MPC8241LZQ200D Freescale Semiconductor, MPC8241LZQ200D Datasheet - Page 31

IC MPU 32BIT 200MHZ PPC 357-PBGA

MPC8241LZQ200D

Manufacturer Part Number
MPC8241LZQ200D
Description
IC MPU 32BIT 200MHZ PPC 357-PBGA
Manufacturer
Freescale Semiconductor
Datasheet

Specifications of MPC8241LZQ200D

Processor Type
MPC82xx PowerQUICC II 32-bit
Speed
200MHz
Voltage
1.8V
Mounting Type
Surface Mount
Package / Case
357-PBGA
Family Name
MPC82XX
Device Core
PowerQUICC II
Device Core Size
32b
Frequency (max)
200MHz
Instruction Set Architecture
RISC
Supply Voltage 1 (typ)
1.8V
Operating Supply Voltage (max)
1.9V
Operating Supply Voltage (min)
1.7V
Operating Temp Range
0C to 105C
Operating Temperature Classification
Commercial
Mounting
Surface Mount
Pin Count
357
Package Type
BGA
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Features
-
Lead Free Status / Rohs Status
Not Compliant

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5
This section details package parameters, pin assignments, and dimensions.
5.1
The MPC8241 uses a 25 mm × 25 mm, cavity up, 357-pin plastic ball grid array (PBGA) package. The
package parameters are as follows.
Freescale Semiconductor
Package Description
Package outline
Interconnects
Pitch
Solder balls
Solder ball diameter
Maximum module height
Co-planarity specification
Maximum force
Package Parameters for the MPC8241
TDI, TMS
TDO
TDO
TCK
MPC8241 Integrated Processor Hardware Specifications, Rev. 10
Figure 23. Test Access Port Timing Diagram
1.27 mm
ZP (PBGA)—62 Sn/36 Pb/2 Ag—available only in Rev B parts
ZQ (Thick substrate thick mold cap PBGA)—62 Sn/36 Pb/2 Ag
VR (Lead free version of package)—95.5 Sn/4.0 Ag/0.5 Cu
2.52 mm
0.15 mm
6.0 lbs. total, uniformly distributed over package (8 grams/ball)
25 mm × 25 mm
357
0.75 mm
12
13
Input Data Valid
10
Output Data Valid
11
Package Description
31

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