MPC7410RX500LE Freescale Semiconductor, MPC7410RX500LE Datasheet

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... MPX bus interface. • The MPC7410 adds full hardware-based multiprocessing capability, including a five-state cache coherency protocol (four MESI states plus a fifth state for shared intervention). © Freescale Semiconductor, Inc., 2005, 2007. All rights reserved. MPC7410EC Rev. 6.1, 11/2007 Contents 1. Overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 2. Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 3 ...

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... Full hardware detection of dependencies (resolved in the execution units) — Dispatch two instructions to eight independent units (system, branch, load/store, fixed-point unit 1, fixed-point unit 2, floating-point, AltiVec permute, AltiVec ALU) — Serialization control (predispatch, postdispatch, execution serialization) MPC7410 RISC Microprocessor Hardware Specifications, Rev. 6.1 2 Freescale Semiconductor ...

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... MPC7410 RISC Microprocessor Hardware Specifications, Rev. 6.1 Freescale Semiconductor Figure 1. MPC7410 Block Diagram Features 3 ...

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... Single-cycle unaligned access within double-word boundary — Alignment, zero padding, sign extend for integer register file — Floating-point internal format conversion (alignment, normalization) — Sequencing for load/store multiples and string operations MPC7410 RISC Microprocessor Hardware Specifications, Rev. 6.1 4 Freescale Semiconductor ...

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... Efficient data flow — All data buses between VRF, load/store unit, dL1, iL1, L2, and the bus are 128 bits wide — dL1 is fully pipelined to provide 128 bits/cycle to/from the VRF MPC7410 RISC Microprocessor Hardware Specifications, Rev. 6.1 Freescale Semiconductor virtual memory 32 ...

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... IEEE Std 1149.1™ JTAG interface — Array built-in self test (ABIST)—factory test only — Redundancy on L1 data arrays and L2 tag arrays • Reliability and serviceability — Parity checking on 60x and L2 cache buses MPC7410 RISC Microprocessor Hardware Specifications, Rev. 6.1 6 Freescale Semiconductor ...

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... The tables in this section describe the MPC7410 DC electrical characteristics. maximum ratings. Characteristic Core supply voltage PLL supply voltage L2 DLL supply voltage Processor bus supply voltage L2 bus supply voltage Input voltage Storage temperature range MPC7410 RISC Microprocessor Hardware Specifications, Rev. 6.1 Freescale Semiconductor 2 ) Table 3 Table 1. Absolute Maximum Ratings Symbol L2AV ...

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... V at any time including during GND Not to Exceed 10 (OV SYSCLK or t (L2OV L2CLK Figure 2. Overshoot/Undershoot Voltage Table 2. Voltage must be provided to the L2OV power pins (continued) Maximum Value Unit 260 °C Figure 2. and have a maximum Table 3 for actual Freescale Semiconductor Notes — DD ...

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... M xx 7410 xxnnn LE (Rev. 1.4) and later only. Previous revisions do not support BVSEL = ¬HRESET. (¬HRESET is the inverse of HRESET.) Table 3 provides the recommended operating conditions for the MPC7410. MPC7410 RISC Microprocessor Hardware Specifications, Rev. 6.1 Freescale Semiconductor Table 2. Input Threshold Voltage Setting 3 L2VSEL Signal 1 ...

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... V ± 100 mV V — 3.3 V ± 165 1.8 V ± 100 mV V — 2.5 V ± 100 mV V — GND — DD GND to L2OV V — 105 °C — and have a DD Value Unit Notes MPC7410 MPC7410 CBGA HCTE 18 20 °C °C °C °C/W 3 Freescale Semiconductor ...

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... Input low voltage (all inputs except SYSCLK) SYSCLK input high voltage SYSCLK input low voltage Input leakage current L2OV / MPC7410 RISC Microprocessor Hardware Specifications, Rev. 6.1 Freescale Semiconductor Symbol R θ JC for details on thermal management. Table 5. DC Electrical Specifications Table 3) Nominal Bus Symbol ...

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... L2OV is the reference for the L2 bus signals and L2OV , or both and L2OV vary by either +5% or –5%). Max Unit 20 µ – 0.45 — V — — 0.45 V 0.4 0.4 6.0 pF and L2OV must vary in the same /CV /CV DC limits Freescale Semiconductor Notes ...

