MT47H32M16HR-25E IT:F TR Micron Technology Inc, MT47H32M16HR-25E IT:F TR Datasheet

MT47H32M16HR-25E IT:F TR

Manufacturer Part Number
MT47H32M16HR-25E IT:F TR
Description
Manufacturer
Micron Technology Inc
Type
DDR2 SDRAMr
Datasheet

Specifications of MT47H32M16HR-25E IT:F TR

Organization
32Mx16
Density
512Mb
Address Bus
15b
Access Time (max)
400ps
Maximum Clock Rate
800MHz
Operating Supply Voltage (typ)
1.8V
Package Type
FBGA
Operating Temp Range
-40C to 85C
Operating Supply Voltage (max)
1.9V
Operating Supply Voltage (min)
1.7V
Supply Current
295mA
Pin Count
84
Mounting
Surface Mount
Operating Temperature Classification
Industrial
Lead Free Status / Rohs Status
Compliant
DDR2 SDRAM
MT47H128M4 – 32 Meg x 4 x 4 banks
MT47H64M8 – 16 Meg x 8 x 4 banks
MT47H32M16 – 8 Meg x 16 x 4 banks
Features
• V
• JEDEC-standard 1.8V I/O (SSTL_18-compatible)
• Differential data strobe (DQS, DQS#) option
• 4n-bit prefetch architecture
• Duplicate output strobe (RDQS) option for x8
• DLL to align DQ and DQS transitions with CK
• 4 internal banks for concurrent operation
• Programmable CAS latency (CL)
• Posted CAS additive latency (AL)
• WRITE latency = READ latency - 1
• Selectable burst lengths: 4 or 8
• Adjustable data-output drive strength
• 64ms, 8192-cycle refresh
• On-die termination (ODT)
• Industrial temperature (IT) option
• Automotive temperature (AT) option
• RoHS-compliant
• Supports JEDEC clock jitter specification
PDF: 09005aef82f1e6e2
512MbDDR2.pdf - Rev. Q 10/10 EN
DD
= +1.8V ±0.1V, V
Products and specifications discussed herein are subject to change by Micron without notice.
DDQ
= +1.8V ±0.1V
t
CK
1
Options
• Configuration
• FBGA package (Pb-free) – x16
• FBGA package (Pb-free) – x4, x8
• FBGA package (lead solder) – x16
• FBGA package (lead solder) – x4, x8
• Timing – cycle time
• Self refresh
• Operating temperature
• Revision
– 128 Meg x 4 (32 Meg x 4 x 4 banks)
– 64 Meg x 8 (16 Meg x 8 x 4 banks)
– 32 Meg x 16 (8 Meg x 16 x 4 banks)
– 84-ball FBGA (8mm x 12.5mm) Rev. F, G
– 60-ball FBGA (8mm x 10mm) Rev. F, G
– 84-ball FBGA (8mm x 12.5mm) Rev. F, G
– 60-ball FBGA (8mm x 10mm) Rev. F, G
– 2.5ns @ CL = 5 (DDR2-800)
– 2.5ns @ CL = 6 (DDR2-800)
– 3.0ns @ CL = 4 (DDR2-667)
– 3.0ns @ CL = 5 (DDR2-667)
– 3.75ns @ CL = 4 (DDR2-533)
– Standard
– Low-power
– Commercial (0°C ≤ T
– Industrial (–40°C ≤ T
– Automotive (–40°C ≤ T
Note:
–40°C ≤ T
Micron Technology, Inc. reserves the right to change products or specifications without notice.
512Mb: x4, x8, x16 DDR2 SDRAM
1. Not all options listed can be combined to
1
define an offered product. Use the Part
Catalog Search on
product offerings and availability.
A
≤ 85°C)
C
C
≤ 95°C;
≤ 85°C)
C
© 2004 Micron Technology, Inc. All rights reserved.
, T
www.micron.com
A
≤ 105°C)
Features
Marking
128M4
32M16
for
64M8
None
None
:F/:G
-25E
-37E
HW
-3E
HR
-25
CF
AT
JN
-3
IT
L

Related parts for MT47H32M16HR-25E IT:F TR

MT47H32M16HR-25E IT:F TR Summary of contents

Page 1

... Commercial (0°C ≤ T – Industrial (–40°C ≤ T –40°C ≤ T – Automotive (–40°C ≤ T • Revision Note: 1 Micron Technology, Inc. reserves the right to change products or specifications without notice. 512Mb: x4, x8, x16 DDR2 SDRAM 1 ≤ 85°C) C ≤ 95°C; C ≤ 85°C) A ≤ ...

Page 2

... BA[1:0] (4) A[11, 9:0] (2K) Example Part Number: MT47H128M4B6-25E :D - Configuration Package Speed 128M4 64M8 32M16 -37E -3E -25 HW -25E JN 2 512Mb: x4, x8, x16 DDR2 SDRAM 800 800 667 800 667 n/a 667 n/a n/a n/a 32 Meg Meg banks 8K A[12:0] (8K) BA[1:0] (4) BA[1:0] (4) A[9:0] (1K) A[9:0] (1K) ...

Page 3

... Output Drive Strength ................................................................................................................................ 80 DQS# Enable/Disable ................................................................................................................................. 80 RDQS Enable/Disable ................................................................................................................................. 80 Output Enable/Disable ............................................................................................................................... 80 On-Die Termination (ODT) ........................................................................................................................ 81 PDF: 09005aef82f1e6e2 512MbDDR2.pdf - Rev. Q 10/10 EN 512Mb: x4, x8, x16 DDR2 SDRAM 3 Micron Technology, Inc. reserves the right to change products or specifications without notice. Features © 2004 Micron Technology, Inc. All rights reserved. ...

Page 4

... CKE Low Anytime ...................................................................................................................................... 123 ODT Timing .................................................................................................................................................. 125 MRS Command to ODT Update Delay ........................................................................................................ 127 PDF: 09005aef82f1e6e2 512MbDDR2.pdf - Rev. Q 10/10 EN 512Mb: x4, x8, x16 DDR2 SDRAM 4 Micron Technology, Inc. reserves the right to change products or specifications without notice. Features © 2004 Micron Technology, Inc. All rights reserved. ...

Page 5

... Figure 48: READ-to-WRITE ............................................................................................................................ 94 Figure 49: READ-to-PRECHARGE – ...................................................................................................... 95 Figure 50: READ-to-PRECHARGE – ...................................................................................................... 95 PDF: 09005aef82f1e6e2 512MbDDR2.pdf - Rev. Q 10/ .............................................................................................................. .............................................................................................................. ............................................................................................................. ............................................................................................................ 65 t RCD (MIN) .............................................................................. 88 5 512Mb: x4, x8, x16 DDR2 SDRAM Micron Technology, Inc. reserves the right to change products or specifications without notice. © 2004 Micron Technology, Inc. All rights reserved. Features ...

