ISP1760ETUM

Manufacturer Part NumberISP1760ETUM
DescriptionIC USB CTRL HI-SPEED 128TFBGA
ManufacturerST-Ericsson Inc
ISP1760ETUM datasheet
 


Specifications of ISP1760ETUM

Controller TypeUSB Peripheral ControllerInterfaceEHCI Interface
Voltage - Supply3 V ~ 3.6 VOperating Temperature-40°C ~ 85°C
Mounting TypeSurface MountPackage / Case128-TFBGA
Lead Free Status / RoHS StatusLead free / RoHS CompliantCurrent - Supply-
Other namesISP1760ET-T
ISP1760ET-T
  
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S e m i c o n d u c t o r s
Inside World News
Automotive
Networking
Technology
4 to 6
Consumer
7 & 8
MultiMarket Semiconductors
Identification
Products in brief
Communications
First 32-bit IVN gateway controller
ARM-based microcontroller with CAN and LIN interfaces for
sophisticated automotive networking solutions
>
See page 2
ULPI increases USB interoperability
New interface standard for embedded USB transceivers reduces
time to market for new products
>
See page 3
Making software development easier
Standardization and cooperation simplify software creation enabling
shorter time to market for home entertainment systems
>
See page 4
RF System-in-a-Package
Combining multiple active and passive dies into a single package
delivers optimum performance and size for RF systems
>
See page 5
First-ever reference design for DVD+RW /
HDD recorders
Cutting development time and cost for an exciting new product type
>
See page 7
The NFC Forum
Philips, Sony and Nokia launch industry forum to promote
NFC technology
>
See page 10
Nexperia Display Module for camera phones
Plug-and-play solution delivers high performance and low power
consumption at low cost
>
See page 12
World News pdf
www.semiconductors.philips.com/publications/worldnews/13.2.pdf
World News
Technology Focus
page
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Much of Philips’ product and package portfolios has been lead-free (Pb-free) for years.Through continuous
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upgrading – replacing SnPb plating with pure tin – and innovative design, full conversion is expected well
before new legislation comes into effect in 2006. Already, Philips’ entire range of small-signal discrete,
plastic, surface mount devices (SMDs) is now in 100% lead-free packaging.This will be followed quickly by
the complete portfolio of glass and ceramic products.
Philips’ drive to eliminate lead from electronic products supports
formal guidelines introduced by various bodies. Of particular
relevance, the RoHS (Restrictions on Hazardous Substances)
establishes phase-out dates for Pb in electronic products, so that
lead content must be below certain limits by July 2006. Philips’
lead-free program aims to achieve complete conversion ahead
of new legislation and without adversely affecting technical
specifications or customers’ manufacturing processes.
In 2001, Philips teamed up with STMicroelectronics and Infineon
Technologies to form the E3 collaboration with the aim of
developing standards relating to lead-free products. These
standards are based on factors such as solderability, material
reliability and characterization of the moisture sensitivity level
(MSL). E3 shares two main goals: compatibility with both SnPb
and Pb-free soldering, and elimination of lead in terminals (leads,
balls, bumps) – the main source of Pb in packages. E3 defines
lead-free as less than 1000 ppm lead content by weight. Increased
uniformity is aided by their ‘Green package’ definition, ensuring
lead and certain other elements are not intentionally added
during manufacture.
Losing lead without compromise
Replacing lead-based package terminals with pure tin (100% Sn)
plating creates a fully compatible Pb-free alternative, equal in size
and electrical / mechanical characteristics. Also, Sn plating means
lead-free Philips devices can still be used in conventional SnPb
soldering. Philips applies solder tests to ensure forward / backward
compatibility, and results also show that solder joint reliability
of Pb-free packages is equal to or better than that for SnPb.
In addition, all current Philips products have been re-qualified to
deliver lead-free solutions that meet industrial standards.
Volume 13
Number 2
May - June 2004
Philips puts its weight
behind Pb-free
Several preventative measures ensure that whisker growth – the
term for metallic protrusion on electroplated layers – is not a
problem with Pb-free: this has been confirmed by more than two
years of extensive testing. Furthermore, MSL remains the same
for Pb and Pb-free packages, although it may be affected by higher
Pb-free soldering temperatures used in some processes.
Leading the way to lead-free!
With the path firmly laid for qualified Pb-free standards and
products, Philips now leads the industry’s drive towards 100%
lead-free packaging with the introduction of the lead-free plastic
SMD portfolio.
“We have accelerated our drive to deliver 100% lead-free
products with the introduction of our portfolio of small-signal
plastic SMDs,” said Frans Scheper, Senior Vice President of Philips
Semiconductors. “We wanted to enable a smooth transition for
our customers by providing forward and backward compatibility
of the devices with the reliability they need, and in plenty of time
to test and prepare before forthcoming legislation.”
Philips’ active program of rapid Pb-free conversion proves
the company’s commitment to delivering quality products that
meet customer requirements and contribute to a cleaner,
greener environment.
www.semiconductors.philips.com
• /green_roadmap/
• /news/content/file_1031.html
Technology continue

