PC929PY Sharp Electronics, PC929PY Datasheet

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PC929PY

Manufacturer Part Number
PC929PY
Description
Manufacturer
Sharp Electronics
Datasheet

Specifications of PC929PY

Number Of Elements
1
Input Type
DC
Output Type
Push-Pull
Forward Voltage
1.75V
Forward Current
20mA
Output Current
100mA
Isolation Voltage
4000Vrms
Package Type
SMD
Operating Temp Range
-25C to 80C
Fall Time
500ns
Rise Time
500ns
Power Dissipation
550mW
Propagation Delay Time
500ns
Pin Count
14
Mounting
Surface Mount
Reverse Breakdown Voltage
6V
Operating Temperature Classification
Commercial
Lead Free Status / Rohs Status
Not Compliant
■ Description
■ Features
PC929 Series
an OPIC chip.
speed responce (t
1. 14 pin Half pitch type (Lead pitch : 1.27 mm)
2. Double transfer mold package
3. Built-in IGBT shortcircuit protector circuit
4. Built-in direct drive circuit for IGBT drive
5. High speed responce (t
6. High isolation voltage (V
∗ "OPIC"(Optical IC) is a trademark of the SHARP Corporation. An OPIC consists of a light-detecting element and a signal-processing
circuit integrated onto a single chip.
Notice The content of data sheet is subject to change without prior notice.
PC929 Series contains an IRED optically coupled to
It is packaged in a Mini-flat, Half pitch type (14 pin).
Input-output isolation voltage(rms) is 4.0kV. High
(Ideal for Flow Soldering)
(Peak output current : I
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP
devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
PLH
, t
PHL
O1P
PLH
: MAX. 0.5 µs).
iso(rms)
, I
, t
O2P
PHL
: 4.0 kV)
: MAX. 0.4 A)
: MAX. 0.5 µs)
1
■ Agency approvals/Compliance
■ Applications
High Speed, Built-in Short
Protection Circuit, Gate Drive
SMD 14 pin
1. Recognized by UL1577, file No. E64380 (as model
2. Approved by VDE (VDE0884) (as an option) file No.
3. Package resin : UL flammability grade (94V-0)
1. Inverter
No. PC929)
94626 (as model No. PC929)
OPIC Photocoulper
Sheet No.: D2-A06302EN
PC929 Series
© SHARP Corporation
Date Mar. 26. 2004

Related parts for PC929PY

PC929PY Summary of contents

Page 1

PC929 Series ■ Description PC929 Series contains an IRED optically coupled to an OPIC chip packaged in a Mini-flat, Half pitch type (14 pin). Input-output isolation voltage(rms) is 4.0kV. High speed responce ( MAX. 0.5 ...

Page 2

... ∗ NC GND output High level Low level At operating protection function High level High level 2. SMT Gullwing Lead-Form (VDE0884 option) [ex. PC929PY] ±0.25 1.27 SHARP mark "S" ±0.3 7.62 Epoxy resin +0.4 +0.4 1.0 −0 −0 +0 10.0 −0.5 2 PC929 Series ∗ No. to pin shall be shorted in the device ...

Page 3

Date code (2 digit) 1st digit Year of production A.D. Mark A.D Mark 1990 A 2002 P 1991 B 2003 R 1992 C 2004 S 1993 D 2005 T 1994 E 2006 U 1995 F 2007 V 1996 H 2008 ...

Page 4

Absolute Maximum Ratings (unless otherwise specified T Parameter Symbol *1 Forward current Reverse voltage V R Supply voltage output current peak output current I 1 O1P O output ...

Page 5

Parameter *11 "Low→High" input threshold current Isolation resistance "Low→High" propagation delay time "High→Low" propagation delay time Rise time Fall time Instantaneous common mode rejection voltage (High level output) Instantaneous common mode rejection voltage (Low level output) *12 Overcurrent detection voltage ...

