K4H561638H-ZIB3

Manufacturer Part NumberK4H561638H-ZIB3
ManufacturerSamsung Semiconductor
K4H561638H-ZIB3 datasheets

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K4H561638H
20.0 System Characteristics for DDR SDRAM
The following specification parameters are required in systems using DDR333, DDR266 devices to ensure proper system performance.
these characteristics are for system simulation purposes and are guaranteed by design.
Table 1 : Input Slew Rate for DQ, DQS, and DM
AC CHARACTERISTICS
PARAMETER
DQ/DM/DQS input slew rate measured between
VIH(DC), VIL(DC) and VIL(DC), VIH(DC)
Table 2 : Input Setup & Hold Time Derating for Slew Rate
∆tIS
Input Slew Rate
0.5 V/ns
0
0.4 V/ns
+50
0.3 V/ns
+100
Table 3 : Input/Output Setup & Hold Time Derating for Slew Rate
∆tDS
Input Slew Rate
0.5 V/ns
0
0.4 V/ns
+75
0.3 V/ns
+150
Table 4 : Input/Output Setup & Hold Derating for Rise/Fall Delta Slew Rate
∆tDS
Delta Slew Rate
+/- 0.0 V/ns
0
+/- 0.25 V/ns
+50
+/- 0.5 V/ns
+100
Table 5 : Output Slew Rate Characteristice (X4, X8 Devices only)
Typical Range
Slew Rate Characteristic
(V/ns)
Pullup Slew Rate
1.2 ~ 2.5
Pulldown slew
1.2 ~ 2.5
Table 6 : Output Slew Rate Characteristice (X16 Devices only)
Typical Range
Slew Rate Characteristic
(V/ns)
Pullup Slew Rate
1.2 ~ 2.5
Pulldown slew
1.2 ~ 2.5
Table 7 : Output Slew Rate Matching Ratio Characteristics
AC CHARACTERISTICS
PARAMETER
Output Slew Rate Matching Ratio (Pullup to Pulldown)
DDR400
SYMBOL
MIN
MAX
DCSLEW
0.5
4.0
∆tIH
Units
Notes
0
ps
i
0
ps
i
0
ps
i
∆tDH
Units
Notes
0
ps
k
+75
ps
k
+150
ps
k
∆tDH
Units
Notes
0
ps
j
+50
ps
j
+100
ps
j
Minimum
Maximum
Notes
(V/ns)
(V/ns)
1.0
4.5
a,c,d,f,g,h
1.0
4.5
b,c,d,f,g,h
Minimum
Maximum
Notes
(V/ns)
(V/ns)
0.7
5.0
a,c,d,f,g,h
0.7
5.0
b,c,d,f,g,h
DDR400
DDR333
MIN
MAX
MIN
0.67
1.5
0.67
Industrial
DDR SDRAM
DDR333
DDR266
MIN
MAX
MIN
MAX
Units
0.5
4.0
0.5
4.0
V/ns
DDR266
MAX
MIN
MAX
Notes
1.5
0.67
1.5
e,m
Rev. 1.3 February 2007
Notes
a, m