IC MPU 32BIT 200MHZ PPC 357-PBGA

MPC8241LZQ200D

Manufacturer Part NumberMPC8241LZQ200D
DescriptionIC MPU 32BIT 200MHZ PPC 357-PBGA
ManufacturerFreescale Semiconductor
MPC8241LZQ200D datasheet
 


Specifications of MPC8241LZQ200D

Processor TypeMPC82xx PowerQUICC II 32-bitSpeed200MHz
Voltage1.8VMounting TypeSurface Mount
Package / Case357-PBGAFamily NameMPC82XX
Device CorePowerQUICC IIDevice Core Size32b
Frequency (max)200MHzInstruction Set ArchitectureRISC
Supply Voltage 1 (typ)1.8VOperating Supply Voltage (max)1.9V
Operating Supply Voltage (min)1.7VOperating Temp Range0C to 105C
Operating Temperature ClassificationCommercialMountingSurface Mount
Pin Count357Package TypeBGA
Lead Free Status / RoHS StatusContains lead / RoHS non-compliantFeatures-
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Freescale Semiconductor
Technical Data
MPC8241 Integrated Processor
Hardware Specifications
The MPC8241 combines a PowerPC™ MPC603E core with
a PCI bridge so that system designers can rapidly design
systems using peripherals designed for PCI and other
standard interfaces. Also, a high-performance memory
controller supports various types of ROM and SDRAM. The
MPC8241 is the second of a family of products that provide
system-level support for industry-standard interfaces with an
MPC603e processor core.
This hardware specification describes pertinent electrical
and physical characteristics of the MPC8241, which is based
on the MPC8245 design. For functional characteristics of the
processor, refer to the MPC8245 Integrated Processor
Reference Manual (MPC8245UM).
For published errata or updates to this document, visit the
web site listed on the back cover of the document.
1
Overview
The MPC8241 integrated processor is composed of a
peripheral logic block and a 32-bit superscalar MPC603e
core, as shown in
Figure
1.
© Freescale Semiconductor, Inc., 2009. All rights reserved.
Document Number: MPC8241EC
Rev. 10, 02/2009
Contents
1. Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
2. Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
3. General Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
4. Electrical and Thermal Characteristics . . . . . . . . . . . . 6
5. Package Description . . . . . . . . . . . . . . . . . . . . . . . . . 31
6. PLL Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . 39
7. System Design Information . . . . . . . . . . . . . . . . . . . 42
8. Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . 52
9. Document Revision History . . . . . . . . . . . . . . . . . . . 54

MPC8241LZQ200D Summary of contents

  • Page 1

    ... Overview The MPC8241 integrated processor is composed of a peripheral logic block and a 32-bit superscalar MPC603e core, as shown in Figure 1. © Freescale Semiconductor, Inc., 2009. All rights reserved. Document Number: MPC8241EC Rev. 10, 02/2009 Contents 1. Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 2. Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 3. General Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 4. Electrical and Thermal Characteristics . . . . . . . . . . . . 6 5 ...

  • Page 2

    ... Data Instruction Instruction Cache Cache Cache Data Bus Data Path (32- or 64-Bit) ECC Controller with 8-Bit Parity or ECC Memory Memory/ROM/ Controller Port X Control/Address SDRAM_SYNC_IN SDRAM Clocks DLL Peripheral Logic PCI_SYNC_IN PLL Fanout PCI Bus Buffers Clocks OSC_IN Freescale Semiconductor ...

  • Page 3

    ... Store gathering on peripheral logic bus-to-PCI writes — Memory interface – Gbytes of SDRAM memory – High-bandwidth data bus (32- or 64-bit) to SDRAM – Programmable timing for SDRAM – One to 8 banks of 16-, 64-, 128-, 256-, or 512-Mbit memory devices MPC8241 Integrated Processor Hardware Specifications, Rev. 10 Freescale Semiconductor Features O interface), and ...

  • Page 4

    ... Interrupt on completed segment, chain, and error – Local-to-local memory – PCI-to-PCI memory – Local-to-PCI memory – PCI memory-to-local memory — Message unit – Two doorbell registers – Two inbound and two outbound messaging registers – message interface 2 MPC8241 Integrated Processor Hardware Specifications, Rev Freescale Semiconductor ...

  • Page 5

    ... Die size Transistor count Logic design Packages Core power supply I/O power supply MPC8241 Integrated Processor Hardware Specifications, Rev. 10 Freescale Semiconductor 0.25 µm CMOS, five-layer metal 2 49.2 mm 4.5 million Fully static Surface-mount 357 (thick substrate and thick mold cap) plastic ball grid array (PBGA) 1.8 V ± ...

