MPC8241LZQ200D Freescale Semiconductor, MPC8241LZQ200D Datasheet - Page 13

• Manufacturer Part Number: MPC8241LZQ200D
• Description: IC MPU 32BIT 200MHZ PPC 357-PBGA
• Manufacturer: Freescale Semiconductor

Specifications of MPC8241LZQ200D

• Processor Type: MPC82xx PowerQUICC II 32-bit
• Speed: 200MHz
• Voltage: 1.8V
• Mounting Type: Surface Mount
• Package / Case: 357-PBGA
• Family Name: MPC82XX
• Device Core: PowerQUICC II
• Device Core Size: 32b
• Frequency (max): 200MHz
• Instruction Set Architecture: RISC
• Supply Voltage 1 (typ): 1.8V
• Operating Supply Voltage (max): 1.9V
• Operating Supply Voltage (min): 1.7V
• Operating Temp Range: 0C to 105C
• Operating Temperature Classification: Commercial
• Mounting: Surface Mount
• Pin Count: 357
• Package Type: BGA
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Features: -
• Lead Free Status / Rohs Status: Not Compliant

4.4
Table 6
“Thermal Management.”
4.5
After fabrication, functional parts are sorted by maximum processor core frequency as shown in
and tested for conformance to the AC specifications for that frequency. The processor core frequency is
determined by the bus (PCI_SYNC_IN) clock frequency and the settings of the PLL_CFG[0:4] signals.
Parts are sold by maximum processor core frequency. See
Freescale Semiconductor
Junction-to-ambient natural
convection
Junction-to-ambient natural
convection
Junction-to-ambient (@200 ft/min) Single-layer board (1s)
Junction-to-ambient (@200 ft/min) Four-layer board (2s2p)
Junction-to-board (bottom)
Junction-to-case (top)
Junction-to-package top
Notes:
1. Junction temperature is a function of on-chip power dissipation, package thermal resistance, mounting site (board)
2. Per SEMI G38-87 and EIA/JESD51-2 with the board horizontal.
3. Per EIA/JESD51-6 with the board horizontal.
4. Thermal resistance between the die and the printed circuit board per JEDEC JESD51-8. Board temperature is measured on
5. Indicates the average thermal resistance between the die and the case top surface as measured by the cold plate method
6. Thermal characterization parameter indicating the temperature difference between package top and the junction temperature
7. Note that the 166- and 200-MHz parts are in a two-layer package and the 266-MHz part is in a four-layer package, which
temperature, ambient temperature, airflow, power dissipation of other components on the board, and board thermal
resistance.
the top surface of the board near the package.
(MIL SPEC-883 Method 1012.1) with the cold plate temperature used for the case temperature.
per EIA/JESD51-2.
causes the two package types to have different thermal characterization data.
provides the package thermal characteristics for the MPC8241. For details, see
Thermal Characteristics
AC Electrical Characteristics
Rating
MPC8241 Integrated Processor Hardware Specifications, Rev. 10
Single-layer board (1s)
Four-layer board (2s2p)
Four-layer board (2s2p)
Single-layer board (1s)
Natural convection
Thermal Test Board
Table 6. Thermal Characterization Data
Description
Symbol
R
R
R
R
R
R
Ψ
θJMA
θJMA
θJMA
θJA
θJB
θJC
JT
Section 8, “Ordering Information.”
(166- and
200-MHz
Value
Parts)
38
25
31
22
17
8
2
7
Electrical and Thermal Characteristics
(266-MHz
Value
Part)
28
20
22
17
11
7
2
7
Section 7.7,
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
Unit
Table 7
Notes
1, 2
1, 3
1, 3
1, 3
4
5
6
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