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... PLL_CFG[0:3] signals. Parts are sold by maximum processor core frequency; see Section 10, “Ordering Information.” MPC7410 RISC Microprocessor Hardware Specifications, Rev. 6.1 Freescale Semiconductor Table 6. Power Consumption for MPC7410 Processor (CPU) Frequency 400 MHz 450 MHz Full-On Mode 4 ...

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... VM = Midpoint Voltage (OV DD /2) Figure 3. SYSCLK Input Timing Diagram 3. 500 MHz Unit Max Min Max 450 350 500 MHz 900 700 1000 MHz 133 33 133 MHz 30 7 0.5 — 0.5 ns ±150 — ±150 ps μs 100 — 100 for valid PLL_CFG[0: Freescale Semiconductor Notes — ...

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... SYSCLK to output high impedance (all except ABB/AMON(0), ARTRY/SHD, DBB/DMON(0), SHD0, SHD1) SYSCLK to ABB/AMON(0), DBB/DMON(0) high impedance after precharge Maximum delay to ARTRY, SHD0, SHD1 precharge MPC7410 RISC Microprocessor Hardware Specifications, Rev. 6.1 Freescale Semiconductor Section 4.2.3, “L2 Clock AC Specifications.” Table 3) Symbol t ...

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... Figure 4. AC Test Load 1 (continued) 400, 450, 500 MHz 2 Unit Min Max — SYSCLK 4). Input and output timings are measured at for inputs and (signal)(state)(reference)(state) symbolizes the time from KHOV ; that is, it should be high-Z as shown in SYSCLK Ω L Freescale Semiconductor Notes 0 ...

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... All Inputs All Outputs (Except TS, ABB, ARTRY, DBB) All Outputs (Except TS, ABB, ARTRY, DBB) TS, ABB/AMON(0), DBB/DMON(0) ARTRY, SHD0, SHD1 MPC7410 RISC Microprocessor Hardware Specifications, Rev. 6.1 Freescale Semiconductor Midpoint Voltage (OV DD /2) Figure 5. Mode Input Timing Diagram IXKH IVKH t t KHOV KHOX ...

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... L2CLK — 640 — 640 — — 50 — L2CSKW provides the potential range of L2CLK Table 10 are referenced to this 500 MHz Unit Max Min Max 400 133 400 MHz 7.5 2.5 7 — 640 — L2CLK — Freescale Semiconductor Notes 1, 4 — ...

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... The L2CLK_OUT timing diagram is shown in L2 Single-Ended Clock Mode L2CLK_OUTA L2CLK_OUTB L2SYNC_OUT L2 Differential Clock Mode L2CLK_OUTB L2CLK_OUTA L2SYNC_OUT Figure 7. L2CLK_OUT Output Timing Diagram MPC7410 RISC Microprocessor Hardware Specifications, Rev. 6.1 Freescale Semiconductor Table 3) 400 MHz 450 MHz Symbol Min Max Min — — ...

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... Figure 8 400, 450, 500 MHz Unit Notes Min Max — 1.0 ns 1.5 — ns — 0 — 2.5 — 2.5 — 2.9 — 3.5 ns 0.4 — 0.8 — 1.2 — 1.6 — ns — 2.0 — 2.5 — 3.0 — 3 Freescale Semiconductor and — ...

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... At recommended operating conditions (see Parameter TCK frequency of operation TCK cycle time TCK clock pulse width measured at OV TCK rise and fall times MPC7410 RISC Microprocessor Hardware Specifications, Rev. 6.1 Freescale Semiconductor VM t DVL2CH t DXL2CH VM = Midpoint Voltage (L2OV DD /2) Figure 8. L2 Bus Input Timing Diagrams ...

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... MPC7410 RISC Microprocessor Hardware Specifications, Rev. 6.1 22 Table 3) Symbol t TRST t DVJH t TMS, TDI IVJH t DXJH t TMS, TDI IXJH t JLDV t TDO JLOV t JLDZ t TDO JLOZ = 50 Ω JHJL t TCLK VM = Midpoint Voltage (OV 1 (continued) Min Max Unit 25 — — 0 — — 25 — Ω /2) DD Freescale Semiconductor Notes ...