ISP1760ETUM Summary of contents

  • Page 1

    Inside World News Automotive Networking Technology Consumer 7 & 8 MultiMarket Semiconductors Identification Products in brief Communications First 32-bit IVN gateway controller ARM-based ...

  • Page 2

    Industry’s first 32-bit IVN gateway controller Today’s in-vehicle networks (IVNs) require more memory and greater computing power in their control modules. Intricate networks are becoming even more complex as the number of applications increases. So Philips’ new dedicated automotive microcontroller, ...

  • Page 3

    ULPI increases interoperability of USB components Leading names in Universal Serial Bus (USB) connectivity have joined forces to develop a new transceiver interface standard for Hi-Speed USB 2.0 that reduces development time, increases design flexibility and ensures interoperability.The UTMI+ Low ...

  • Page 4

    Easier software development for attractive consumer products Software is a vital element of today’s consumer devices, providing more and more exciting new features and broad product differentiation. However, creating robust and reliable software is a long and expensive process. Philips ...

  • Page 5

    Maximize RF performance, minimize system size Increased integration, smaller devices and higher frequencies are major trends in RF design. Philips helps designers respond to these challenges while improving overall RF performance with RF System-in-a-Package (RF SiP) and passive integration technologies.The ...

  • Page 6

    Collaboration drives advanced process development For leading consumer electronics companies, access to state-of-the-art semiconductor technology is the key to delivering ever-richer consumer experiences in areas such as multimedia entertainment and communications. Philips is heavily involved in many cooperative projects to ...

  • Page 7

    First-ever DVD+RW/HDD combination recorder reference design Philips offers the world’s first semiconductor reference design for DVD+ RW and hard disk drive (HDD) combination recorders. Combination devices are the next step towards the vision of the Connected Consumer and are expected ...

  • Page 8

    Latest LCD TV solutions are world firsts The booming flat panel display and LCD TV market is likely to reach 32 million units by 2008, according to Strategy Analytics.Though currently dominated by small and medium-sized displays, the 30"+ segment is ...

  • Page 9

    New arrivals in the LPC2100 family Philips has expanded its LPC2100 32-bit microcontroller range with nine 2 new devices featuring CAN, SPI, UART and I C. Offering high performance and low power consumption, these compact devices provide cost-effective solutions for ...

  • Page 10

    New industry forum to promote NFC technology Philips and Sony have been driving the development of Near Field Communication (NFC) technology over the last eighteen months. Now, together with Nokia – the world’s largest mobile handset vendor – they are ...

  • Page 11

    New products in brief Because of the breadth of the Philips Semiconductors product range, not all new products can be described in detail.The list below shows new products not dealt with elsewhere in this issue. For full information on any ...

  • Page 12

    Integrated display module for camera phones As the camera phone market matures, more and more applications are being developed, creating and exploiting business opportunities that didn’t exist just a few years ago. Many of these applications require higher-resolution displays, but ...