XC3S250E-4TQG144C Xilinx Inc, XC3S250E-4TQG144C Datasheet - Page 189

• Manufacturer Part Number: XC3S250E-4TQG144C
• Description: IC SPARTAN-3E FPGA 250K 144TQFP
• Manufacturer: Xilinx Inc
• Series: Spartan™-3Er

Specifications of XC3S250E-4TQG144C

• Number Of Logic Elements/cells: 5508
• Number Of Labs/clbs: 612
• Total Ram Bits: 221184
• Number Of I /o: 108
• Number Of Gates: 250000
• Voltage - Supply: 1.14 V ~ 1.26 V
• Mounting Type: Surface Mount
• Operating Temperature: 0°C ~ 85°C
• Package / Case: 144-LQFP
• For Use With: 813-1009 - MODULE USB-TO-FPGA TOOL W/MANUAL
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 122-1524

User I/Os by Bank
Table 142
distributed between the four I/O banks on the PQ208 pack-
age.
Table 142: User I/Os Per Bank for the XC3S250E and XC3S500E in the PQ208 Package
DS312-4 (v3.8) August 26, 2009
Product Specification
Notes:
1.
2.
Top
Right
Bottom
Left
TOTAL
Package
Some VREF and CLK pins are on INPUT pins.
The eight global clock pins in this bank have optional functionality during configuration and are counted in the DUAL column.
Edge
indicates how the 158 available user-I/O pins are
R
I/O Bank
0
1
2
3
Maximum
158
I/O
38
40
40
40
I/O
18
23
58
9
8
www.xilinx.com
Footprint Migration Differences
The XC3S250E and XC3S500E FPGAs have identical foot-
prints in the PQ208 package. Designs can migrate between
the XC3S250E and XC3S500E without further consider-
ation.
INPUT
25
6
7
6
6
All Possible I/O Pins by Type
DUAL
21
24
46
1
0
VREF
13
5
3
2
3
Pinout Descriptions
(1)
CLK
0
0
16
8
8
(2)
(2)
(1)
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