  • Page 6

    ... MPC8241 Integrated Processor Hardware Specifications, Rev Table 1 Table 1. Absolute Maximum Ratings provides the absolute maximum Symbol Range V –0.3 to 2.1 DD _OV –0 /AV 2 –0 –0 –0 105 j T –55 to 150 stg + 0.5 V DC. DD Freescale Semiconductor Unit •C C •C C ...

  • Page 7

    ... PCI pins are designed to withstand LV 8. Caution: Input voltage (V ) must not be greater than the supply voltage (V in including during power-on reset. Input voltage (V including during power-on reset. MPC8241 Integrated Processor Hardware Specifications, Rev. 10 Freescale Semiconductor Symbol _OV DD AV ...

  • Page 8

    ... Relock 3 Time 2 Nine External Memory Clock Cycles Setup Time Maximum Rise Time Must be Less Than One External Memory Clock Cycle Table 2 for details on this topic _OV /( /AV / HRST_CPU and Time 6 HRST_CTRL PLL Asserted 255 External Memory 3 Clock Cycles 1 Table 2. Freescale Semiconductor ...

  • Page 9

    ... Figure 5 show the undershoot and overshoot voltage of the PCI interface for the 3.3- and 5-V signals, respectively. Overvoltage Waveform Undervoltage Waveform Figure 4. Maximum AC Waveforms for 3.3-V Signaling MPC8241 Integrated Processor Hardware Specifications, Rev. 10 Freescale Semiconductor _OV DD DD Not to Exceed 10 SDRAM_CLK Figure 3 ...

  • Page 10

    ... Table 3. DC Electrical Specifications Symbol Min 0.65 × 2 3 GND/GNDRING IL ≤ ≤ 3.465 p-to-p (Min) 10.75 V p-to-p (Min) Max Unit _OV 0.3 × GV — _OV DD DD 3.3 0.8 — ±70 µA — ±10 µA — — 0.4 Freescale Semiconductor Notes ...

  • Page 11

    ... For all others with GV _OV = 3 entry. 5. See driver bit details for output driver control register (0x73) in the MPC8245 Integrated Processor Reference Manual. 6. See Chip Errata No the MPC8245/MPC8241 Integrated Processor Chip Errata. MPC8241 Integrated Processor Hardware Specifications, Rev. 10 Freescale Semiconductor Symbol Min both GV _OV /LV and V ...

  • Page 12

    ... V where a nominal FP value, a nominal INT value, and and AV 2) < 15 mW, guaranteed by design, but not tested value resulted from the MPC8241 operating at the fastest frequency combination of Unit Notes 66/66/ 266 66/133/ 266 1.5 1.8 W 1.9 2.1 W 1.6 1.8 W 1.0 1 0.4 0 0.2 0 Maximum Unit Notes 1130 mW Freescale Semiconductor ...

  • Page 13

    ... AC specifications for that frequency. The processor core frequency is determined by the bus (PCI_SYNC_IN) clock frequency and the settings of the PLL_CFG[0:4] signals. Parts are sold by maximum processor core frequency. See MPC8241 Integrated Processor Hardware Specifications, Rev. 10 Freescale Semiconductor Table 6. Thermal Characterization Data Thermal Test Board Symbol ...

  • Page 14

    ... Min Max 200 100 266 100 33 133 for valid PLL_CFG[0:4] settings Min Max Unit 25 66 MHz — 2 — 200 ps — 250 ps — 190 ps — 100 µs See Figure 7 ns Figure 8 through Figure MHz — Freescale Semiconductor Unit MHz MHz MHz Notes ...

  • Page 15

    ... PCI_SYNC_IN input clock timing diagram, and DLL locking range loop delay versus frequency of operation. PCI_SYNC_IN Figure 6. PCI_SYNC_IN Input Clock Timing Diagram MPC8241 Integrated Processor Hardware Specifications, Rev. 10 Freescale Semiconductor Table 2) with LV = 3.3 V ± 0 the propagation delay of the DLL synchronization feedback loop (PC ...

  • Page 16

    ... Keeping a DLL mode locked below tap point decimal 12 is not recommended. MPC8241 Integrated Processor Hardware Specifications, Rev Table 9. Table 9. DLL Mode Definition Bit 2 of Configuration Bit 7 of Configuration Register at 0x76 value used for the trace length of SDRAM_SYNC_OUT to Register at 0x72 Freescale Semiconductor ...

