XC3S250E-4TQG144C Xilinx Inc, XC3S250E-4TQG144C Datasheet - Page 165

• Manufacturer Part Number: XC3S250E-4TQG144C
• Description: IC SPARTAN-3E FPGA 250K 144TQFP
• Manufacturer: Xilinx Inc
• Series: Spartan™-3Er

Specifications of XC3S250E-4TQG144C

• Number Of Logic Elements/cells: 5508
• Number Of Labs/clbs: 612
• Total Ram Bits: 221184
• Number Of I /o: 108
• Number Of Gates: 250000
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C
• Package / Case: 144-LQFP
• For Use With: 813-1009 - MODULE USB-TO-FPGA TOOL W/MANUAL
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 122-1524

Package Overview
Table 125
tion package styles for the Spartan-3E family. Each pack-
age style is available as a standard and an environmentally
friendly lead-free (Pb-free) option. The Pb-free packages
include an extra ‘G’ in the package style name. For exam-
ple, the standard “VQ100” package becomes “VQG100”
when ordered as the Pb-free option. The mechanical
dimensions of the standard and Pb-free packages are simi-
Table 125: Spartan-3E Family Package Options
Selecting the Right Package Option
Spartan-3E FPGAs are available in both quad-flat pack
(QFP) and ball grid array (BGA) packaging options. While
QFP packaging offers the lowest absolute cost, the BGA
Table 126: QFP and BGA Comparison
DS312-4 (v3.8) August 26, 2009
Product Specification
Notes:
1.
Maximum User I/O
Packing Density (Logic/Area)
Signal Integrity
Simultaneous Switching Output (SSO) Support
Thermal Dissipation
Minimum Printed Circuit Board (PCB) Layers
Hand Assembly/Rework
VQ100 / VQG100
PQ208 / PQG208
CP132 / CPG132
TQ144 / TQG144
FG320 / FGG320
FG400 / FGG400
FG484 / FGG484
FT256 / FTG256
Package mass is ±10%.
Package
shows the eight low-cost, space-saving produc-
R
Leads
100
132
144
208
256
320
400
484
Characteristic
Very-thin Quad Flat Pack (VQFP)
Chip-Scale Package (CSP)
Thin Quad Flat Pack (TQFP)
Plastic Quad Flat Pack (PQFP)
Fine-pitch, Thin Ball Grid Array (FBGA)
Fine-pitch Ball Grid Array (FBGA)
Fine-pitch Ball Grid Array (FBGA)
Fine-pitch Ball Grid Array (FBGA)
Type
www.xilinx.com
Quad Flat Pack (QFP)
lar, as shown in the mechanical drawings provided in
Table
Not all Spartan-3E densities are available in all packages.
For a specific package, however, there is a common foot-
print that supports all the devices available in that package.
See the footprint diagrams that follow.
For additional package information, see UG112: Device
Package User Guide.
packages are superior in almost every other aspect, as
summarized in
mends using BGA packaging whenever possible.
Maximum
127.
108
158
190
250
304
376
I/O
66
92
Possible
Good
158
Fair
Fair
Fair
4
Lead
Pitch
(mm)
Table
0.5
0.5
0.5
0.5
1.0
1.0
1.0
1.0
126. Consequently, Xilinx recom-
Area (mm)
30.6 x 30.6
Footprint
8.1 x 8.1
16 x 16
22 x 22
17 x 17
19 x 19
21 x 21
23 x 23
Ball Grid Array (BGA)
Pinout Descriptions
Difficult
Better
Better
Better
Better
Height
(mm)
376
1.60
1.55
1.20
1.10
4.10
2.00
2.43
2.60
4-6
Mass
(g)
0.6
0.1
1.4
0.9
1.4
2.2
2.2
5.3
(1)
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