XC2VP7-5FFG896I Xilinx Inc, XC2VP7-5FFG896I Datasheet - Page 290

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XC2VP7-5FFG896I

Manufacturer Part Number
XC2VP7-5FFG896I
Description
IC FPGA VIRTEX-II PRO 896-FBGA
Manufacturer
Xilinx Inc
Series
Virtex™-II Pror
Datasheet

Specifications of XC2VP7-5FFG896I

Number Of Logic Elements/cells
11088
Number Of Labs/clbs
1232
Total Ram Bits
811008
Number Of I /o
396
Voltage - Supply
1.425 V ~ 1.575 V
Mounting Type
Surface Mount
Operating Temperature
-40°C ~ 100°C
Package / Case
896-BBGA, FCBGA
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Number Of Gates
-
R
FF1517 Flip-Chip Fine-Pitch BGA Package
As shown in
Table
12, XC2VP50 and XC2VP70 Virtex-II Pro devices are available in the FF1517 flip-chip fine-pitch BGA
package. Following this table are the
Table 12: FF1517 — XC2VP50 and XC2VP70
Bank
Pin Description
0
IO_L01N_0/VRP_0
0
IO_L01P_0/VRN_0
0
IO_L02N_0
0
IO_L02P_0
0
IO_L03N_0
0
IO_L03P_0/VREF_0
0
IO_L05_0/No_Pair
0
IO_L06N_0
0
IO_L06P_0
0
IO_L07N_0
0
IO_L07P_0
0
IO_L08N_0
0
IO_L08P_0
0
IO_L09N_0
0
IO_L09P_0/VREF_0
0
IO_L19N_0
0
IO_L19P_0
0
IO_L20N_0
0
IO_L20P_0
0
IO_L21N_0
0
IO_L21P_0
0
IO_L25N_0
0
IO_L25P_0
0
IO_L26N_0
0
IO_L26P_0
0
IO_L27N_0
0
IO_L27P_0/VREF_0
0
IO_L28N_0
0
IO_L28P_0
0
IO_L29N_0
0
IO_L29P_0
0
IO_L30N_0
0
IO_L30P_0
0
IO_L34N_0
DS083 (v4.7) November 5, 2007
Product Specification
Virtex-II Pro and Virtex-II Pro X Platform FPGAs: Pinout Information
FF1517 Flip-Chip Fine-Pitch BGA Package Specifications (1.00mm
Pin
Number
D31
E31
K30
J30
G30
H30
K28
E30
F30
C30
D30
J29
K29
G29
H29
E29
F29
L28
L27
C29
D29
H28
J28
M27
M26
D28
E28
H27
J27
J26
K26
F28
G27
D27
www.xilinx.com
pitch).
No Connects
XC2VP50
XC2VP70
NC
NC
NC
NC
NC
NC
NC
Module 4 of 4
162

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