shall not exceed a maximum value of 0.61mm (0.024
inch)
10. Controlling dimension: MILLIMETER. Converted inch dimensions are
not necessarily exact.
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
For information regarding Intersil Corporation and its products, see www.intersil.com
20
X9429
M16.3
(JEDEC MS-013-AA ISSUE C)
16 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE
M
B
M
SYMBOL
MIN
A
0.0926
A1
0.0040
L
B
0.013
C
0.0091
D
0.3977
h x 45°
E
0.2914
e
H
0.394
C
h
0.010
L
0.016
N
α
INCHES
MILLIMETERS
MAX
MIN
MAX
NOTES
0.1043
2.35
2.65
0.0118
0.10
0.30
0.0200
0.33
0.51
0.0125
0.23
0.32
0.4133
10.10
10.50
0.2992
7.40
7.60
0.050 BSC
1.27 BSC
0.419
10.00
10.65
0.029
0.25
0.75
0.050
0.40
1.27
16
16
Rev. 1 6/05
October 13, 2008
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9
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3
4
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5
6
7
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FN8248.3