PRIXP423ABB Intel, PRIXP423ABB Datasheet - Page 76

• Manufacturer Part Number: PRIXP423ABB
• Manufacturer: Intel

Specifications of PRIXP423ABB

• Core Operating Frequency: 266MHz
• Package Type: BGA
• Pin Count: 492
• Mounting: Surface Mount
• Operating Temperature (max): 70C
• Operating Temperature (min): 0C
• Operating Temperature Classification: Commercial
• Lead Free Status / Rohs Status: Compliant

Table 25.
4.3
Intel
Datasheet
76
Note:
AE10
AE11
AE12
AE13
AE14
AE15
AE16
AE17
AE18
AE19
AE20
AE21
AE22
AE23
AE24
AE25
AE26
Ball
AE1
AE2
AE3
AE4
AE5
AE6
AE7
AE8
AE9
®
IXP42X Product Line of Network Processors and IXC1100 Control Plane Processor
Interfaces not being utilized at a system level require external pull-up or pull-down resistors. For specific details and requirements, see
Section 3.0, “Functional Signal Descriptions” on page
ETH_RXDATA0[3]
ETH_RXDV1
ETH_TXEN1
ETH_COL0
ETH_COL1
HIGHZ_N
VCCPLL1
VCCPLL2
JTG_TDI
Signal
VCCP
VCCP
VCCP
VCCP
VCCP
VCCP
VCCP
VCCP
VSS
VSS
VSS
VSS
N/C
N/C
N/C
N/C
N/C
Ball Map Assignment for the Intel
IXC1100 Control Plane Processor (Sheet 7 of 7)
Package Thermal Specifications
The thermal characterization parameter “Ψ
difference between the top, center of the package and the junction temperature.
This can be a useful value for verifying device temperatures in an actual environment.
By measuring the package of the device, the junction temperature can be estimated, if
the thermal characterization parameter has been measured under similar conditions.
The use of Ψ
the device junction to the external surface of the package or case nearest the die
attachment — as the case is held at a constant temperature.
The case temperature can then be monitored to make sure that the maximum junction
temperature is not violated. Examples are given in the following sections.
Case temperature = Junction Temperature - (
Dissipation)
T
JC
= T
J
- (
AF10
AF11
AF12
AF13
AF14
AF15
AF16
AF17
AF18
AF19
AF20
AF21
AF22
AF23
AF24
AF25
AF26
Ball
AF1
AF2
AF3
AF4
AF5
AF6
AF7
AF8
AF9
Ψ
JT
JT
should not be confused with Θ
* Power Dissipation)
Intel
ETH_RXDATA0[2]
ETH_TXDATA1[3]
ETH_RXDATA1[0]
ETH_TXCLK1
BYPASS_CLK
(Reserved)
ETH_MDIO
ETH_CRS1
OSC_OUT
VSSOSCP
JTG_TMS
JTG_TCK
VCCOSC
VSSOSC
®
OSC_IN
Signal
IXP42X product line and IXC1100 control plane processors—Datasheet
N/C
N/C
N/C
N/C
N/C
N/C
N/C
N/C
N/C
N/C
N/C
30.
®
Ball
IXP420 Network Processor and Intel
JT”
jc,
is proportional to the temperature
Ψ
which is the thermal resistance from
JT
Signal
* Power
Document Number:
Ball
Signal
252479-007US
June 2007
®