DAC1232LCJ National Semiconductor, DAC1232LCJ Datasheet - Page 7

• Manufacturer Part Number: DAC1232LCJ
• Description: IC DAC 12BIT DBL BUFFERED 20-DIP
• Manufacturer: National Semiconductor
• Series: MICRO-DAC™r

Specifications of DAC1232LCJ

• Settling Time: 1µs
• Number Of Bits: 12
• Data Interface: Parallel
• Number Of Converters: 1
• Voltage Supply Source: Single Supply
• Power Dissipation (max): 500mW
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Through Hole
• Package / Case: *
• Case: DIP-20L
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Other names: *DAC1232LCJ

Application Hints
1 1 Automatic Transfer
The 12-bit DAC word is automatically transferred to the DAC register and the R-2R ladder when the second write (the 4 LSBs of
the data) occurs
1 2 Independent Processor Transfer Control
In this case a separate address is decoded to provide the XFER signal This allows the processor to load the next required DAC
word but not change the analog output until some time later most useful for the simultaneous updating of several DACs in a
system where their XFER lines would be tied together
1 3 Transfer via an External Strobe
This method is basically the same as the previous operation except the XFER signal is provided by a device other than the
processor This allows the DAC to hold the code for a conditional analog output signal which will be required on demand from an
external monitoring device (an analog voltage comparator for instance)
WR2 tied to a logic low (0V)
(Continued)
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TL H 5690 – 7
TL H 5690– 8
TL H 5690– 9