K4T1G164QF-BCE6 Samsung Semiconductor, K4T1G164QF-BCE6 Datasheet - Page 17

• Manufacturer Part Number: K4T1G164QF-BCE6
• Manufacturer: Samsung Semiconductor

Specifications of K4T1G164QF-BCE6

• Lead Free Status / Rohs Status: Compliant

K4T1G044QF
K4T1G084QF
K4T1G164QF
NOTE :
1. IDD specifications are tested after the device is properly initialized
2. Input slew rate is specified by AC Parametric Test Condition
3. IDD parameters are specified with ODT disabled.
4. Data bus consists of DQ, DM, DQS, DQS, RDQS, RDQS, LDQS, LDQS, UDQS, and UDQS. IDD values must be met with all combinations of EMRS bits 10 and 11.
5. Definitions for IDD
For purposes of IDD testing, the following parameters are utilized
Detailed IDD7
The detailed timings are shown below for IDD7.
Legend: A = Active; RA = Read with Autoprecharge; D = Deselect
IDD7: Operating Current: All Bank Interleave Read operation
All banks are being interleaved at minimum tRC(IDD) without violating tRRD(IDD) and tFAW(IDD) using a burst length of 4. Control and address bus inputs are STABLE during
DESELECTs. IOUT = 0mA
Timing Patterns for 8bank devices x4/ x8
-DDR2-667 5/5/5 : A0 RA0 D A1 RA1 D A2 RA2 D A3 RA3 D D A4 RA4 D A5 RA5 D A6 RA6 D A7 RA7 D D
-DDR2-800 6/6/6 : A0 RA0 D A1 RA1 D A2 RA2 D A3 RA3 D D D A4 RA4 D A5 RA5 D A6 RA6 D A7 RA7 D D D
-DDR2-800 5/5/5 : A0 RA0 D A1 RA1 D A2 RA2 D A3 RA3 D D D A4 RA4 D A5 RA5 D A6 RA6 D A7 RA7 D D D
Timing Patterns for 8bank devices x16
-DDR2-667 5/5/5 : A0 RA0 D D A1 RA1 D D A2 RA2 D D A3 RA3 D D D A4 RA4 D D A5 RA5 D D A6 RA6 D D A7 RA7 D D D
-DDR2-800 6/6/6 : A0 RA0 D D A1 RA1 D D A2 RA2 D D A3 RA3 D D D D A4 RA4 D D A5 RA5 D D A6 RA6 D D A7 RA7 D D D D
-DDR2-800 5/5/5 : A0 RA0 D D A1 RA1 D D A2 RA2 D D A3 RA3 D D D D A4 RA4 D D A5 RA5 D D A6 RA6 D D A7 RA7 D D D D
tRRD(IDD)-x4/x8
tRRD(IDD)-x16
LOW is defined as V
HIGH is defined as V
STABLE is defined as inputs stable at a HIGH or LOW level
FLOATING is defined as inputs at V
SWITCHING is defined as:
tRASmin(IDD)
Parameter
tRCD(IDD)
tRFC(IDD)
tRC(IDD)
tCK(IDD)
tRP(IDD)
CL(IDD)
inputs changing between HIGH and LOW every other clock cycle (once per two clocks) for address and control
signals, and
inputs changing between HIGH and LOW every other data transfer (once per clock) for DQ signals not including
masks or strobes.
IN
IN
≤ V
≥ V
IL
IH
(AC)max
(AC)min
DDR2-800
127.5
5-5-5
12.5
57.5
12.5
7.5
2.5
10
45
REF
5
= V
DDQ
/2
datasheet
DDR2-800
127.5
6-6-6
7.5
2.5
15
60
10
45
15
6
- 17 -
DDR2-667
127.5
5-5-5
7.5
15
60
10
45
15
5
3
Units
tCK
ns
ns
ns
ns
ns
ns
ns
ns
DDR2 SDRAM
Rev. 1.11