XC3S200AN-4FTG256C Xilinx Inc, XC3S200AN-4FTG256C Datasheet - Page 107

IC SPARTAN-3AN FPGA 200K 256FTBG

XC3S200AN-4FTG256C

Manufacturer Part Number
XC3S200AN-4FTG256C
Description
IC SPARTAN-3AN FPGA 200K 256FTBG
Manufacturer
Xilinx Inc
Series
Spartan™-3ANr

Specifications of XC3S200AN-4FTG256C

Total Ram Bits
294912
Number Of Logic Elements/cells
4032
Number Of Labs/clbs
448
Number Of I /o
195
Number Of Gates
200000
Voltage - Supply
1.14 V ~ 1.26 V
Mounting Type
Surface Mount
Operating Temperature
0°C ~ 85°C
Package / Case
256-LBGA
No. Of Logic Blocks
4032
No. Of Gates
200000
No. Of Macrocells
4032
Family Type
Spartan-3AN
No. Of Speed Grades
4
No. Of I/o's
195
Package
256FTBGA
Family Name
Spartan®-3AN
Device Logic Units
4032
Device System Gates
200000
Maximum Internal Frequency
667 MHz
Typical Operating Supply Voltage
1.2 V
Maximum Number Of User I/os
195
Ram Bits
294912
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
122-1553

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User I/Os by Bank
Table 79
The AWAKE pin is counted as a dual-purpose I/O.
Table 79: User I/Os Per Bank for the XC3S700AN in the FGG484 Package
Table 80: User I/Os Per Bank for the XC3S1400AN in the FGG484 Package
Footprint Migration Differences
Table 81
FPGAs that can affect migration between devices available in the FGG484 package. All other pins unconditionally migrate
between the Spartan-3AN devices available in the FGG484 package.
Spartan-3AN FPGAs are pin compatible with the same density Spartan-3A FPGAs in the FG(G)484 package, although the
Spartan-3A FPGAs require an external configuration source.
In
right. Migration in the other direction is possible depending on how the pin is configured for the device on the right.
Table 81: FGG484 XC3S700AN to XC3S1400AN Footprint Migration/Differences
DS557 (v4.1) April 1, 2011
Product Specification
Top
Right
Bottom
Left
Top
Right
Bottom
Left
Table
FGG484 Ball
Package
Package
Edge
Edge
Total
Total
U16
U7
T8
81, the arrow () indicates that this pin can unconditionally migrate from the device on the left to the device on the
and
summarizes the three footprint and functionality differences between the XC3S700AN and the XC3S1400AN
Table 80
I/O Bank
I/O Bank
0
1
2
3
0
1
2
3
indicate how the user-I/O pins are distributed between the four I/O banks on the FGG484 package.
Number of Differences:
Bank
2
2
2
Maximum I/Os
Maximum I/Os
N.C.
N.C.
N.C.
372
375
92
94
92
94
92
94
95
94
XC3S700AN
195
195
I/O
I/O
58
33
43
61
58
33
43
61
www.xilinx.com
INPUT
INPUT
17
15
11
17
60
17
15
13
17
62
All Possible I/O Pins by Type
All Possible I/O Pins by Type
Spartan-3AN FPGA Family: Pinout Descriptions
Migration
3
DUAL
DUAL
30
21
52
30
21
52
1
0
1
0
INPUT/VREF
INPUT
INPUT
VREF
VREF
33
10
34
XC3S1400AN
8
8
9
8
8
8
8
CLK
CLK
32
32
8
8
8
8
8
8
8
8
107

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