Page 6

... Package 50pcs/sleeve VDE0884 −−−−−− Approved Model No. PC929 PC929Y Please contact a local SHARP sales representative to inquire about production status and Lead-Free options. Taping 1 000pcs/reel −−−−−− Approved PC929P PC929PY 6 PC929 Series Sheet No.: D2-A06302EN ...

Page 7

Fig.1 Test Circuit for O Low Level Output 1 Voltage PC929 Fig.3 Test Circuit for O Low Level Output 2 Voltage PC929 V ...

Page 8

Fig.7 Test Circuit for Instantaneous Common Mode Rejection Voltage PC929 − waveform waveform ...

Page 9

Fig.11 Test Circuit for O Low Level 1 Error Signal Voltage PC929 FSL 8 Fig.13 Test Circuit for O "High→Low" Propagation 2 Delay Time at Overcurrent ...

Page 10

Fig.15 Forward Current vs. Ambient Temperature − Ambient temperature T Fig.17 Forward Current vs. Forward Voltage 100 25˚C 50˚C 70˚C 0.1 0.01 1.0 1.2 1.4 1.6 Forward ...

Page 11

Fig.21 O Low Level Output Voltage vs. 1 Ambient Temperature 0.20 0.15 0.10 I =0.1A O1 0.05 0.00 − Ambient temperature T Fig.23 O High Level Output Voltage vs. 2 Supply Voltage ...

Page 12

Fig.27 High Level Supply Current vs. Supply Voltage 16 T =−25˚ =25˚ =80˚ Supply voltage V Fig.29 Propagation Delay Time vs. Forward Current 1 . ...

Page 13

Fig.33 Error Signal "High-Low" Propagation Delay Time vs. Ambient Temperature 1.5 1.2 0.9 0.6 0.3 0 − Ambient temperature T Fig.35 Low Level Error Signal Voltage vs. Ambient Temperature 0.5 =24V =5mA F I ...

Page 14

Fig.39 Overcurrent Detecting Voltage - Supply Voltage Characteristics Test Circuit V Anode Cathode GND Fig.40 Example of The Application Circuit (IGBT Drive ...

Page 15

Fig.41 Operations of Shortcircuit Protector Circuit Anode 3 Cathode 1 Cathode 2 TTL, microcomputer, etc. 1. Detection of increase in V CE(sat) 2. Reduction of the IGBT gate voltage, and suppression of the collector current 3. Simultaneous output of signals ...

Page 16

Design Considerations ● Notes about static electricity Transistor of detector side in bipolar configuration may be damaged by static electricity due to its minute de- sign. When handling these devices, general countermeasure against static electricity should be taken to ...

Page 17

Degradation In general, the emission of the LED used in photocouplers will degrade over time. In the case of long term operation, please take the general LED degradation (50% degradation over 5years) into the design consideration. Please decide the ...

Page 18

Manufacturing Guidelines ● Soldering Method Reflow Soldering: Reflow soldering should follow the temperature profile shown below. Soldering should not exceed the curve of temperature profile and time. Please don't solder more than twice. (˚C) 300 Terminal : 260˚C peak ...

Page 19

Cleaning instructions Solvent cleaning: Solvent temperature should be 45˚C or below Immersion time should be 3minutes or less Ultrasonic cleaning: The impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning time, size ...

Page 20

Package specification ● Sleeve package Package materials Sleeve : HIPS (with anti-static material) Stopper : Styrene-Elastomer Package method MAX. 50 pcs. of products shall be packaged in a sleeve. Both ends shall be closed by tabbed and tabless stoppers. ...

Page 21

Tape and Reel package Package materials Carrier tape : A-PET (with anti-static material) Cover tape : PET (three layer system) Reel : PS Carrier tape structure and Dimensions F Dimensions List A ±0.3 16.0 7.5 H ±0.1 10.4 0.4 ...

Page 22

Important Notices · The circuit application examples in this publication are provided to explain representative applications of SHARP devices and are not intended to guarantee any circuit design or license any intellectual property rights. SHARP takes no responsibility for ...

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