Page 6

... Rev. Q 10/ DQSQ, QH, and Data Valid Window .................................................. DQSQ, QH, and Data Valid Window ..................................................... 100 and DQSCK ......................................................................................... 101 6 512Mb: x4, x8, x16 DDR2 SDRAM Micron Technology, Inc. reserves the right to change products or specifications without notice. © 2004 Micron Technology, Inc. All rights reserved. Features ...

Page 7

... Table 41: Burst Definition .............................................................................................................................. 76 Table 42: READ Using Concurrent Auto Precharge ......................................................................................... 96 Table 43: WRITE Using Concurrent Auto Precharge ....................................................................................... 102 Table 44: Truth Table – CKE ......................................................................................................................... 117 PDF: 09005aef82f1e6e2 512MbDDR2.pdf - Rev. Q 10/ DS, DH Derating Values with Differential Strobe ............................................ 512Mb: x4, x8, x16 DDR2 SDRAM and IH) ................................................... and IH) .......................................... and DH ...

Page 8

... Bank active READ WRITE PRE, PRE_A Precharging identify all timing requirements or possible command restrictions such as multibank in- teraction, power down, entry/exit, etc. 8 512Mb: x4, x8, x16 DDR2 SDRAM State Diagram CKE_L Self refreshing REFRESH Refreshing Precharge power- down CKE_L ACT = ACTIVATE ...

Page 9

... I/O balls. A bidirectional data strobe (DQS, DQS#) is transmitted externally, along with data, for use in data capture at the receiver. DQS is a strobe transmitted by the DDR2 SDRAM during READs and by the memory controller during WRITEs. DQS is edge-aligned with data for READs and center-aligned with data for WRITEs. The x16 offering has two data strobes, one for the lower byte (LDQS, LDQS#) and one for the upper byte (UDQS, UDQS#). The DDR2 SDRAM operates from a differential clock (CK and CK#) ...

Page 10

... Any specific requirement takes precedence over a general statement. PDF: 09005aef82f1e6e2 512MbDDR2.pdf - Rev. Q 10/10 EN 512Mb: x4, x8, x16 DDR2 SDRAM Functional Description 10 Micron Technology, Inc. reserves the right to change products or specifications without notice. exceeds C is < ...

Page 11

... Functional Block Diagrams The DDR2 SDRAM is a high-speed CMOS, dynamic random access memory inter- nally configured as a multibank DRAM. Figure 3: 128 Meg x 4 Functional Block Diagram ODT Control CKE CK logic CK# CS# RAS# CAS# WE# Refresh 14 Mode Row- counter registers address MUX 16 14 ...

Page 12

... DM mask logic Write control logic 256 64 (x64) drivers Internal Column CK out CK, CK# decoder Column- 8 address 2 counter/ latch COL0, COL1 12 512Mb: x4, x8, x16 DDR2 SDRAM Functional Block Diagrams ODT control sw1 sw2 CK, CK# sw3 COL0, COL1 8 DLL 8 sw1 sw2 sw3 8 MUX DRVRS Data 8 ...

Page 13

... V NF, RDQS#/ DM, DM/RDQS SSQ DQ1 V DDQ V DQ3 SSQ V V REF SS CKE WE# BA0 BA1 A10 A12 RFU 13 512Mb: x4, x8, x16 DDR2 SDRAM Ball Assignments and Descriptions DQS#/NU V SSQ DDQ DQS V NF, DQ7 SSQ V DQ0 V DDQ DDQ DQ2 V NF, DQ5 SSQ SSDL DD ...

Page 14

... V DDQ V DQ3 SSQ V V REF SS CKE WE# BA0 BA1 A10 A12 RFU 14 Micron Technology, Inc. reserves the right to change products or specifications without notice. 512Mb: x4, x8, x16 DDR2 SDRAM UDQS#/NU V SSQ DDQ UDQS V DQ15 SSQ V DQ8 V DDQ DDQ DQ10 V DQ13 SSQ V LDQS#/NU ...

Page 15

... Input On-die termination: ODT (registered HIGH) enables termination resistance internal to the DDR2 SDRAM. When enabled, ODT is only applied to each of the following balls: DQ[15:0], LDM, UDM, LDQS, LDQS#, UDQS, and UDQS# for the x16; DQ[7:0], DQS, DQS#, RDQS, RDQS#, and DM for the x8; DQ[3:0], DQS, DQS#, and DM for the x4. The ODT input will be ignored if disabled via the LOAD MODE command ...

Page 16

... DQS#; x4 and A8 = NU. If EMR(E10 x16 and E8 = NU; x8 and A8 = NU; x4 and A8 = NU. – RFU Reserved for future use: Bank address BA2, row address bits A13 (x16 only), A14, and A15. PDF: 09005aef82f1e6e2 512MbDDR2.pdf - Rev. Q 10/10 EN 512Mb: x4, x8, x16 DDR2 SDRAM Ball Assignments and Descriptions /2). DDQ and SSQ 16 Micron Technology, Inc ...

Page 17

... F G 12.5 ±0 0.8 TYP 6.4 CTR 8 ±0.1 Pb, 2% Ag). 17 512Mb: x4, x8, x16 DDR2 SDRAM Ball A1 ID 1.2 MAX 0.25 MIN Micron Technology, Inc. reserves the right to change products or specifications without notice. © 2004 Micron Technology, Inc. All rights reserved. Packaging ...

Page 18

... CTR Ball ±0 0.8 TYP 6.4 CTR 8 ±0.1 Pb, 2% Ag). 18 512Mb: x4, x8, x16 DDR2 SDRAM Ball A1 ID 1.2 MAX 0.25 MIN Micron Technology, Inc. reserves the right to change products or specifications without notice. © 2004 Micron Technology, Inc. All rights reserved. Packaging ...

Page 19

... DIO = +1.8V ±0.1V MHz 25° / OUT(DC) DDQ with I/O balls, reflecting the fact that they are matched in loading. any given device. 19 512Mb: x4, x8, x16 DDR2 SDRAM Min Max Units 1.0 2.0 pF – 0.25 pF 1.0 2.0 pF – 0.25 pF 2.5 4.0 pF – 0 +1.8V ± ...

Page 20

... TN-00-08, “Thermal Applications,” prior to using the thermal impedances listed in Table 7. For designs that are expected to last several years and require the flexi- bility to use several DRAM die shrinks, consider using final target theta values (rather than existing values) to account for increased thermal impedances from the die size re- duction. The DDR2 SDRAM device’ ...

