LTC4269IDKD-1#PBF Linear Technology, LTC4269IDKD-1#PBF Datasheet - Page 42

• Manufacturer Part Number: LTC4269IDKD-1#PBF
• Description: IC PD/OPTO FLYBACK CTRLR 32-DFN
• Manufacturer: Linear Technology
• Type: Power Over Ethernet (PoE)r

Specifications of LTC4269IDKD-1#PBF

• Applications: Power Interface Switch for Power Over Ethernet (PoE) Devices
• Voltage - Supply: 14 V ~ 16 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 32-DFN
• Current - Supply: 1.35mA
• Interface: IEEE 802.3af
• Controller Type: Powered Device Interface Controller (PD)
• Input Voltage: 60V
• Supply Current: 6.4mA
• Digital Ic Case Style: DFN
• No. Of Pins: 32
• Duty Cycle (%): 88%
• Frequency: 100kHz
• Operating Temperature Range: -40°C To +85°C
• Msl: MSL 1 - Unlimited
• Rohs Compliant: Yes
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

LTC4269-1
PACKAGE DESCRIPTION
42
4.50 ± 0.05
3.10 ± 0.05
0.200 REF
NOTE:
1. DRAWING PROPOSED TO BE MADE VARIATION OF VERSION (WXXX)
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
IN JEDEC PACKAGE OUTLINE M0-229
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
2.65 ±0.05
PIN 1
TOP MARK
(SEE NOTE 6)
RECOMMENDED SOLDER PAD LAYOUT
0.40 BSC
6.43 ±0.05
7.00 ±0.10
6.00 REF
0.20 ± 0.05
(Reference LTC DWG # 05-08-1734 Rev A)
32-Lead Plastic DFN (7mm × 4mm)
0.00 – 0.05
0.75 ±0.05
DKD Package
0.70 ± 0.05
4.00 ±0.10
PACKAGE
OUTLINE
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.20mm ON ANY SIDE
ON THE TOP AND BOTTOM OF PACKAGE
R = 0.05
TYP
17
16
2.65 ±0.10
BOTTOM VIEW—EXPOSED PAD
6.43 ±0.10
0.40 BSC
R = 0.115
TYP
6.00 REF
0.35 × 45° CHAMFER
R = 0.30 TYP OR
PIN 1 NOTCH
0.20 ± 0.05
(DKD32) QFN 0707 REV A
32
1
0.40 ± 0.10
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