RXEF250 TE Connectivity, RXEF250 Datasheet - Page 17

• Manufacturer Part Number: RXEF250
• Description: FUSE, PTC RESET, 72V, 2.5A, RADIAL
• Manufacturer: TE Connectivity
• Series: RXEFr

Specifications of RXEF250

• Holding Current: 2.5A
• Tripping Current: 5A
• Initial Resistance Max: 0.08ohm
• Operating Voltage: 72V
• Ptc Fuse Case: Radial Leaded
• Initial Resistance Min: 0.05ohm
• Resistance R1: 0.13ohm
• Rohs Compliant: Yes
• Hold Current: 2.5A
• Trip Current: 5A
• Initial Resistance (min): 50mOhm
• Initial Resistance (max): 80mOhm
• Voltage Rating Max: 72V
• Trip Time (max): 15.6@12.5As
• Power Dissipation (typ): 2.5W
• Post Trip Resistance (max): 130mOhm
• Wire Form: Straight
• Agency Approvals: CSA/TUV/UL
• Operating Temperature Min Deg. C: -40C
• Operating Temperature Max Deg. C: 85C
• Brand/series: PolySwitch®/RXEF Series
• Current, Rating: 2.5 A
• Dimensions: 0.82x0.12x1 "
• Material, Body: Epoxy Polymer
• Mounting Type: PCB
• Primary Type: Resettable
• Resistance, Dc: 0.08 Ohms
• Termination: Radial
• Voltage, Rating: 72 VDC
• Agency Recognition: UL, CSA, TUV
• Ul File Number: E74889
• Csa File Number: A78165
• Vmax (v): 72
• Imax (a): 40
• Ih (room Temperature) (a): 2.5
• It (room Temperature) (a): 5.00
• Rmin (?): 0.05
• Rmax (?): 0.080
• R1 Max [post Trip] (?): 0.13
• Power Dissipation (typical) (w): 2.50
• Construction: Radial
• Lead Type: Straight
• Family Name: RXEF
• Coating: Coated
• Rohs/elv Compliance: RoHS compliant, ELV compliant
• Lead Free Solder Processes: Wave solder capable to 240°C, Wave solder capable to 260°C, Wave solder capable to 265°C
• Rohs/elv Compliance History: Always was RoHS compliant
• Tuv Certificate No.: Available on request (per IEC 60730-1)
• Operating Temperature (max.) (°c): 85
• Application: Radial
• Packaging Method: Bulk
• Lead Free Status / Rohs Status: Compliant

Table R5 - Physical Characteristics and Environmental Specifications for Radial-leaded Devices
RTEF
Physical Characteristics
Lead material
Soldering characteristics
Solder heat withstand
Insulting material
RTEF
Environmental Specifications
Test
Passive aging
Humidity aging
Thermal Shock
Solvent resistance
RUEF
Physical Characteristics
Lead material
Soldering characteristics
Solder heat withstand
Insulting material
Devices are not designed to be placed through a reflow process.
RUEF
Environmental Specifications
Test
Passive aging
Humidity aging
Thermal Shock
Solvent resistance
RUSBF
Physical Characteristics
Lead material
Soldering characteristics
Solder heat withstand
Insulting material
Devices are not designed to be placed through a reflow process.
RUSBF
Environmental Specifications
Test
Passive aging
Humidity aging
Thermal Shock
Solvent resistance
RGEF
Physical Characteristics
Lead material
Soldering characteristics
Solder heat withstand
Insulting material
Devices are not designed to be placed through a reflow process.
Tin-plated copper-clad steel, 0.205mm
Solderability pre ANSI/J-STD-002 Category 3
per IEC-STD 68-2-20, Test Tb, Method 1a, condition b; can withstand 10 seconds at 260°C ±5°C
Cured, flame-retardant epoxy polymer; meets UL 94V-0
Conditions
70°C, 1000 hours
85°C, 1000 hours
85°C, 85%RH, 1000 hours
85°C, -40°C (10 times)
MIL-STD-202, Method 215F
RUEF090 to RUEF250: Tin-plated copper-clad steel, 0.205mm
RUEF300 to RUEF900: Tin-plated copper, 0.52mm
Solderability pre ANSI/J-STD-002 Category 3
per IEC-STD 68-2-20, Test Tb, Method1a, condition b, can withstand 10 seconds at 260°C ±5°C
Cured, flame-retardant epoxy polymer; meets UL 94V-0
Conditions
70°C, 1000 hours
85°C, 1000 hours
85°C, 85%RH, 1000 hours
85°C, -40°C (10times)
MIL-STD-202, Method 215F
RUSBF075: Tin-plated nickel-copper alloy, 0.205mm
RUSBF090 to RUSBF250: Tin-plated copper clad-steel, 0.205mm
Solderability pre ANSI/J-STD-002 Category 3 except
RUSBF075 meet ANSI/J-STD-002 Category 1
RUSBF120: per IEC-STD 68-2-20, Test Tb, Method 1a, condition a; can withstand 5 seconds at 260°C ±5°C
All others: per IEC-STD 68-2-20, Test Tb, Method 1a, condition b; can withstand 10 seconds at 260°C ±5°C
Cured, flame-retardant epoxy polymer; meets UL 94V-0
Conditions
70°C, 1000 hours
85°C, 1000 hours
85°C, 85%RH, 1000 hours
85°C, -40°C (10 times)
MIL-STD-202, Method 215F
RGEF300 to RGEF1100: Tin-plated copper, 0.52mm
RGEF1200 to RGEF1400: Tin-plated copper, 0.82mm
Solderability pre ANSI/J-STD-002 Category 3
RGEF300K and RGEF400: per IEC 68-2-20, Test Tb, Method 1a, condition a; can withstand 5 seconds at 260°C ±5°C
RGEF500 to RGEF1400: per IEC 68-2-20, Test Tb, Method 1a, condition b; can withstand 10 seconds at 260°C ±5°C
Cured, flame-retardant epoxy polymer; meets UL 94V-0
2
(24AWG), ø0.40mm (0.016in.)
2
2
(20AWG), ø0.81mm (0.032in.)
2
(20AWG), ø0.81mm/0.032in.
2
Resistance Change
±5%
±5%
±5%
±5%
No change
(24AWG), ø0.51mm/0.020in.
(18AWG), ø1.0mm/0.04in.
2
(24AWG)
2
(24AWG), ø0.51mm/0.020in.
Resistance Change
±5%
±5%
±5%
±5%
No change
Resistance Change
±5%
±5%
±5%
±5%
No change
...
Cont'd
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