Page 21

... Length (L) 0.5 (L) 0.5 (W) Width (W) Lmm x Wmm FBGA Θ JA (°C/W) Θ JA (°C/W) Airflow = 0m/s Airflow = 1m/s 71.4 54.1 53.6 44.5 65.8 50.4 50.0 41.3 21 512Mb: x4, x8, x16 DDR2 SDRAM Min Max Units –55 150 ° °C –40 95 °C –40 85 °C –40 105 ° ...

Page 22

... Airflow = 1m/s 94.2 76.5 76.4 66.9 88.8 71.3 71.4 62.1 be viewed as a typical number. 22 512Mb: x4, x8, x16 DDR2 SDRAM Θ JA (°C/W) Airflow = 2m/s Θ JB (°C/W) Θ JC (°C/W) 70.1 57.3 63.1 56.5 65.6 52.5 58.7 52.0 Micron Technology, Inc. reserves the right to change products or specifications without notice. ...

Page 23

... A0 RA0 RA1 RA2 RA3 active read auto precharge deselect. Notes: 2. All banks are being interleaved at 3. Control and address bus inputs are stable during DESELECTs. PDF: 09005aef82f1e6e2 512MbDDR2.pdf - Rev. Q 10/10 EN 512Mb: x4, x8, x16 DDR2 SDRAM Electrical Specifications – I Parameters DD -25E -25 -3E ...

Page 24

... DD2N x16 I Fast PDN exit DD3Pf MR12 = 0 I Slow PDN exit DD3Ps MR12 = 1 I x4, x8 DD3N x16 DD I x4, x8 DD4W x16 t RAS 24 512Mb: x4, x8, x16 DDR2 SDRAM DD -25E/ -25 -3E/-3 -37E 100 90 80 135 120 110 115 105 95 165 150 135 ...

Page 25

... DQ signals, not including masks or strobes , I , and I require A12 in EMR1 to be enabled during testing. DD1 DD4R DD7 values must be derated (I DD tion devices when operated outside of the range 0°C ≤ 512Mb: x4, x8, x16 DDR2 SDRAM -25E/ -25 -3E/-3 -37E 205 180 145 275 235 195 ...

Page 26

... DD2N DD2Q ≥ 85° 2%; I must be derated by 20 DD2P C 30%; and I must be derated by 80% (I DD6 T < 85°C and the 2X refresh option is still enabled 512Mb: x4, x8, x16 DDR2 SDRAM DD and I DD4R DD5W must be derated by 7% DD7 , and I DD3N DD3P(FAST) DD4R DD4W DD5W ...

Page 27

... DD1 x16 CKE DD I x4, x8, x16 DD2P I x4, x8 DD2Q x16 I x4, x8 DD2N x16 I Fast PDN exit DD3Pf MR12 = 0 I Slow PDN exit DD3Ps MR12 = 1 I x4, x8 DD3N x16 DD I x4, x8 DD4W x16 t RAS 27 512Mb: x4, x8, x16 DDR2 SDRAM DD -25E/ -25 -3E/-3 -37E ...

Page 28

... DQ signals, not including masks or strobes , I , and I require A12 in EMR1 to be enabled during testing. DD1 DD4R DD7 values must be derated (I DD tion devices when operated outside of the range 0°C ≤ 512Mb: x4, x8, x16 DDR2 SDRAM -25E/ -25 -3E/-3 -37E 120 110 95 150 125 110 ...

Page 29

... DD2N DD2Q ≥ 85° 2%; I must be derated by 20 DD2P C 30%; and I must be derated by 80% (I DD6 T < 85°C and the 2X refresh option is still enabled 512Mb: x4, x8, x16 DDR2 SDRAM DD and I DD4R DD5W must be derated by 7% DD7 , and I DD3N DD3P(FAST) DD4R DD4W DD5W ...

Page 30

AC Timing Operating Specifications Table 12: AC Operating Specifications and Conditions Not all speed grades listed may be supported for this device; refer to the title page for speeds supported; Notes: 1–5 apply to the entire table +1.8V ...

Page 31

Table 12: AC Operating Specifications and Conditions (Continued) Not all speed grades listed may be supported for this device; refer to the title page for speeds supported; Notes: 1–5 apply to the entire table +1.8V ±0.1V ...

Page 32

Table 12: AC Operating Specifications and Conditions (Continued) Not all speed grades listed may be supported for this device; refer to the title page for speeds supported; Notes: 1–5 apply to the entire table +1.8V ±0.1V ...

Page 33

Table 12: AC Operating Specifications and Conditions (Continued) Not all speed grades listed may be supported for this device; refer to the title page for speeds supported; Notes: 1–5 apply to the entire table +1.8V ±0.1V ...

Page 34

Table 12: AC Operating Specifications and Conditions (Continued) Not all speed grades listed may be supported for this device; refer to the title page for speeds supported; Notes: 1–5 apply to the entire table +1.8V ±0.1V ...

Page 35

Table 12: AC Operating Specifications and Conditions (Continued) Not all speed grades listed may be supported for this device; refer to the title page for speeds supported; Notes: 1–5 apply to the entire table +1.8V ±0.1V ...

Page 36

Table 12: AC Operating Specifications and Conditions (Continued) Not all speed grades listed may be supported for this device; refer to the title page for speeds supported; Notes: 1–5 apply to the entire table +1.8V ±0.1V ...

Page 37

All voltages are referenced to V Notes Tests for AC timing and electrical AC and DC characteristics may be conducted at nominal reference/supply DD voltage levels, but the related specifications and the operation of the ...

Page 38

... The inputs to the DRAM must be aligned to the associated clock, that is, the actual clock that latches it in. Howev- er, the input timing (in ns) references to the following input parameters are determined by taking the specified percentage times the CK: IPW, DIPW, DQSS, DQSH, DQSL, 19. The DRAM output timing is aligned to the nominal or average clock. Most output parameters must be derated by the actual jitter error when input clock jitter is present ...

Page 39

... PRECHARGE command can be issued. A 4-bit prefetch is when the READ command internally latches the READ so that data will output CL later. This parameter is only applicable when t cies faster than 533 MHz when RTP = 7.5ns satisfied as well. The DDR2 SDRAM will automatically delay the internal PRECHARGE command until (MIN) has been satisfied ...

Page 40

The half-clock of AOFD’s 2.5 CK assumes a 50/50 clock duty cycle. This half-clock value must be derated by the amount of half-clock duty cycle error. For example, if the clock duty cycle was 47/53, t 0.03, ...