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... Figure 15 provides the test access port timing diagram. TCK TDI, TMS TDO TDO Output Data Valid Figure 15. Test Access Port Timing Diagram MPC7410 RISC Microprocessor Hardware Specifications, Rev. 6.1 Freescale Semiconductor t TRST VM = Midpoint Voltage (OV /2) DD Figure 13. TRST Timing Diagram VM t DVJH ...

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... HCTE_LGA package to indicate the direction of the top surface view. Part Part B MPC7410 RISC Microprocessor Hardware Specifications, Rev. 6.1 24 Figure 16, part B shows the side profile of the CBGA and HCTE_CBGA Figure 16, part C shows the side profile of the Not to Scale View Substrate Assembly Encapsulant BGA Package Die Freescale Semiconductor ...

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... K1 DH[0:31] W12, W11, V11, T9, W10, U9, U10, M11, M9, P8, W7, P9, W9, R10, W6, V7, V6, U8, V9, T7, U7, R7, U6, W5, U5, W4, P7, V5, V4, W3, U4, R5 MPC7410 RISC Microprocessor Hardware Specifications, Rev. 6.1 Freescale Semiconductor View Substrate Assembly Encapsulant as Viewed from the Top Surface Pin Number Pinout Listings ...

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... Output L2VSEL High Output L2VSEL High I/O L2VSEL High I/O L2VSEL — — N/A High Input L2VSEL High Output L2VSEL High Input BVSEL Freescale Semiconductor Notes — — — — — — — 2 — 8 — — — — — — 11 — ...

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... D9 TEA J1 TMS C8 TRST A10 TS K7 TSIZ[0:2] A9, B9, C9 TT[0:4] C10, D11, B12, C12, F11 WT C3 MPC7410 RISC Microprocessor Hardware Specifications, Rev. 6.1 Freescale Semiconductor Pin Number Pinout Listings 1 Active I/O I/F Select High Input N/A Low Output L2VSEL High Output L2VSEL Low ...

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... PLL and DLL (after filtering to become DD Table 2 and the voltage supplied. For actual recommended value 3. DD based Active I/O I/F Select — — N/A for normal machine operation. Table 2 for supported BVSEL and L2VSEL pin on the MPC7410 360 package. DD Freescale Semiconductor Notes — ...

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... Package outline Interconnects Pitch Minimum module height Maximum module height Ball diameter Coefficient of thermal expansion MPC7410 RISC Microprocessor Hardware Specifications, Rev. 6.1 Freescale Semiconductor 25 × 360 (19 × 19 ball array – 1) 1.27 mm (50 mil) 2.72 mm 3.20 mm 0.89 mm (35 mil) 6.8 ppm/°C (CBGA) 12.3ppm/° ...

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... A3 — 0.60 A4 0.82 0.90 b 0.82 0.93 D 25.00 BSC D2 — 12.50 D4 6.00 9.00 e 1.27 BSC E 25.00 BSC E2 — 14.30 E4 8.00 11.00 F 22.86 BSC K1 — 9.75 K2 6.46 — K3 8.20 8.60 K4 2.75 — L1 — 9.50 L2 6.94 — 3.10 3. 3.00 — Freescale Semiconductor ...

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... MPC7410, 360 HCTE_CBGA (lead-free C5 spheres) package. A1 CORNER 0 1213141516 F e 360X Figure 18. Mechanical Dimensions and Bottom Surface Nomenclature for the MPC7410 360 HCTE_CBGA (Lead-Free C5 Spheres) Package MPC7410 RISC Microprocessor Hardware Specifications, Rev. 6.1 Freescale Semiconductor 2X Capacitor Region 0 0. ...

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... The package parameters are as listed here. The package type is the 25 × 25 mm, 360 high coefficient of thermal expansion LGA package (HCTE_LGA). Package outline Interconnects Pitch Minimum module height Maximum module height Coefficient of thermal expansion MPC7410 RISC Microprocessor Hardware Specifications, Rev. 6 × 360 (19 × 19 land array – 1) 1.27 mm (50 mil) 1.92 mm 2.20 mm 12.3ppm/°C Freescale Semiconductor ...

