XC3S200AN-4FTG256C Xilinx Inc, XC3S200AN-4FTG256C Datasheet
XC3S200AN-4FTG256C
Manufacturer Part Number
XC3S200AN-4FTG256C
Description
IC SPARTAN-3AN FPGA 200K 256FTBG
Manufacturer
Xilinx Inc
Series
Spartan™-3ANr
Datasheets
1.XC3S50A-4VQG100C.pdf
(7 pages)
2.XC3S50AN-4TQG144C.pdf
(2 pages)
3.XC3S50AN-4TQG144C.pdf
(123 pages)
Specifications of XC3S200AN-4FTG256C
Total Ram Bits
294912
Number Of Logic Elements/cells
4032
Number Of Labs/clbs
448
Number Of I /o
195
Number Of Gates
200000
Voltage - Supply
1.14 V ~ 1.26 V
Mounting Type
Surface Mount
Operating Temperature
0°C ~ 85°C
Package / Case
256-LBGA
No. Of Logic Blocks
4032
No. Of Gates
200000
No. Of Macrocells
4032
Family Type
Spartan-3AN
No. Of Speed Grades
4
No. Of I/o's
195
Package
256FTBGA
Family Name
Spartan®-3AN
Device Logic Units
4032
Device System Gates
200000
Maximum Internal Frequency
667 MHz
Typical Operating Supply Voltage
1.2 V
Maximum Number Of User I/os
195
Ram Bits
294912
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
122-1553
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
XC3S200AN-4FTG256C
Manufacturer:
XILINX
Quantity:
450
Part Number:
XC3S200AN-4FTG256C
Manufacturer:
XILINX/赛灵思
Quantity:
20 000
Table 1: Affected Part Numbers
the current 2-layer substrate for the FT256 and FTG256 packages. All other Spartan FT/FTG256 devices
currently use 2-layer substrates including Spartan-3A XC3S700A and XC3S1400A devices.
XCN08014 (v1.0) October 20, 2008
Overview
The purpose of this notification is to announce the standardization of remaining Spartan
Description
This change is to standardize FT256 and FTG256 in the XC3S50A, XC3S200A/AN and XC3S400A to the
current 2-layer substrate package construction. All other Spartan devices, including the XC3S700A and
XC3S1400A, use a 2-layer substrate for the FT256 and FTG256 packages. The 2-layer substrate has
equivalent performance and specifications to the 4-layer substrate and there is no difference in the fit or
form between these substrates.
Products Affected
This change affects all speed and temperature variations of the commercial (C) and industrial (I) grade
devices for the three affected devices using the FT256 or FTG256 package. Automotive XA I and Q
grade devices are already offered in 2-layer and are not affected.
XC3S50A-4FT256C
XC3S50A-4FTG256C
XC3S200A-4FT256C
XC3S200A-4FTG256C
XC3S200AN-4FT256C
XC3S200AN-4FTG256C
XC3S400A-4FT256C
XC3S400A-4FTG256C
NOTES:
1) SCD part numbers based on these base part numbers will also be affected.
XCN08014 (v1.0) October 20, 2008
© 2008 Xilinx, Inc. All rights reserved. All Xilinx trademarks, registered trademarks, patents, and disclaimers are as listed at http://www.xilinx.com/legal.htm.
All other trademarks and registered trademarks are the property of their respective owners. All specifications are subject to change without notice.
XC3S50A-4FT256I
XC3S50A-4FTG256I
XC3S200A-4FT256I
XC3S200A-4FTG256I
XC3S200AN-4FT256I
XC3S200AN-4FTG256I
XC3S400A-4FT256I
XC3S400A-4FTG256I
www.xilinx.com
Package Substrate Change
for Spartan-3A and
Spartan-3AN Devices
XC3S200AN-5FTG256C
XC3S50A-5FT256C
XC3S50A-5FTG256C
XC3S200A-5FT256C
XC3S200A-5FTG256C
XC3S200AN-5FT256C
XC3S400A-5FT256C
XC3S400A-5FTG256C
Product/Process Change Notice
®
-3A devices to
1
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XC3S200AN-4FTG256C Summary of contents
Page 1
... Table 1: Affected Part Numbers XC3S50A-4FT256C XC3S50A-4FTG256C XC3S200A-4FT256C XC3S200A-4FTG256C XC3S200AN-4FT256C XC3S200AN-4FTG256C XC3S400A-4FT256C XC3S400A-4FTG256C NOTES: 1) SCD part numbers based on these base part numbers will also be affected. XCN08014 (v1.0) October 20, 2008 © 2008 Xilinx, Inc. All rights reserved. All Xilinx trademarks, registered trademarks, patents, and disclaimers are as listed at http://www.xilinx.com/legal.htm. ...
Page 2
Package Substrate Change for Spartan-3A and Spartan-3AN Devices Key Dates and Ordering Information Xilinx will begin to cross-ship the 2-layer package on or after January 10, 2009. At that time, shipment of either or both 2-layer and 4-layer substrate material ...