CY7C63001A-PXC Cypress Semiconductor Corp, CY7C63001A-PXC Datasheet - Page 24

• Manufacturer Part Number: CY7C63001A-PXC
• Description: IC MCU 4K USB MCU LS 20-DIP
• Manufacturer: Cypress Semiconductor Corp
• Series: M8™r

Specifications of CY7C63001A-PXC

• Applications: USB Microcontroller
• Core Processor: M8A
• Program Memory Type: OTP (4 kB)
• Controller Series: CY7C630xx
• Ram Size: 128 x 8
• Interface: USB
• Number Of I /o: 12
• Voltage - Supply: 4 V ~ 5.25 V
• Operating Temperature: 0°C ~ 70°C
• Mounting Type: Through Hole
• Package / Case: 20-DIP (0.300", 7.62mm)
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 428-1616

11.0
Table 11-1 below shows the die pad coordinates for the
CY7C63001A-XC and CY7C63001A-XWC. The center
location of each bond pad is relative to the bottom left corner
of the die which has coordinate (0,0).
Table 11-1. CY7C63001A-XC Probe Pad Coordinates in Microns ((0,0) to Bond Pad Centers)
All product and company names mentioned in this document are the trademarks of their respective holders.
Document #: 38-08026 Rev. *A
© Cypress Semiconductor Corporation, 2004. The information contained herein is subject to change without notice. Cypress Semiconductor Corporation assumes no responsibility for the use
of any circuitry other than circuitry embodied in a Cypress product. Nor does it convey or imply any license under patent or other rights. Cypress products are not warranted nor intended to be
used for medical, life support, life saving, critical control or safety applications, unless pursuant to an express written agreement with Cypress. Furthermore, Cypress does not authorize its
products for use as critical components in life-support systems where a malfunction or failure may reasonably be expected to result in significant injury to the user. The inclusion of Cypress
products in life-support systems application implies that the manufacturer assumes all risk of such use and in doing so indemnifies Cypress against all charges.
Pad #
10
12
11
1
2
3
4
5
6
7
8
9
Package Diagrams
Port00
Port01
Port02
Port03
Port10
Port12
Port14
Port16
Name
Xtalin
Cext
Vss
Vpp
Pin
(microns)
676.00
507.35
338.70
170.05
120.10
120.10
120.10
120.10
148.50
278.30
414.25
653.45
(continued)
X
(microns)
2325.40
2325.40
2325.40
2325.40
2132.30
1962.90
1765.20
1595.80
121.80
121.80
121.80
121.80
Y
Y
(0,0)
9 10 11 12
4 3 2 1 24 23 22 21
DIE FORM
5
6
7
8
X
13 14 15 16
Pad #
13
14
15
16
17
18
19
20
21
22
23
24
18
17
20
19
Port17
Port15
Port13
Port11
Port07
Port06
Port05
Port04
Name
Xtlout
Pin
Vcc
D+
D-
(microns)
1033.55
1129.75
1451.70
1446.10
1446.10
1446.10
1446.10
1395.65
1227.00
1058.35
794.85
889.7
X
51-85025-*B
CY7C63001A
CY7C63101A
(microns)
Page 24 of 25
1595.80
1765.20
1962.90
2132.30
2325.40
2325.40
2325.40
2325.40
121.80
121.80
121.80
121.80
Y