BAP50-05 NXP Semiconductors, BAP50-05 Datasheet

Two planar PIN diodes in common cathode configuration in a SOT23 small plastic SMD package

BAP50-05

Manufacturer Part Number
BAP50-05
Description
Two planar PIN diodes in common cathode configuration in a SOT23 small plastic SMD package
Manufacturer
NXP Semiconductors
Datasheet

Specifications of BAP50-05

Configuration
Dual Common Cathode
Forward Current
50mA
Forward Voltage
1.1V
Power Dissipation
250mW
Operating Temperature Classification
Military
Reverse Voltage
50V
Package Type
SOT-23
Mounting
Surface Mount
Maximum Series Resistance @ Minimum If
40@0.5mAOhm
Maximum Series Resistance @ Maximum If
5@10mAOhm
Operating Temperature (max)
150C
Operating Temperature (min)
-65C
Pin Count
3
Lead Free Status / Rohs Status
Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
BAP50-05
Manufacturer:
FENGHUA
Quantity:
660 000
Part Number:
BAP50-05
Manufacturer:
NXP
Quantity:
30 000
Part Number:
BAP50-05
Manufacturer:
NXP/恩智浦
Quantity:
20 000
Part Number:
BAP50-05W
Manufacturer:
NXP
Quantity:
36 000
Product specification
Supersedes data of 1999 Feb 01
DATA SHEET
BAP50-05
General purpose PIN diode
halfpage
DISCRETE SEMICONDUCTORS
M3D088
1999 May 10

Related parts for BAP50-05

BAP50-05 Summary of contents

Page 1

... DATA SHEET halfpage BAP50-05 General purpose PIN diode Product specification Supersedes data of 1999 Feb 01 DISCRETE SEMICONDUCTORS M3D088 1999 May 10 ...

Page 2

... T junction temperature j 1999 May 10 PINNING PIN olumns 3 Top view Marking code: 1Cp. Fig.1 Simplified outline (SOT23) and symbol. CONDITIONS = 90  Product specification BAP50-05 DESCRIPTION anode anode common cathode MAM108 MIN. MAX. UNIT    250 mW 65 C +150  ...

Page 3

... MHz MHz MHz 0.5 mA 100 MHz; note mA 100 MHz; note mA 100 MHz; note 1 F PARAMETER 3 Product specification BAP50-05 MIN. TYP. MAX. UNIT  0.95 1.1 V     100 nA   0.45 pF  0.35 0.6 pF  0.3 0.5 pF  ...

Page 4

... Diode capacitance as a function of reverse voltage; typical values (dB) −5 −10 −15 −20 −25 0.5 1 1.5 2 Diode zero biased and inserted in series with a 50  stripline circuit C. T amb  2 Isolation ( the diode in off-state function of frequency; typical values. Product specification BAP50-05 MGS318 (V) MGS321 2 (GHz) ...

Page 5

... OUTLINE VERSION IEC SOT23 1999 May scale 3.0 1.4 2.5 1.9 0.95 2.8 1.2 2.1 REFERENCES JEDEC JEITA TO-236AB 5 Product specification detail 0.45 0.55 0.2 0.1 0.15 0.45 EUROPEAN PROJECTION BAP50-05 SOT23 ISSUE DATE 04-11-04 06-03-16 ...

Page 6

... Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. 6 Product specification BAP50-05 DEFINITION ...

Page 7

... NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications. 7 Product specification BAP50-05 ...

Page 8

... Interface, Security and Digital Processing expertise Customer notification This data sheet was changed to reflect the new company name NXP Semiconductors, including new legal definitions and disclaimers. No changes were made to the technical content, except for package outline drawings which were updated to the latest version. ...

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