K4T1G164QF-BCE6 Samsung Semiconductor, K4T1G164QF-BCE6 Datasheet - Page 7

• Manufacturer Part Number: K4T1G164QF-BCE6
• Manufacturer: Samsung Semiconductor

Specifications of K4T1G164QF-BCE6

• Lead Free Status / Rohs Status: Compliant

K4T1G044QF
K4T1G084QF
K4T1G164QF
3.3 x16 Package Pinout (Top view) : 84ball FBGA Package
NOTE : V
DDL
and V
M
A
B
C
D
E
G
H
K
N
P
R
F
J
L
SSDL
Top view
(See the balls through package)
Ball Locations (x16)
are power and ground for the DLL. It is recommended that they be isolated on the device from V
Populated ball
Ball not populated
DQ14
DQ12
V
V
V
DQ6
DQ4
BA2
V
V
V
V
DDQ
DDQ
DDL
1
DD
DD
SS
DD
A10/AP
V
V
V
V
V
DQ9
DQ1
CKE
BA0
A12
NC
NC
A3
A7
SSQ
SSQ
SSQ
SSQ
REF
2
datasheet
DQ11
V
V
UDM
LDM
DQ3
BA1
V
V
V
WE
NC
A1
A5
A9
DDQ
DDQ
3
SS
SS
SS
4
- 7 -
5
C
D
G
H
M
N
R
A
B
E
F
K
L
P
J
6
1
2
UDQS
LDQS
V
DQ10
V
V
V
V
RAS
CAS
DQ2
A11
SSDL
NC
A2
A6
SSQ
DDQ
SSQ
DDQ
3
7
4
5
UDQS
LDQS
V
V
V
V
DQ8
DQ0
6
CK
CK
NC
CS
A0
A4
A8
SSQ
SSQ
SSQ
SSQ
8
7
8
DQ15
DQ13
9
V
V
V
V
DQ7
DQ5
ODT
V
V
V
DDQ
DDQ
DDQ
DDQ
9
DD
DD
SS
DD
DDR2 SDRAM
, V
DDQ
, V
SS
, and V
Rev. 1.11
SSQ
.