Page 41

... DC value. Peak-to-peak AC noise This measurement taken at the nearest V REF(DC) is not applied directly to the device resistors, is expected to be set equal REF 41 512Mb: x4, x8, x16 DDR2 SDRAM AC and DC Operating Conditions Nom Max 1.8 1.9 1.8 1.9 1.8 1.9 0.50 × V 0.51 × ...

Page 42

... Measure voltage (VM) at tested ball with no load. PDF: 09005aef82f1e6e2 512MbDDR2.pdf - Rev. Q 10/ DDQ and R are determined by separately applying V TT1(EFF) TT2(EFF) being tested, and then measuring current, I(V between –40°C and 0° 512Mb: x4, x8, x16 DDR2 SDRAM ODT DC Electrical Characteristics Symbol Min Nom Max TT1(EFF) R 120 150 ...

Page 43

... Note: PDF: 09005aef82f1e6e2 512MbDDR2.pdf - Rev. Q 10/10 EN Input Electrical Characteristics and Operating Conditions Symbol V V IH(DC) V IL(DC) + 300mV allowed provided 1.9V is not exceeded. DDQ Symbol 512Mb: x4, x8, x16 DDR2 SDRAM Min Max 1 + 125 V REF(DC) DDQ –300 V - 125 REF(DC) Min Max V + 250 V IH(AC) ...

Page 44

... DQS) level and V is expected to be approximately 0.5 × 300mV allowed provided 1.9V is not exceeded. DDQ X X RDQS#, LDQS#, and UDQS# signals. V /2. DDQ ID(DC)min 44 512Mb: x4, x8, x16 DDR2 SDRAM Max V DDQ V DDQ V DDQ - 175 0.50 × 175 DDQ ...

Page 45

... Numbers in diagram reflect nominal values (V PDF: 09005aef82f1e6e2 512MbDDR2.pdf - Rev. Q 10/10 EN Input Electrical Characteristics and Operating Conditions 45 Micron Technology, Inc. reserves the right to change products or specifications without notice. 512Mb: x4, x8, x16 DDR2 SDRAM = 1.8V). DDQ © 2004 Micron Technology, Inc. All rights reserved. ...

Page 46

... SSTL_18 receiver. The actual current val- IL,max ues are derived by shifting the desired driver operating point (see output IV curves) along a 21Ω load line to define a convenient driver current for measurement. 46 512Mb: x4, x8, x16 DDR2 SDRAM Max - 125 0.50 × 125 ...

Page 47

... V teed by design and characterization. 40°C and 0° DDQ 25Ω Reference point ) 47 512Mb: x4, x8, x16 DDR2 SDRAM Nom Max – 4 – +1.8V ±0.1V +1.8V ±0.1V. DDQ DD must be less than 23.4Ω for values of V must be less than 23.4Ω for values ...

Page 48

... DDR2 SDRAM Output Driver Characteristics 1.5 Nom 0.00 5.63 11.30 16.52 22.19 27.59 32.39 36.45 40.38 44.01 47.01 49.63 51.71 53.32 54 ...

Page 49

... DDR2 SDRAM Output Driver Characteristics 1.5 Nom 0.00 –5.63 –11.30 –16.52 –22.19 –27.59 –32.39 –36.45 –40.38 –44.01 –47.01 –49.63 –51.71 –53.32 – ...

Page 50

... DDR2 SDRAM Output Driver Characteristics 1.5 Nom 0.00 2.98 5.99 8.75 11.76 14.62 17.17 19.32 21.40 23.32 24.92 26.30 27.41 28.26 29 ...

Page 51

... DDR2 SDRAM Output Driver Characteristics 1.5 Nom 0.00 –2.98 –5.99 –8.75 –11.76 –14.62 –17.17 –19.32 –21.40 –23.32 –24.92 –26.30 –27.41 –28.26 – ...

Page 52

... Voltage Across Clamp (V) 52 512Mb: x4, x8, x16 DDR2 SDRAM Minimum Ground Clamp Current (mA) 0.0 0.0 0.0 0.0 0.0 ...

Page 53

... Figure 20) 0.19 Vns DDQ (see Figure 21) 0.19 Vns SSQ Maximum amplitude DDQ SSQ Time (ns) SSQ Maximum amplitude Time (ns) 53 512Mb: x4, x8, x16 DDR2 SDRAM Specification -25/-25E -3/-3E 0.50V 0.50V 0.50V 0.50V 0.50V 0.50V 0.66 Vns 0.80 Vns 0.66 Vns 0.80 Vns ...

Page 54

... AC level: 2 × × V IL(DC the falling edge. For example, the CK/CK# would be –250mV to +500mV for IH(DC) CK rising edge and would be +250mV to –500mV for CK falling edge. 54 512Mb: x4, x8, x16 DDR2 SDRAM Min Max Units See Note 2 See Note 5 V × 0.49 V × ...

Page 55

... REF(DC) level is used for the derating value (Figure 25 (page 59)). REF(DC the time of the rising clock transition), a valid IH[AC] IL[AC] 55 512Mb: x4, x8, x16 DDR2 SDRAM Input Slew Rate Derating t IH (hold time) required is calculated IH (base) value to the Δ IS and Δ (base) + Δ ...

Page 56

... PDF: 09005aef82f1e6e2 512MbDDR2.pdf - Rev. Q 10/10 EN 512Mb: x4, x8, x16 DDR2 SDRAM Input Slew Rate Derating and IH) CK, CK# Differential Slew Rate 2.0 V/ns 1.5 V/ns Δ Δ Δ Δ ...

Page 57

... DDR2 SDRAM Input Slew Rate Derating and IH) 1.0 V/ns Δ Δ +210 +154 +203 +149 +193 +143 +180 ...

Page 58

... IL(AC)max = rising signal Δ REF Nominal region line Tangent line Nominal line ΔTF SS Setup slew rate = rising signal 58 512Mb: x4, x8, x16 DDR2 SDRAM Input Slew Rate Derating Nominal slew rate REF region Δ IH(AC)min REF(DC) = Δ Tangent line REF region ΔTR ...

Page 59

... DDQ REF region Tangent line Nominal V SS ΔTR Tangent line ( Hold slew rate REF[DC] IL[DC]max = falling signal ΔTR 59 512Mb: x4, x8, x16 DDR2 SDRAM Input Slew Rate Derating Nominal slew rate REF region Δ Nominal line Tangent line REF line region ΔTF ...

