MPC8241LZQ200D Freescale Semiconductor, MPC8241LZQ200D Datasheet - Page 50

IC MPU 32BIT 200MHZ PPC 357-PBGA

MPC8241LZQ200D

Manufacturer Part Number
MPC8241LZQ200D
Description
IC MPU 32BIT 200MHZ PPC 357-PBGA
Manufacturer
Freescale Semiconductor
Datasheet

Specifications of MPC8241LZQ200D

Processor Type
MPC82xx PowerQUICC II 32-bit
Speed
200MHz
Voltage
1.8V
Mounting Type
Surface Mount
Package / Case
357-PBGA
Family Name
MPC82XX
Device Core
PowerQUICC II
Device Core Size
32b
Frequency (max)
200MHz
Instruction Set Architecture
RISC
Supply Voltage 1 (typ)
1.8V
Operating Supply Voltage (max)
1.9V
Operating Supply Voltage (min)
1.7V
Operating Temp Range
0C to 105C
Operating Temperature Classification
Commercial
Mounting
Surface Mount
Pin Count
357
Package Type
BGA
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Features
-
Lead Free Status / Rohs Status
Not Compliant

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System Design Information
The board designer can choose among several types of thermal interface. Heat sink adhesive materials are
selected on the basis of high conductivity and adequate mechanical strength to meet equipment
shock/vibration requirements. Several commercially-available thermal interfaces and adhesive materials
are provided by the following vendors:
50
The Bergquist Company
18930 West 78
Chanhassen, MN 55317
Internet: www.bergquistcompany.com
Chomerics, Inc.
77 Dragon Ct.
Woburn, MA 01888-4014
Internet: www.chomerics.com
Dow-Corning Corporation
Dow-Corning Electronic Materials
2200 W. Salzburg Rd.
Midland, MI 48686-0997
Internet: www.dow.com
1.5
0.5
2
1
0
Figure 31. Thermal Performance of Select Thermal Interface Material
0
th
MPC8241 Integrated Processor Hardware Specifications, Rev. 10
St.
10
20
Contact Pressure (psi)
30
40
50
800-347-4572
781-935-4850
800-248-2481
Silicone Sheet (0.006 in.)
Bare Joint
Floroether Oil Sheet (0.007 in.)
Graphite/Oil Sheet (0.005 in.)
Synthetic Grease
60
70
Freescale Semiconductor
80

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