C8051F336-GMR Silicon Laboratories Inc, C8051F336-GMR Datasheet - Page 96
C8051F336-GMR
Manufacturer Part Number
C8051F336-GMR
Description
Microcontrollers (MCU) 16KB 10ADC 10DAC 768Ram MCU Lead Free
Manufacturer
Silicon Laboratories Inc
Datasheet
1.C8051F336-GM.pdf
(226 pages)
Specifications of C8051F336-GMR
Processor Series
C8051F3x
Core
8051
Data Bus Width
8 bit
Program Memory Type
Flash
Program Memory Size
16 KB
Data Ram Size
768 B
Interface Type
I2C, SPI, UART
Maximum Clock Frequency
25 MHz
Number Of Programmable I/os
17
Number Of Timers
4
Operating Supply Voltage
2.7 V to 3.6 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
Package / Case
QFN-20
3rd Party Development Tools
KSK-SL-TOOLSTICK, PK51, CA51, A51, ULINK2
Development Tools By Supplier
C8051F336DK
Minimum Operating Temperature
- 40 C
On-chip Adc
10 bit
On-chip Dac
10 bit
Package
20QFN
Device Core
8051
Family Name
C8051F336
Maximum Speed
25 MHz
Ram Size
768 Byte
Operating Temperature
-40 to 85 °C
Lead Free Status / Rohs Status
Details
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C8051F336/7/8/9
11. Add address bounds checking to the routines that write or erase Flash memory to ensure that a routine
16.4.3. System Clock
12.If operating from an external crystal, be advised that crystal performance is susceptible to electrical
13.If operating from the external oscillator, switch to the internal oscillator during Flash write or erase
Additional Flash recommendations and example code can be found in AN201, "Writing to Flash from Firm-
ware", available from the Silicon Laboratories web site.
96
areas.
called with an illegal address does not result in modification of the Flash.
interference and is sensitive to layout and to changes in temperature. If the system is operating in an
electrically noisy environment, use the internal oscillator or use an external CMOS clock.
operations. The external oscillator can continue to run, and the CPU can switch back to the external
oscillator after the Flash operation has completed.
Rev.1.0
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