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... Mechanical Dimensions for the MPC7410, 360 HCTE_LGA Figure 19 provides the mechanical dimensions and bottom surface nomenclature of the MPC7410, 360 HCTE_LGA package. A1 CORNER 0 111213141516 F e 360X Figure 19. Mechanical Dimensions and Bottom Surface Nomenclature for the MPC7410, MPC7410 RISC Microprocessor Hardware Specifications, Rev. 6.1 Freescale Semiconductor 2X Capacitor Region ...

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... C5-2 GND C6 0.01 C6-2 GND Bus Bus Bus 83.3 MHz 100 MHz 133 MHz — — — — — — — — — — — 400 (800) — — 350 465 (700) (930) — — 400 — (800) Freescale Semiconductor ...

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... The core-to-L2 frequency divisor for the L2 PLL is selected through the L2CLK bits of the L2CR register. Generally, the divisor must be chosen according to the frequency supported by the external RAMs, the frequency of the MPC7410 RISC Microprocessor Hardware Specifications, Rev. 6.1 Freescale Semiconductor Bus Bus ...

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... High frequency noise in DD power plane could affect the stability of DD input signals should both implement the DD power plane, as described above, and DD sensitivities to OV and power plane due to I/O switching DD ) internal to the MPC7410 DD Figure 22 at the AV input. Existing designs DD Freescale Semiconductor input DD noise, DD input of ...

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... Suggested bulk capacitors—100–330 µF (AVX TPS tantalum or Sanyo OSCON). MPC7410 RISC Microprocessor Hardware Specifications, Rev. 6.1 Freescale Semiconductor filter solutions, and the filter providing the most robust margin should DD 10 Ω ...

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... The voltage drop across the force /2, is divided by the measured current to determine the output DD . Similarly, the impedance of the pull-up device is determined by dividing N /2, by the current sank by the pull-up when the data is high and L2OV , and GND pins of the MPC7410 )/ SW2 SW1 Freescale Semiconductor , force ...

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... During inactive periods on the bus, the address and transfer attributes may not be driven by any master and may, therefore, float in the high-impedance state for relatively long periods of time. Since the MPC7410 must continually monitor these signals for snooping, this float condition may cause excessive power draw by the input receivers on MPC7410 RISC Microprocessor Hardware Specifications, Rev. 6.1 Freescale Semiconductor = ( ...

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... MPC7410 RISC Microprocessor Hardware Specifications, Rev. 6.1 40 allows the COP port to independently assert HRESET or TRST, while ensuring Figure 25, if this is not possible, the isolation resistor will allow adds many benefits—breakpoints, watchpoints, register and memory Freescale Semiconductor ...

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... HRESET from the target source to TRST of the part through a 0-Ω isolation resistor. 6. The COP port and target board should be able to independently assert HRESET and TRST to the pro- cessor in order to fully control the processor as shown above. MPC7410 RISC Microprocessor Hardware Specifications, Rev. 6.1 Freescale Semiconductor SRESET HRESET QACK ...

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... PCI bridge chip in a system and is an input to the Figure 27 for the LGA package. This spring force should not exceed BGA Package Heat Sink Heat Sink Clip Printed-Circuit Board 25; consequently, many different pin Figure 25 is common to all known Freescale Semiconductor ...

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... Ultimately, the final selection of an appropriate heat sink depends on many factors, such as thermal performance at a given air velocity, spatial volume, mass, attachment method, assembly, and cost. MPC7410 RISC Microprocessor Hardware Specifications, Rev. 6.1 Freescale Semiconductor LGA Package Heat Sink Heat Sink ...

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... MPC7410 RISC Microprocessor Hardware Specifications, Rev. 6.1 44 Radiation Convection Heat Sink Printed-Circuit Board Radiation Convection Thermal Interface Material Die/Package Die Junction Package/Leads Figure 29 Figure Freescale Semiconductor shows 26). ...