Page 60

... AC/DC trip points to DQ referenced to V Table 36 (page 63). Table 35 provides the and DH ) for DDR2-533. Table 36 provides the the and DH ) for DDR2-400 512Mb: x4, x8, x16 DDR2 SDRAM Input Slew Rate Derating 1.4 V/ns 1.2 V/ns 1.0 V/ns Δ Δ Δ Δ Δ – ...

Page 61

... Converting the derated base values from DQ referenced the AC/DC trip points to DQ referenced to V ble 34 provides the V -based fully derated values for the DQ ( REF 61 512Mb: x4, x8, x16 DDR2 SDRAM Input Slew Rate Derating 1.4 V/ns 1.2 V/ns 1.0 V/ns Δ Δ Δ ...

Page 62

... DDR2 SDRAM Input Slew Rate Derating and and DH -specified values REF 1.0 V/ns 0.8 V/ns 0.6 V/ns ...

Page 63

... Micron Technology, Inc. reserves the right to change products or specifications without notice. 512Mb: x4, x8, x16 DDR2 SDRAM Input Slew Rate Derating ) at DDR2-533 REF ) REF 1.0 V/ns 0.8 V/ns 0.6 V/ ...

Page 64

... Tangent line Tangent line Nominal line ΔTF ΔTR Tangent line ( Tangent line (V REF[DC] IL[AC]max Setup slew rate = = rising signal ΔTF 64 512Mb: x4, x8, x16 DDR2 SDRAM Input Slew Rate Derating Nominal slew rate REF region IH(AC)min REF(DC) = ΔTR and V IL(DC)max IH(DC)min ...

Page 65

... IS DDQ REF region Tangent line Nominal V SS ΔTR Tangent line ( REF[DC] IL[DC]max Hold slew rate = ΔTR falling signal 65 512Mb: x4, x8, x16 DDR2 SDRAM Input Slew Rate Derating Nominal slew rate REF region Δ IH(DC)min REF(DC) = ΔTF and V IL(DC)max IH(DC)min Nominal ...

Page 66

... Figure 30: AC Input Test Signal Waveform Command/Address Balls Logic levels V levels REF Figure 31: AC Input Test Signal Waveform for Data with DQS, DQS# (Differential) Logic levels V levels REF PDF: 09005aef82f1e6e2 512MbDDR2.pdf - Rev. Q 10/10 EN 512Mb: x4, x8, x16 DDR2 SDRAM CK DQS# DQS t DS ...

Page 67

... Figure 32: AC Input Test Signal Waveform for Data with DQS (Single-Ended) Logic levels V levels REF Figure 33: AC Input Test Signal Waveform (Differential PDF: 09005aef82f1e6e2 512MbDDR2.pdf - Rev. Q 10/10 EN 512Mb: x4, x8, x16 DDR2 SDRAM DQS DDQ Crossing point Vswing SSQ 67 Micron Technology, Inc. reserves the right to change products or specifications without notice. ...

Page 68

... H Power-down exit L 1. All DDR2 SDRAM commands are defined by states of CS#, RAS#, CAS#, WE#, and CKE at Notes: 2. The state of ODT does not affect the states described in this table. The ODT function is 3. “X” means “H or L” (but a defined logic level) for valid I 4. BA2 is only applicable for densities ≥ ...

Page 69

... Issue DESELECT or NOP commands, or allowable commands to the other bank, on any clock edge occurring during these states. Allowable commands to the other bank are determined by its current state and this table, and according to Table 39 (page 71). 69 512Mb: x4, x8, x16 DDR2 SDRAM Command/Action t RP has been met, and any READ burst is com- t RCD has been met ...

Page 70

... NOP commands must be applied on each positive clock edge during these states): Refresh: Starts with registration of a REFRESH command and ends when t met. After RFC is met, the DDR2 SDRAM will be in the all banks idle state. Accessing Starts with registration of the LOAD MODE command and ends when t mode MRD has been met ...

Page 71

... A READ burst has been initiated with auto precharge disabled and has not yet terminated. Write: A WRITE burst has been initiated with auto precharge disabled and has not yet terminated. 71 512Mb: x4, x8, x16 DDR2 SDRAM Command/Action t RP has been met, and any READ t RCD has been met. ...

Page 72

... WRITE or WRITE with auto precharge DESELECT The DESELECT function (CS# HIGH) prevents new commands from being executed by the DDR2 SDRAM. The DDR2 SDRAM is effectively deselected. Operations already in progress are not affected. DESELECT is also referred to as COMMAND INHIBIT. PDF: 09005aef82f1e6e2 512MbDDR2.pdf - Rev. Q 10/10 EN ...

Page 73

... If auto precharge is selected, the row being accessed will be pre- charged at the end of the WRITE burst; if auto precharge is not selected, the row will remain open for subsequent accesses. DDR2 SDRAM also supports the AL feature, which allows a READ or WRITE command to be issued prior to command to the internal device by AL clock cycles. ...

Page 74

... Mode Register (MR) The mode register is used to define the specific mode of operation of the DDR2 SDRAM. This definition includes the selection of a burst length, burst type, CAS latency, operat- ing mode, DLL RESET, write recovery, and power-down mode, as shown in Figure 34 (page 75) ...

Page 75

... Burst Length Burst length is defined by bits M0–M2, as shown in Figure 34. Read and write accesses to the DDR2 SDRAM are burst-oriented, with the burst length being programmable to either four or eight. The burst length determines the maximum number of column loca- tions that can be accessed for a given READ or WRITE command. ...

Page 76

... Figure 34 (page 75). When bit M7 is “1,” no other bits of the mode register are programmed. Programming bit M7 to “1” places the DDR2 SDRAM into a test mode that is only used by the manufacturer and should not be used. No operation or functionality is guaranteed if M7 bit is “1.” ...

Page 77

... Write Recovery Write recovery (WR) time is defined by bits M9–M11, as shown in Figure 34 (page 75). The WR register is used by the DDR2 SDRAM during WRITE with auto precharge opera- tion. During WRITE with auto precharge operation, the DDR2 SDRAM delays the inter- nal auto precharge operation by WR clocks (programmed in bits M9–M11) from the last data burst. An example of WRITE with auto precharge is shown in Figure 63 (page 109). WR values clocks may be used for programming bits M9– ...

Page 78

... DDR2 SDRAM also supports a feature called posted CAS additive latency (AL). This fea- ture allows the READ command to be issued prior to internal command to the DDR2 SDRAM by AL clocks. The AL feature is described in further detail in Posted CAS Additive Latency (AL) (page 81). Examples and are shown in Figure 35; both assume READ command is registered at clock edge n, and the clocks, the data will be available nominally coincident with clock edge (this assumes ...