  • Page 17

    ... Figure 7. DLL Locking Range Loop Delay versus Frequency of Operation for DLL_Extend=0 MPC8241 Integrated Processor Hardware Specifications, Rev. 10 Freescale Semiconductor Propagation Delay Time (ns) loop and Normal Tap Delay Electrical and Thermal Characteristics ...

  • Page 18

    ... Electrical and Thermal Characteristics 30 27.5 25 22.5 20 17.5 15 12.5 10 7.5 0 Figure 8. DLL Locking Range Loop Delay versus Frequency of Operation for DLL_Extend=1 MPC8241 Integrated Processor Hardware Specifications, Rev Propagation Delay Time (ns) loop and Normal Tap Delay 4 5 Freescale Semiconductor ...

  • Page 19

    ... Figure 9. DLL Locking Range Loop Delay versus Frequency of Operation for DLL_Extend=0 MPC8241 Integrated Processor Hardware Specifications, Rev. 10 Freescale Semiconductor Propagation Delay Time (ns) loop and Max Tap Delay Electrical and Thermal Characteristics ...

  • Page 20

    ... PCI input signals valid to PCI_SYNC_IN (input setup) 10b Memory input signals valid to sys_logic_clk (input setup) MPC8241 Integrated Processor Hardware Specifications, Rev Propagation Delay Time (ns) loop and Max Tap Delay Figure 11 and Figure 12. Table 10. Input AC Timing Specifications Characteristic 4 5 Table Min Max Unit Notes 3.0 — Freescale Semiconductor 2) ...

  • Page 21

    ... SDRAM loading must be performed to optimize timing. For details on trace measurements and the T problem, refer to the Freescale application note AN2164, MPC8245/MPC8241 Memory Clock Design Guidelines. os MPC8241 Integrated Processor Hardware Specifications, Rev. 10 Freescale Semiconductor Characteristic /2 of the rising edge of PCI_SYNC_IN to 0.4 × GV _OV DD ...

  • Page 22

    ... PCI Inputs/Outputs Input Timing Figure 12. Input/Output Timing Diagram Referenced to PCI_SYNC_IN MPC8241 Integrated Processor Hardware Specifications, Rev 11a 2.0 V 2.0 V 0 _OV 12a 11c 0 _OV 13b 12b-d 14b Output Timing _OV GV _OV 13a 14a GV _OV 0.615 0.285 Output Timing Freescale Semiconductor ...

  • Page 23

    ... Tap 2, PCI_HOLD_DEL = 10, [MCP,CKE] = 01, 33 MHz PCI 13a3 Tap 3, PCI_HOLD_DEL = 11, [MCP,CKE 13b Output hold (all others) 14a PCI_SYNC_IN to output high impedance (for PCI) MPC8241 Integrated Processor Hardware Specifications, Rev. 10 Freescale Semiconductor VM 10e 2 Midpoint Voltage (1 3.3 V ± 0.3 V (see Figure DD 14). Output timings are measured at the pin ...

  • Page 24

    ... Figure Figure 11. Figure 15 Output Measurements are Made at the Device Pin = 50 Ω Ω Figure 14. AC Test Load for the MPC8241 Min Max Unit — 4 0.615 × _OV DD DD 12. for PCI_HOLD_DEL effect on output valid and GV _OV /2 for DD DD PCI or Memory Freescale Semiconductor Notes 2 ...

  • Page 25

    ... DC electrical characteristics for the I At recommended operating conditions with OV Parameter Input high voltage level Input low voltage level Low level output voltage MPC8241 Integrated Processor Hardware Specifications, Rev. 10 Freescale Semiconductor 13a2, 2.1 ns for 33 MHz PCI PCI_HOLD_DEL = 10 13a0 for 66 MHz PCI ...

  • Page 26

    ... I2PVKH t I2KHDX μA 10 — Min Max 0 400 4 1.3 — 4 0.6 — 4 0.6 — 4 0.6 — 4 100 — — — — 3 — 0.9 0.6 — 1.3 — 0.1 × OV — Freescale Semiconductor 2 3 Unit kHz μs μs μs μs ns μs μs μs V ...

  • Page 27

    ... The maximum t has only to be met if the device does not stretch the LOW period (t I2DXKL 4. Guaranteed by design Figure 16 provides the AC test load for the I Output MPC8241 Integrated Processor Hardware Specifications, Rev. 10 Freescale Semiconductor Electrical Specifications (continued) Table 12). Symbol V NH (first two letters of functional block)(signal)(state) (reference)(state) for outputs ...