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... Dow-Corning Electronic Materials 2200 W. Salzburg Rd. Midland, MI 48686-0997 Internet: www.dow.com Shin-Etsu MicroSi, Inc. 10028 S. 51st St. Phoenix, AZ 85044 Internet: www.microsi.com MPC7410 RISC Microprocessor Hardware Specifications, Rev. 6.1 Freescale Semiconductor Silicone Sheet (0.006") Bare Joint Floroether Oil Sheet (0.007") Graphite/Oil Sheet (0.005") Synthetic Grease ...

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... The thermal resistance typically about 1°C/W. Assuming 5.0 W, the following expression for 7°C/W, thus sa Table ) may range from 30° 30° 5°C, a CBGA package obtained × 5 versus airflow velocity is sa Freescale Semiconductor 3. ...

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... For these reasons, we recommend using conjugate heat transfer models for the board, as well as, system-level designs. MPC7410 RISC Microprocessor Hardware Specifications, Rev. 6.1 Freescale Semiconductor Thermalloy #2328B Pin-Fin Heat Sink (25 × 28 × 15 mm) 0 ...

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... JMA changed from 8 to 9°C/W. θ JB changed from 14 to 11°C/W. θ JB removing optional heat sink clip to package. Section for HCTE_CBGA Lead Free C5 Spheres package, similar to Figure HCTE_CBGA device. 8.8. Figure 17 but with Table 17 and Table Freescale Semiconductor 19. ...

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... Section 1.8.2—revised section for HCTE package. Added text and figure for AV package. Section 1.8.6—removed AACK, TEA, and TS from control signals requiring pull-ups. Removed TBST from snooped transfer attribute list. TBST is an output and is not snooped. MPC7410 RISC Microprocessor Hardware Specifications, Rev. 6.1 Freescale Semiconductor Substantive Change(s) OH per Product Bulletin. OL filter selection for the CBGA package ...

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... Table 21—added MPC7410THXnnnLE extended temperature HCTE package part numbers and part number specification document reference. MPC7410 RISC Microprocessor Hardware Specifications, Rev. 6.1 50 Substantive Change(s) from –0.3 to 3.465 to now be –0.3 to 3.6 and L2OV –0.3 to 2.8. DD references for revisions prior to Rev. 1.4 have while OV references t L2CLK DD SYSCLK Freescale Semiconductor . ...

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... Table 3—added notes 5 and 6 to clarify BVSEL for revisions prior to Rev. E which do not support 3 Table 5—added note 8 regarding DC voltage limits for JTAG signals. MPC7410 RISC Microprocessor Hardware Specifications, Rev. 6.1 Freescale Semiconductor Substantive Change(s) and I leakage current specs. in TSI Document Revision History ...

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... Updated Table 11—L2SYNC_IN to high impedance. Updated Figure 17—mechanical dimensions, adds capacitor pad dimensions. 0.1 — Minor updates. 0 — Initial release. MPC7410 RISC Microprocessor Hardware Specifications, Rev. 6.1 52 Substantive Change(s) from 2 compatible with L2CHOX . of the MPC107. Added OH Freescale Semiconductor ...

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... Processor core frequencies supported by parts addressed by this specification only. Not all parts described in this specification support all core frequencies. Additionally, parts addressed by part number specifications may support other maximum core frequencies. MPC7410 RISC Microprocessor Hardware Specifications, Rev. 6.1 Freescale Semiconductor Table 17. Part Numbering Nomenclature nnn x ...

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... Package 1 Frequency 400 450 x Revision Level 1 C: 1.2; PVR = 800C 1102 2 D: 1.3; PVR = 800C 1103 3 E: 1.4; PVR = 800C 1104 N E Revision Level E: 1.4; PVR = 800C 1104 N E Application Revision Level Modifier N: 1.5 V ± 1.4; PVR = 800C 1104 Freescale Semiconductor ...

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... MMMMMM is the 6-digit mask number. AWLYYWWA is the traceability code. CCCCC is the country of assembly. This space is left blank if parts are assembled in the United States. Figure 31. Part Marking for HCTE_CBGA Device MPC7410 RISC Microprocessor Hardware Specifications, Rev. 6.1 Freescale Semiconductor Figure 31. MPC7410 HXnnnLE ...

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... All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. Freescale Semiconductor does not convey any license under its patent rights nor the rights of others. Freescale Semiconductor products are not designed, intended, or authorized for use as components in systems intended for surgical ...