XC3S250E-4TQG144C Xilinx Inc, XC3S250E-4TQG144C Datasheet - Page 14

IC SPARTAN-3E FPGA 250K 144TQFP

XC3S250E-4TQG144C

Manufacturer Part Number
XC3S250E-4TQG144C
Description
IC SPARTAN-3E FPGA 250K 144TQFP
Manufacturer
Xilinx Inc
Series
Spartan™-3Er
Datasheet

Specifications of XC3S250E-4TQG144C

Number Of Logic Elements/cells
5508
Number Of Labs/clbs
612
Total Ram Bits
221184
Number Of I /o
108
Number Of Gates
250000
Voltage - Supply
1.14 V ~ 1.26 V
Mounting Type
Surface Mount
Operating Temperature
0°C ~ 85°C
Package / Case
144-LQFP
For Use With
813-1009 - MODULE USB-TO-FPGA TOOL W/MANUAL
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
122-1524

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
XC3S250E-4TQG144C
Manufacturer:
XILINX
Quantity:
2 000
Part Number:
XC3S250E-4TQG144C
Manufacturer:
XILINX
Quantity:
2 400
Part Number:
XC3S250E-4TQG144C
Manufacturer:
Xilinx Inc
Quantity:
10 000
Part Number:
XC3S250E-4TQG144C
Manufacturer:
XILINX
Quantity:
5 000
Part Number:
XC3S250E-4TQG144C
Manufacturer:
XILINX
Quantity:
5 000
Part Number:
XC3S250E-4TQG144C
Manufacturer:
XILINX
0
Part Number:
XC3S250E-4TQG144C
Manufacturer:
XILINX/赛灵思
Quantity:
20 000
Part Number:
XC3S250E-4TQG144CS1
Manufacturer:
XILINX
0
Part Number:
XC3S250E-4TQG144CS1
Manufacturer:
XILINX/赛灵思
Quantity:
20 000
Functional Description
Table 5: Storage Element Options (Continued)
Double-Data-Rate Transmission
Double-Data-Rate (DDR) transmission describes the tech-
nique of synchronizing signals to both the rising and falling
edges of the clock signal. Spartan-3E devices use register
pairs in all three IOB paths to perform DDR operations.
The pair of storage elements on the IOB’s Output path
(OFF1 and OFF2), used as registers, combine with a spe-
cial multiplexer to form a DDR D-type flip-flop (ODDR2).
This primitive permits DDR transmission where output data
bits are synchronized to both the rising and falling edges of
a clock. DDR operation requires two clock signals (usually
50% duty cycle), one the inverted form of the other. These
signals trigger the two registers in alternating fashion, as
shown in
erates the two clock signals by mirroring an incoming signal,
and then shifting it 180 degrees. This approach ensures
minimal skew between the two signals. Alternatively, the
inverter inside the IOB can be used to invert the clock sig-
nal, thus only using one clock line and both rising and falling
edges of that clock line as the two clocks for the DDR
flip-flops.
14
SRHIGH/SRLOW
INIT1/INIT0
Option Switch
Figure
7. The Digital Clock Manager (DCM) gen-
180˚ 0˚
DCM
Determines whether SR acts as a Set, which
forces the storage element to a logic "1"
(SRHIGH) or a Reset, which forces a logic "0"
(SRLOW)
When Global Set/Reset (GSR) is asserted or
after configuration this option specifies the
initial state of the storage element, either set
(INIT1) or reset (INIT0). By default, choosing
SRLOW also selects INIT0; choosing SRHIGH
also selects INIT1.
Figure 7: Two Methods for Clocking the DDR Register
D1
D2
CLK1
CLK2
Q1
Q2
Function
DDR MUX
FDDR
www.xilinx.com
Q
The storage-element pair on the Three-State path (TFF1
and TFF2) also can be combined with a local multiplexer to
form a DDR primitive. This permits synchronizing the output
enable to both the rising and falling edges of a clock. This
DDR operation is realized in the same way as for the output
path.
The storage-element pair on the input path (IFF1 and IFF2)
allows an I/O to receive a DDR signal. An incoming DDR
clock signal triggers one register, and the inverted clock sig-
nal triggers the other register. The registers take turns cap-
turing bits of the incoming DDR data signal. The primitive to
allow this functionality is called IDDR2.
Aside from high bandwidth data transfers, DDR outputs also
can be used to reproduce, or mirror, a clock signal on the
output. This approach is used to transmit clock and data sig-
nals together (source synchronously). A similar approach is
used to reproduce a clock signal at multiple outputs. The
advantage for both approaches is that skew across the out-
puts is minimal.
DCM
Independent for each storage element, except
when using ODDR2. In the latter case, the selection
for the upper element will apply to both elements.
Independent for each storage element, except
when using ODDR2, which uses two IOBs. In the
ODDR2 case, selecting INIT0 for one IOBs applies
to both elements within the IOB, although INIT1
could be selected for the elements in the other IOB.
D1
D2
CLK1
CLK2
Q1
Q2
Specificity
DDR MUX
DS312-2 (v3.8) August 26, 2009
FDDR
DS312-2_20_021105
Product Specification
Q
R

Related parts for XC3S250E-4TQG144C