XC3S250E-4TQG144C Xilinx Inc, XC3S250E-4TQG144C Datasheet - Page 180

IC SPARTAN-3E FPGA 250K 144TQFP

XC3S250E-4TQG144C

Manufacturer Part Number
XC3S250E-4TQG144C
Description
IC SPARTAN-3E FPGA 250K 144TQFP
Manufacturer
Xilinx Inc
Series
Spartan™-3Er
Datasheet

Specifications of XC3S250E-4TQG144C

Number Of Logic Elements/cells
5508
Number Of Labs/clbs
612
Total Ram Bits
221184
Number Of I /o
108
Number Of Gates
250000
Voltage - Supply
1.14 V ~ 1.26 V
Mounting Type
Surface Mount
Operating Temperature
0°C ~ 85°C
Package / Case
144-LQFP
For Use With
813-1009 - MODULE USB-TO-FPGA TOOL W/MANUAL
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
122-1524

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Pinout Descriptions
TQ144: 144-lead Thin Quad Flat Package
The XC3S100E and the XC3S250E FPGAs are available in
the 144-lead thin quad flat package, TQ144. Both devices
share a common footprint for this package as shown in
Table 137
Table 137
bank number and then by pin name of the largest device.
Pins that form a differential I/O pair appear together in the
table. The table also shows the pin number for each pin and
the pin type, as defined earlier.
Pinout Table
Table 137: TQ144 Package Pinout
180
Bank
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
0
1
1
1
and
lists all the package pins. They are sorted by
IO
IO/VREF_0
IO_L01N_0
IO_L01P_0
IO_L02N_0
IO_L02P_0
IO_L04N_0/GCLK5
IO_L04P_0/GCLK4
IO_L05N_0/GCLK7
IO_L05P_0/GCLK6
IO_L07N_0/GCLK11
IO_L07P_0/GCLK10
IO_L08N_0/VREF_0
IO_L08P_0
IO_L09N_0
IO_L09P_0
IO_L10N_0/HSWAP
IO_L10P_0
IP
IP
IP
IP
IP_L03N_0
IP_L03P_0
IP_L06N_0/GCLK9
IP_L06P_0/GCLK8
VCCO_0
VCCO_0
IO/A0
IO/VREF_1
IO_L01N_1/A15
Figure
XC3S100E Pin Name
83.
IO
IO/VREF_0
IO_L01N_0
IO_L01P_0
IO_L02N_0
IO_L02P_0
IO_L04N_0/GCLK5
IO_L04P_0/GCLK4
IO_L05N_0/GCLK7
IO_L05P_0/GCLK6
IO_L07N_0/GCLK11
IO_L07P_0/GCLK10
IO_L08N_0/VREF_0
IO_L08P_0
IO_L09N_0
IO_L09P_0
IO_L10N_0/HSWAP
IO_L10P_0
IP
IP
IP
IP
IP_L03N_0
IP_L03P_0
IP_L06N_0/GCLK9
IP_L06P_0/GCLK8
VCCO_0
VCCO_0
IO/A0
IO/VREF_1
IO_L01N_1/A15
www.xilinx.com
XC3S250E Pin Name
The TQ144 package only supports 20 address output pins
in the Byte-wide Peripheral Interface (BPI) configuration
mode. In larger packages, there are 24 BPI address out-
puts.
An electronic version of this package pinout table and foot-
print diagram is available for download from the Xilinx web
site at:
http://www.xilinx.com/support/documentation/data_sheets/s3e_pin.zip
TQ144 Pin
P132
P124
P113
P112
P117
P116
P123
P122
P126
P125
P131
P130
P135
P134
P140
P139
P143
P142
P111
P114
P136
P141
P120
P119
P129
P128
P121
P138
P98
P83
P75
DS312-4 (v3.8) August 26, 2009
Product Specification
INPUT
INPUT
INPUT
INPUT
INPUT
INPUT
VCCO
VCCO
VREF
GCLK
GCLK
GCLK
GCLK
GCLK
GCLK
VREF
GCLK
GCLK
VREF
DUAL
DUAL
DUAL
Type
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
R

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