  • Page 28

    ... GV _OV DD Min 1/14 SDRAM_SYNC_IN 40 — 0 — 1 sys_logic_clk period + 2 — Figure 18 and Figure 19, depict timing relationships to sys_logic_clk and S_CLK t I2CF t I2CR t I2PVKH 3.3 V ± 5% and DD Max Unit 1/2 SDRAM_SYNC_IN MHz — sys_logic_clk period + 6 ns — Freescale Semiconductor Notes 1 — — — ...

  • Page 29

    ... TRST setup time to TCK falling edge 5 TRST assert time 6 Input data setup time 7 Input data hold time 8 TCK to output data valid 9 TCK to output high impedance 10 TMS, TDI data setup time MPC8241 Integrated Processor Hardware Specifications, Rev. 10 Freescale Semiconductor Table 2) with LV DD Characteristic Electrical and Thermal Characteristics VM 4 ...

  • Page 30

    ... Data Outputs Data Outputs Figure 22. JTAG Boundary Scan Timing Diagram MPC8241 Integrated Processor Hardware Specifications, Rev Characteristic Midpoint Voltage 4 5 Figure 21. JTAG TRST Timing Diagram 8 9 Min Max Unit 15 — Input Data Valid Output Data Valid Freescale Semiconductor Notes — — — ...

  • Page 31

    ... Package outline Interconnects Pitch Solder balls Solder ball diameter Maximum module height Co-planarity specification Maximum force MPC8241 Integrated Processor Hardware Specifications, Rev. 10 Freescale Semiconductor 10 Input Data Valid 12 Output Data Valid × 357 1. (PBGA)—62 Sn/36 Pb/2 Ag—available only in Rev B parts ZQ (Thick substrate thick mold cap PBGA)— ...

  • Page 32

    ... DIMENSIONS IN MILLIMETERS. 3. DIMENSION b IS THE MAXIMUM SOLDER BALL DIAMETER MEASURED PARALLEL TO DATUM C. MILLIMETERS DIM MIN MAX A --- 2.05 A1 0.50 0.70 A2 0.95 1.35 A3 0.70 0.90 b 0.60 0.90 D 25.00 BSC D1 22.86 BSC D2 22.40 22.60 e 1.27 BSC E 25.00 BSC E1 22.86 BSC E2 22.40 22.60 Freescale Semiconductor ...

  • Page 33

    ... Figure 25 shows the top surface, side profile, and pinout of the MPC8241, 357 PBGA ZQ and VR packages. Figure 25. MPC8241 Package Dimensions and Pinout Assignments (ZQ and VR Packages) MPC8241 Integrated Processor Hardware Specifications, Rev. 10 Freescale Semiconductor Package Description 33 ...

  • Page 34

    ... DRV_PCI DD DD _OV DRV_PCI DD DD _OV DRV_PCI DD DD _OV DRV_PCI DD DD _OV DRV_PCI DD DD _OV — _OV DRV_STD_MEM DD DD _OV DRV_STD_MEM DD DD _OV DRV_MEM_CTRL DD DD _OV DRV_MEM_CTRL DD DD _OV DRV_MEM_CTRL DD DD _OV DRV_MEM_CTRL DD DD Freescale Semiconductor Notes — 10, 11 10, 11 ...

  • Page 35

    ... IRQ2/S_RST U19 IRQ3/S_FRAME P15 IRQ4/L_INT P2 SDA P17 SCL R19 SOUT1/PCI_CLK0 T16 SIN1/PCI_CLK1 U16 SOUT2/RTS1/PCI_CLK2 W18 SIN2/CTS1/PCI_CLK3 V19 PCI_CLK0/SOUT1 T16 MPC8241 Integrated Processor Hardware Specifications, Rev. 10 Freescale Semiconductor Power Pin Type Supply Output GV _OV DD DD I/O GV _OV DD DD Output GV _OV DD DD I/O ...

  • Page 36

    ... DD DRV_MEM_CTRL DRV_MEM_CTRL — DD — — DD DRV_STD_MEM 5 DD — — — DRV_STD_MEM 10, 11 — — DD — DRV_MEM_CTRL DRV_MEM_CTRL DRV_STD_MEM 5, 11 DRV_MEM_CTRL — DRV_STD_MEM 5 DD DRV_STD_MEM 1, 10 DRV_STD_MEM 23 DD DRV_STD_MEM DRV_STD_MEM — — 13 — — — DRV_PCI 23 DD Freescale Semiconductor ...