Page 79

... OCD operation, all three bits must be set to “1” for the OCD default state, then set to “0” before initialization is finished. 79 512Mb: x4, x8, x16 DDR2 SDRAM Extended Mode Register (EMR) t MRD before initiating any subsequent opera- ...

Page 80

... The output disable feature is intended to be used during I characterization of read current. PDF: 09005aef82f1e6e2 512MbDDR2.pdf - Rev. Q 10/ DQSCK parameters. 80 Micron Technology, Inc. reserves the right to change products or specifications without notice. 512Mb: x4, x8, x16 DDR2 SDRAM Extended Mode Register (EMR) © 2004 Micron Technology, Inc. All rights reserved. DD ...

Page 81

... In this operation, the DDR2 SDRAM allows a READ or WRITE command to be issued prior to using this feature would set held for the time of the AL before it is issued internally to the DDR2 SDRAM device controlled by the sum of AL and CL CL. WRITE latency (WL) is equal to RL minus one clock × ...

Page 82

... ACTIVE n WRITE n Command DQS, DQS Notes PDF: 09005aef82f1e6e2 512MbDDR2.pdf - Rev. Q 10/ NOP NOP NOP AC, DQSCK, and T2 T3 NOP NOP t RCD (MIN 512Mb: x4, x8, x16 DDR2 SDRAM Extended Mode Register (EMR NOP NOP NOP Transitioning Data t DQSQ NOP NOP NOP Transitioning Data Micron Technology, Inc. reserves the right to change products or specifications without notice. © ...

Page 83

... Extended mode register (EMR2) Extended mode register (EMR3) grammed to “0.” served for future use and must be programmed to “0.” 83 512Mb: x4, x8, x16 DDR2 SDRAM Extended Mode Register 2 (EMR2) t MRD before initiating any subsequent opera Address bus ...

Page 84

... Extended mode register (EMR) Extended mode register (EMR2) Extended mode register (EMR3) programmed to “0.” served for future use and must be programmed to “0.” 84 512Mb: x4, x8, x16 DDR2 SDRAM Extended Mode Register 3 (EMR3) t MRD before initiating any subsequent opera Address bus ...

Page 85

... Initialization Figure 41: DDR2 Power-Up and Initialization DDR2 SDRAM must be powered up and initialized in a predefined manner. Operational procedures other than those specified may result in unde- fined operation. Figure 41 illustrates, and the notes outline, the sequence required for power-up and initialization DDL V VTD 1 ...

Page 86

... TT to the ODT ball (all other inputs may be undefined; I/Os and outputs must be less than V during voltage ramp time to avoid DDR2 SDRAM device latch-up). V DDQ plied directly to the device; however, least one of the following two sets of conditions ( must be met to obtain a stable ...

Page 87

... Issue a LOAD MODE command to the EMR to enable OCD default by setting bits E7, E8, 13. Issue a LOAD MODE command to the EMR to enable OCD exit by setting bits E7, E8, and 14. The DDR2 SDRAM is now initialized and ready for normal operation 200 clock cycles af- 15. DM represents DM for the x4, x8 configurations and UDM, LDM for the x16 configura- 16 ...

Page 88

... ACTIVATE Before any READ or WRITE commands can be issued to a bank within the DDR2 SDRAM, a row in that bank must be opened (activated), even when additive latency is used. This is accomplished via the ACTIVATE command, which selects both the bank and the row to be activated. ...

Page 89

... READ Row Col Row Col Bank b Bank b Bank c Bank c t FAW (MIN 3.75ns FAW (MIN) = 37.5ns. 89 512Mb: x4, x8, x16 DDR2 SDRAM ACT READ NOP NOP Row Col Bank d Bank d t RRD (MIN) = 7.5ns, Micron Technology, Inc. reserves the right to change products or specifications without notice. ...

Page 90

... READ burst as long as the interruption occurs on a 4-bit boundary due to the 4n prefetch architecture of DDR2 SDRAM. As shown in Figure 47 (page 94), READ burst operations may not be interrupted or truncated with any other command except another READ com- mand ...

Page 91

... READ NOP NOP Bank a, Col ( READ NOP NOP Bank a, Col ( AC, DQSCK, and 91 512Mb: x4, x8, x16 DDR2 SDRAM T3 T3n T4 T4n NOP NOP T4n NOP NOP T3n T4 T4n NOP NOP DO n Transitioning Data t DQSQ. Micron Technology, Inc. reserves the right to change products or specifications without notice. ...

Page 92

... READ Bank, Bank, Col n Col b t CCD READ NOP READ Bank, Bank, Col n Col b t CCD AC, DQSCK, and 92 512Mb: x4, x8, x16 DDR2 SDRAM T5n T3 T3n T4 T4n T5 NOP NOP NOP T5n T2n T3 T3n T4 T4n T5 NOP NOP NOP DO n Transitioning Data t DQSQ. Micron Technology, Inc. reserves the right to change products or specifications without notice. ...

Page 93

... NOP READ Bank, Bank, Col n Col READ NOP NOP READ Bank, Bank, Col n Col AC, DQSCK, and tive READs. 93 512Mb: x4, x8, x16 DDR2 SDRAM T3n T4 T4n T5 T6 T6n T7 NOP NOP NOP NOP T4n T5 T5n NOP NOP NOP NOP DO n Transitioning Data t DQSQ. ...

Page 94

... T2 can be either same bank or different bank). terrupting READ command NOP NOP WRITE AC, DQSCK, and t RTP is the minimum time from the rising clock edge that initiates the last 4-bit 94 512Mb: x4, x8, x16 DDR2 SDRAM Valid Valid Valid Transitioning Data t CK from previous READ. ...

Page 95

... READ NOP NOP NOP AL + BL/2 - 2CK + MAX ( t RTP 2CK) Bank ≥t RAS (MIN) ≥t RC (MIN) t RTP ≥ 2 clocks AC, DQSCK, and 95 512Mb: x4, x8, x16 DDR2 SDRAM NOP NOP ACT Bank a Valid ≥ (MIN) Transitioning Data Don’t Care t DQSQ NOP PRE ...

Page 96

... READ with Auto Precharge If A10 is high when a READ command is issued, the READ with auto precharge function is engaged. The DDR2 SDRAM starts an auto precharge operation on the rising clock edge that (BL/2) cycles later than the read with auto precharge command provi- t ded edge, the start point of the auto precharge operation will be delayed until satisfied ...

Page 97

... CK NOP 1 NOP 1 READ 2 Col n 5 Bank x t RCD RAS these times. but to when the device begins to drive or no longer drives, respectively. order. 97 512Mb: x4, x8, x16 DDR2 SDRAM T7n T8 NOP 1 PRE 3 NOP 1 NOP 1 t RTP 4 All banks One bank Bank DQSCK (MIN) ...

Page 98

... NOP commands are shown for ease of illustration; other commands may be valid at Notes ( the case shown. 3. The DDR2 SDRAM internally delays auto precharge until both 4. Enable auto precharge. 5. I/O balls, when entering or exiting High-Z, are not referenced to a specific voltage level data-out from column n; subsequent elements are applied in the programmed PDF: 09005aef82f1e6e2 512MbDDR2 ...

Page 99

... DQSQ is derived at each DQS clock edge, is not cumulative over time, begins with DQS transitions, and ends with the last valid transition of DQ. T2 and at T2n are “early DQS,” are “nominal DQS,” and at T3n are “late DQS.” derived from HP 512Mb: x4, x8, x16 DDR2 SDRAM T2n T3 T3n DQSQ 2 t DQSQ 2 t DQSQ ...

Page 100

... CH clock transitions collectively when a bank is active. t DQSQ is derived at each DQS clock edge, is not cumulative over time, begins with DQS transitions, and ends with the last valid transition of DQ. lower byte, and UDQS defines the upper byte. 100 512Mb: x4, x8, x16 DDR2 SDRAM T3 T3n ...

Page 101

... I/O balls, when entering or exiting High-Z, are not referenced to a specific voltage level, WRITE WRITE bursts are initiated with a WRITE command. DDR2 SDRAM uses WL equal to RL minus one clock cycle ( 1CK) (see READ (page 73)). The starting column and bank addresses are provided with the WRITE command, and auto precharge is either enabled or disabled for that access ...

Page 102

... WRITE burst as long as the interruption occurs on a 4-bit boundary due to the 4n-prefetch architec- ture of DDR2 SDRAM. WRITE burst operations may not be interrupted or truncated with any command except another WRITE command, as shown in Figure 59 (page 105). ...

Page 103

... Rev. Q 10/ CK# CK WRITE NOP Bank a, Col b WL ± t DQSS DQSS DQSS 103 512Mb: x4, x8, x16 DDR2 SDRAM T2 T2n T3 T3n T4 NOP NOP NOP DQSS DQSS Transitioning Data Don’t Care t DQSS. Micron Technology, Inc. reserves the right to change products or specifications without notice. ...

Page 104

... Bank, Bank, Col b Col n WL ± DQSS CK# CK WRITE NOP NOP Bank, Col b WL ± t DQSS 104 512Mb: x4, x8, x16 DDR2 SDRAM T2n T3 T3n T4 T4n T5 T5n NOP NOP NOP Transitioning Data t DQSS. T2n T3 T3n T4 T4n T5 T5n WRITE NOP NOP Bank, Col n ...

Page 105

... NOP 2 Valid 5 Valid issued to banks used for WRITEs at T0 and T2. starts with T7 and not T5 (because from MR and not the truncated length and T2 can be either same bank or different bank). terrupting WRITE command. 105 512Mb: x4, x8, x16 DDR2 SDRAM NOP 2 NOP 2 Valid 4 Valid ...

Page 106

... WTR is required for any READ following a WRITE to the same device, but it is not re- quired between module ranks. t WTR is referenced from the first positive CK edge after the last data-in pair. greater. 106 512Mb: x4, x8, x16 DDR2 SDRAM NOP READ NOP NOP ...

Page 107

... referenced from the first positive CK edge after the last data-in pair. and WRITE commands may be to different banks, in which case the PRECHARGE command could be applied earlier. 107 512Mb: x4, x8, x16 DDR2 SDRAM NOP NOP NOP t WR Transitioning Data t DQSS not required and Micron Technology, Inc. reserves the right to change products or specifications without notice. © ...

Page 108

... Bank x t RCD ± t DQSS (NOM) these times DSH is applicable during DQSS (MIN) and is referenced from T6 DSS is applicable during DQSS (MAX) and is referenced from T7. 108 512Mb: x4, x8, x16 DDR2 SDRAM T5 T5n T6 T6n T7 T8 NOP 1 NOP 1 NOP 1 NOP RAS 5 t DQSL t DQSH t WPST ...

Page 109

... WL ± t DQSS (NOM) t WPRE these times. rounding up to the next integer value DSH is applicable during DQSS (MIN) and is referenced from T6 DSS is applicable during DQSS (MAX) and is referenced from T7. 109 512Mb: x4, x8, x16 DDR2 SDRAM T5 T5n T6 T6n T7 T8 NOP 1 NOP 1 NOP 1 NOP RAS ...

Page 110

... WR starts at the end of the data burst regardless of the data mask condition DSH is applicable during DQSS (MIN) and is referenced from T7 DSS is applicable during DQSS (MAX) and is referenced from T8. 110 512Mb: x4, x8, x16 DDR2 SDRAM T9 T6 T6n T7 T7n T8 NOP 1 NOP 1 NOP RAS ...

Page 111

... DSH (MIN) generally occurs during t DSS (MIN) generally occurs during t RP timing applies. When the PRECHARGE (ALL) com- t RPA timing applies, regardless of the number of banks opened. 111 512Mb: x4, x8, x16 DDR2 SDRAM T3 T3n T4 t DSS 2 t DSH 1 t DSS DQSL t DQSH ...

Page 112

... REFRESH The commercial temperature DDR2 SDRAM requires REFRESH cycles at an average in- terval of 7.8125µs (MAX) and all rows in all banks must be refreshed at least once every 64ms. The refresh period begins when the REFRESH command is registered and ends t RFC (MIN) later. The average interval must be reduced to 3.9µs (MAX) when T ceeds +85° ...

Page 113

... First, the differential clock must be stable and meet prior to CKE going back to HIGH. Once CKE is HIGH ( with three clock registrations), the DDR2 SDRAM must have NOP or DESELECT com- mands issued for ments is used to apply NOP or DESELECT commands for 200 clock cycles before applying any other command ...

Page 114

... XSNR is required before any nonREAD command can be applied. off ( TT ing self refresh at state T1. t XSRD (200 cycles of CK) is required before a READ command can be applied at state Td0. refresh. 114 512Mb: x4, x8, x16 DDR2 SDRAM Tb0 Tc0 Ta2 t ISXR 2 t CKE 3 NOP 4 NOP 4 ...

Page 115

... Figure 69 (page 118)–Figure 76 (page 121). Table 44 (page 117) is the CKE Truth Table. DDR2 SDRAM requires CKE to be registered HIGH (active) at all times that an access is in progress—from the issuing of a READ or WRITE command until completion of the burst. Thus, a clock suspend is not supported. For READs, a burst completion is defined when the read postamble is satisfied ...