  • Page 37

    ... C15 A13 Connect R14 DD DA0/QACK A3 DA1/CKO L1 DA2 R5 DA3/PCI_CLK4 V17 DA4/REQ4 W13 DA5/GNT4 T11 MPC8241 Integrated Processor Hardware Specifications, Rev. 10 Freescale Semiconductor Power Pin Type Supply Input GV _OV DD Input GV _OV DD Power and Ground Signals Ground — Reference LV DD voltage 3.3 V, 5.0 V Power for GV ...

  • Page 38

    ... Pin Type I/O Output Output Output _OV DD and V entries Table 2 /AV / more than 1 any time including during power-on reset. Note that DD DD Power Output Supply Driver Type GV _OV — _OV DRV_PCI _OV DRV_STD_MEM _OV DRV_MEM_CTRL Table 3. for details. Freescale Semiconductor Notes ...

  • Page 39

    ... Not available 1C 11100 5,13 1D 11101 44 MPC8241 Integrated Processor Hardware Specifications, Rev. 10 Freescale Semiconductor 2 200-MHz Part PCI Clock Peripheral Logic/ CPU Input Mem Clock (PCI_ Mem Bus Range SYNC_IN) 3 Range (MHz) Range (MHz) (MHz) 5 25- 34– ...

  • Page 40

    ... Off Off Multipliers CPU Clock PCI-to-Mem Mem-to-CPU Range (Mem VCO) (CPU VCO) (MHz) 188–263 3 (2) 225–264 3 (2) 225–266 1 (4) 100–133 1 (Bypass) 100–176 2 (4) Freescale Semiconductor Mem-to- CPU (CPU VCO) Off Off 2.5 (2) 3 (2) 4.5 (2) 2 (4) 2 (4) ...

  • Page 41

    ... B) 11110 1E (Rev. D) 11110 MPC8241 Integrated Processor Hardware Specifications, Rev. 10 Freescale Semiconductor 9 266-MHz Part Periph Logic/ Mem Bus 1 Range Clock Range (MHz) (MHz) Bypass –66 50–66 Not Available –66 50– – ...

  • Page 42

    ... Howard Johnson recommends using multiple small capacitors of equal value instead of multiple values. MPC8241 Integrated Processor Hardware Specifications, Rev 266-MHz Part Periph Logic/ Mem Bus 1 Range Clock Range (MHz) (MHz) Not usable Multipliers CPU Clock PCI-to-Mem Mem-to-CPU Range (Mem VCO) (CPU VCO) (MHz) Off Figure 26 using surface and AV DD Freescale Semiconductor Off 2 DD ...

  • Page 43

    ... AN2164/D, MPC8245/MPC8241 Memory Clock Design Guidelines: Part 1 and AN2746, MPC8245/MPC8241 Memory Clock Design Guidelines: Part 2 for more details. Note the SDRAM_SYNC_IN to PCI_SYNC_IN time requirement (see MPC8241 Integrated Processor Hardware Specifications, Rev. 10 Freescale Semiconductor 10 Ω 2.2 µF 2.2 µF Low ESL Surface Mount Capacitors GND Figure 26 ...

  • Page 44

    ... SDA, SCL, SMI (the clamping voltage) with weak pull-up DD Table DD ) pins should be connected to 3.3 ± 0.3 V power supply if DD _OV . DD DD _OV and that the following DD DD 16. Unused active high input pins pins should be connected Freescale Semiconductor ...

  • Page 45

    ... IC). Regardless of the numbering, the signal placement recommended in common to all known emulators. MPC8241 Integrated Processor Hardware Specifications, Rev. 10 Freescale Semiconductor allows the COP port to independently assert HRESET or TRST, Figure System Design Information 27 ...

  • Page 46

    ... CHKSTOP_IN 8 TMS 9 TDO 1 TDI 3 TCK with a 1- kΩ pull-up resistor. DD with a 10-kΩ pull-up resistor. DD Figure 27. COP Connector Diagram MPC8241 5 SRESET HRST_CPU HRST_CTRL 10 kΩ kΩ kΩ kΩ TRST kΩ kΩ CHKSTOP_IN TMS TDO TDI TCK 1 QACK Freescale Semiconductor ...