Page 116

... XARDS timing is used for exit active power-down to READ command if slow exit is selec- ted via MR (bit 12 = 1). the DLL was not in a locked state when CKE went LOW, the DLL must be reset after exiting power-down mode for proper READ operation. 116 512Mb: x4, x8, x16 DDR2 SDRAM Power-Down Mode ...

Page 117

... CKE (n) is the logic state of CKE at clock edge n; CKE ( was the state of CKE at the Notes: 2. Current state is the state of the DDR2 SDRAM immediately prior to clock edge n. 3. Command (n) is the command registered at clock edge n, and action ( result of 4. The state of ODT does not affect the states described in this table. The ODT function is 5. Power-down modes do not perform any REFRESH operations. The duration of power- 6. “ ...

Page 118

... Power-down or self refresh entry may occur after the READ burst completes. PDF: 09005aef82f1e6e2 512MbDDR2.pdf - Rev. Q 10/ NOP NOP Valid entry NOP NOP entry is at T6. 118 512Mb: x4, x8, x16 DDR2 SDRAM Power-Down Mode NOP 1 Valid DO DO Power-down 2 or self refresh entry Transitioning Data NOP 1 Valid Valid DO DO ...

Page 119

... NOP NOP Valid cur later at Ta1, prior to RP being satisfied next integer CK. 119 512Mb: x4, x8, x16 DDR2 SDRAM Power-Down Mode NOP 1 Valid Valid t WTR Power-down or self refresh entry 1 Transitioning Data T5 Ta0 Ta1 Valid 1 Valid NOP WR 2 Power-down or self refresh entry Indicates a break in ...

Page 120

... REFRESH REFRESH command. Precharge power-down entry occurs prior to fied Valid ACT VALID VATE command. Active power-down entry occurs prior to 120 512Mb: x4, x8, x16 DDR2 SDRAM Power-Down Mode T2 T3 NOP t CKE (MIN) Power-down 1 entry Don’t Care t RFC (MIN) being satis NOP ...

Page 121

... PRE Valid All banks A10 vs Single bank CKE 1 x PRECHARGE command. Precharge power-down entry occurs prior to isfied Valid LM Valid 121 512Mb: x4, x8, x16 DDR2 SDRAM Power-Down Mode T2 T3 NOP t CKE (MIN Power-down 1 entry Don’t Care NOP NOP t CKE (MIN) t MRD ...

Page 122

... Precharge Power-Down Clock Frequency Change When the DDR2 SDRAM is in precharge power-down mode, ODT must be turned off and CKE must logic LOW level. A minimum of two differential clock cycles must pass after CKE goes LOW before clock frequency may change. The device input clock frequency is allowed to change only within minimum and maximum operating frequen- cies specified for the particular speed grade ...

Page 123

... If CKE asynchronously drops LOW during any valid operation (including a READ or WRITE burst), the memory controller must satisfy the timing parameter turning off the clocks. Stable clocks must exist at the CK, CK# inputs of the DRAM be- fore CKE is raised HIGH, at which time the normal initialization sequence must occur (see Initialization) ...

Page 124

... V must be valid at all times. DD DDL DDQ TT REF represents DQS, DQS#, UDQS, UDQS#, LDQS, LDQS#, RDQS, and RDQS# for the appropri- ate configuration (x4, x8, x16). completion of the burst. 124 512Mb: x4, x8, x16 DDR2 SDRAM T5 Ta0 CKE (MIN) 1 NOP 2 4 High-Z High-Z ...

Page 125

... AXPD (MIN) is not satisfied because ODT LOW occurs at state Ta0 AXPD (MIN) is not satisfied, AOFPD timing parameters apply. t AXPD (MIN) is satisfied, 125 512Mb: x4, x8, x16 DDR2 SDRAM t AOF timing parameters are applied, as shown t AOFPD timing parameters apply. t AONPD timing parameters apply. t ...

Page 126

... Active power-down slow (asynchronous) Precharge power-down (asynchronous AOND/ AOFD (synchronous AONPD/ AOFPD (asynchronous) 126 512Mb: x4, x8, x16 DDR2 SDRAM Synchronous t t AXPD (8 CKs) First CKE latched HIGH Any mode except self refresh mode t AOND/ Micron Technology, Inc. reserves the right to change products or specifications without notice. ...

Page 127

... MOD window until Valid Valid Valid Valid Valid Valid t AOND TT t AON (MIN) t AON (MAX) 127 512Mb: x4, x8, x16 DDR2 SDRAM t MOD (MAX) updates the R setting. TT Ta2 Ta3 Ta4 NOP NOP NOP 2 t MOD t IS Undefined New setting Indicates a break in time scale t MOD is met ...

Page 128

... Valid Valid Valid Valid Valid Valid t AONPD (MAX) t AONPD (MIN) t AOFPD (MIN) Transitioning NOP NOP NOP TT TT Transitioning R TT 128 512Mb: x4, x8, x16 DDR2 SDRAM Valid Valid Valid Valid Valid Valid Valid Valid t AOFPD (MAX) R Unknown NOP NOP NOP t ANPD (MIN) ...

Page 129

... CK# CK Command CKE ODT R ODT R PDF: 09005aef82f1e6e2 512MbDDR2.pdf - Rev. Q 10/ NOP NOP NOP TT TT Transitioning R TT 129 512Mb: x4, x8, x16 DDR2 SDRAM NOP NOP NOP NOP t ANPD (MIN) t AOND t AON (MAX) t AON (MIN) t AONPD (MAX) t AONPD (MIN) R Unknown Micron Technology, Inc. reserves the right to change products or specifications without notice. ...

Page 130

... PDF: 09005aef82f1e6e2 512MbDDR2.pdf - Rev. Q 10/ Ta0 NOP NOP NOP NOP t AXPD (MIN) Indicates a break in R Unknown TT time scale 130 512Mb: x4, x8, x16 DDR2 SDRAM Ta1 Ta2 Ta3 Ta4 NOP NOP NOP NOP t AOFD t AOF (MIN) t AOFPD (MAX) t AOFPD (MIN Transitioning Micron Technology, Inc ...

Page 131

... Rev. Q 10/ Ta0 NOP NOP NOP NOP t AXPD (MIN) Indicates a break time scale times occur. 131 512Mb: x4, x8, x16 DDR2 SDRAM Ta1 Ta2 Ta3 Ta4 NOP NOP NOP NOP t AOND t AON (MAX) t AON (MIN) t AONPD (MAX) t AONPD (MIN) Unknown R On ...

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