  • Page 47

    ... A large heat sink (cross cut extrusion, 38 × 38 × 16.5 mm) is attached to the PBGA package and a • low board-level thermal loading from adjacent components exists (label used—2s2p/sink). MPC8241 Integrated Processor Hardware Specifications, Rev. 10 Freescale Semiconductor PBGA Package Heat Sink Heat Sink ...

  • Page 48

    ... Alpha Novatech, IERC, Chip Coolers, and Wakefield Engineering offer different heat sink-to-ambient thermal resistances, and may or may not need airflow. MPC8241 Integrated Processor Hardware Specifications, Rev 0.5 1 1.5 2 Airflow Velocity (m/s) Airflow Velocity (m/s) 603-224-9988 408-749-7601 800-522-6752 603-635-5102 1s 2s2p 1s/s ink 2s2p/s ink 2.5 Freescale Semiconductor ...

  • Page 49

    ... The selection of any thermal interface material depends on factors such as thermal performance requirements, manufacturability, service temperature, dielectric properties, and cost. MPC8241 Integrated Processor Hardware Specifications, Rev. 10 Freescale Semiconductor Figure Radiation Convection ...

  • Page 50

    ... Internet: www.chomerics.com Dow-Corning Corporation Dow-Corning Electronic Materials 2200 W. Salzburg Rd. Midland, MI 48686-0997 Internet: www.dow.com MPC8241 Integrated Processor Hardware Specifications, Rev Silicone Sheet (0.006 in.) Bare Joint Floroether Oil Sheet (0.007 in.) Graphite/Oil Sheet (0.005 in.) Synthetic Grease Contact Pressure (psi) 800-347-4572 781-935-4850 800-248-2481 Freescale Semiconductor ...

  • Page 51

    ... (ψ MPC8241 Integrated Processor Hardware Specifications, Rev. 10 Freescale Semiconductor , can be obtained from the equation: J × θCA . For instance, the user can change the size of the heat θCA ) measures the temperature at the top center of the package case ...

  • Page 52

    ... Numbers Fully Addressed by This Document.” Section 8.2, “Part Numbers Not Fully Addressed by This Document,” lists the part numbers which do not fully conform to the specifications of this document. These special part numbers require an additional document called a hardware specifications addendum. MPC8241 Integrated Processor Hardware Specifications, Rev Section 8.1, “Part Freescale Semiconductor ...

  • Page 53

    ... Table 20. Part Numbers Addressed by MPC8241TXXPNS Series nnnn MPC T Product Part Process Descriptor Code Identifier MPC8241 Integrated Processor Hardware Specifications, Rev. 10 Freescale Semiconductor Table 19. Part Numbering Nomenclature Package ZQ = thick substrate and thick mold cap PBGA (two layers thick substrate and thick mold cap PBGA (four layers, ...

  • Page 54

    ... MMMMM is the 5-digit mask number. ATWLYYWW is traceability code. CCCCC is the country code. Table 21. Revision History Table Substantive Change(s) Signals” Reworded paragraph beginning “The arrangement Figure 27 .. .” nnn x 166, 200 D:1.4 = 0x80811014 @ 1.8 V Rev. ID:0x14 ± 100 specifications as with other related integrated Freescale Semiconductor ...

  • Page 55

    ... Section 5.2 — Included package case outline for ZP (Rev. B) packaging parts. Section 9 — Updated Part markings for the offerings of the MPC8241. All sections — Nontechnical reformatting MPC8241 Integrated Processor Hardware Specifications, Rev. 10 Freescale Semiconductor Document Revision History Substantive Change(s) range and wording in note 7; Figure 11: changed wording os ...

  • Page 56

    ... Section 1.6—Added Table 19 for PLL of the 266-MHz part. Section 1.7.7—Corrected note numbering in COP connector diagram. Section 1.9.1—Updated package description in part marking nomenclature. MPC8241 Integrated Processor Hardware Specifications, Rev Substantive Change(s) in the sixth paragraph ± 0 Table 7. Freescale Semiconductor ± 0.3 V. ...

  • Page 57

    ... Updated Features list in Section 1.2. Corrected pin assignments in Table 16 for DA[15] and DQM[3] signals. Added vendor (Cool Innovations, Inc.) to list of heat sink vendors. 0 — Initial release. MPC8241 Integrated Processor Hardware Specifications, Rev. 10 Freescale Semiconductor Substantive Change( _OV instead ψ ...

  • Page 58

    ... Freescale Semiconductor product could create a situation where personal injury or death may occur. Should Buyer ...