TDA8024T-T NXP Semiconductors, TDA8024T-T Datasheet

IC SMART CARD INTERFACE 28-SOIC

TDA8024T-T

Manufacturer Part Number
TDA8024T-T
Description
IC SMART CARD INTERFACE 28-SOIC
Manufacturer
NXP Semiconductors
Datasheet

Specifications of TDA8024T-T

Controller Type
Smart Card Interface
Interface
Analog
Voltage - Supply
2.7 V ~ 6.5 V
Current - Supply
1.5mA
Operating Temperature
-25°C ~ 85°C
Mounting Type
Surface Mount
Package / Case
28-SOIC (7.5mm Width)
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
568-2448-2
Product specification
Supersedes data of 2003 Aug 19
DATA SHEET
TDA8024
IC card interface
INTEGRATED CIRCUITS
2004 July 12

Related parts for TDA8024T-T

TDA8024T-T Summary of contents

Page 1

DATA SHEET TDA8024 IC card interface Product specification Supersedes data of 2003 Aug 19 INTEGRATED CIRCUITS 2004 July 12 ...

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Philips Semiconductors IC card interface CONTENTS 1 FEATURES 2 APPLICATIONS 3 GENERAL DESCRIPTION 4 ORDERING INFORMATION 5 QUICK REFERENCE DATA 6 BLOCK DIAGRAM 7 PINNING 8 FUNCTIONAL DESCRIPTION 8.1 Power supply 8.2 Voltage supervisor 8.2.1 Without external divider on pin ...

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... NAME TDA8024T SO28 plastic small outline package; 28 leads; body width 7.5 mm TDA8024AT SO28 plastic small outline package; 28 leads; body width 7.5 mm TDA8024TT TSSOP28 plastic thin shrink small outline package; 28 leads; body width 4.4 mm 2004 July 12 2 APPLICATIONS IC card readers for banking ...

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Philips Semiconductors IC card interface 5 QUICK REFERENCE DATA SYMBOL PARAMETER Power supplies V supply voltage DD V DC/DC converter supply DDP voltage I supply current DD I DC/DC converter supply DDP current Card supply V card supply voltage (including ...

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Philips Semiconductors IC card interface 6 BLOCK DIAGRAM 100 SUPPLY INTERNAL R1 REFERENCE 18 PORADJ (1) VOLTAGE SENSE R2 23 OFF 20 RSTIN 19 CMDVCC 3 5V/3V 1 CLKDIV1 2 CLKDIV2 CLOCK CIRCUITRY 24 ...

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Philips Semiconductors IC card interface 7 PINNING SYMBOL PIN TYPE CLKDIV1 1 I CLKDIV2 2 I 5V/ PGND I DDP I/O UP PRES 9 I PRES ...

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... OFF 22 GND RSTIN 19 CMDVCC 18 n. RST 15 CLK 7 Product specification TDA8024 5V/ PGND DDP TDA8024TT PRES 9 20 PRES I/O AUX2 12 17 AUX1 CGND 001aab431 Fig.3 Pin configuration TDA8024TT. AUX2UC AUX1UC I/OUC XTAL2 XTAL1 OFF GND V DD RSTIN CMDVCC PORADJ V CC RST CLK ...

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Philips Semiconductors IC card interface 8 FUNCTIONAL DESCRIPTION Throughout this document it is assumed that the reader is familiar with ISO7816 terminology. 8.1 Power supply The supply pins for the IC are the range of 2.7 ...

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Philips Semiconductors IC card interface 8.2.2 W ITH AN EXTERNAL DIVIDER ON PIN TDA8024AT) FOR THE If an external resistor bridge is connected to pin PORADJ (R1 and R2 in Fig.1), then the following occurs: The internal threshold voltage V ...

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Philips Semiconductors IC card interface 8.3 Clock circuitry The card clock signal (CLK) is derived from a clock signal input to pin XTAL1 or from a crystal operating MHz connected between pins XTAL1 and XTAL2. The ...

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Philips Semiconductors IC card interface (V) ( (1) Current. (2) Voltage. Fig.6 I/O, AUX1 and AUX2 output voltage and current as functions of time during a LOW-to-HIGH transition. 8.5 Inactive mode After ...

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Philips Semiconductors IC card interface handbook, full pagewidth CMDVCC I/O CLK RSTIN RST I/OUC Fig.7 Activation sequence using RSTIN and CMDVCC. handbook, full pagewidth CMDVCC I/O CLK RSTIN ...

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Philips Semiconductors IC card interface 8.7 Active mode When the activation sequence is completed, the TDA8024 will be in its active mode. Data is exchanged between the card and the microcontroller via the I/O lines. The TDA8024 is designed for ...

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Philips Semiconductors IC card interface 8.9 V generator CC The V generator has a capacity to supply continuously and internal overload detector operates at approximately 120 ...

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Philips Semiconductors IC card interface handbook, full pagewidth OFF PREST RST CLK I Fig.11 Emergency deactivation sequence (card extraction). 2004 July Product ...

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... R thermal resistance from junction th(j-a) to ambient TDA8024T TDA8024AT TDA8024TT Note 1. This figure was obtained using the following PCB technology: FR, 4 layers, 0.5 mm thickness, class 5, copper thickness 35 m, Ni/Go plating, ground plane in internal layers 2004 July 12 CONDITIONS pins XTAL1, XTAL2, 5V/3V, RSTIN, ...

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Philips Semiconductors IC card interface 12 CHARACTERISTICS DDP amb otherwise specified. SYMBOL PARAMETER Temperature T ambient temperature amb Supplies V supply voltage DD V DC/DC converter ...

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Philips Semiconductors IC card interface SYMBOL PARAMETER DC/DC converter f clock frequency CLK V threshold voltage for th(vd-vf) voltage doubler to change to voltage follower V output voltage on pin V UP(av) (average value) Card supply voltage (pin V ); ...

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Philips Semiconductors IC card interface SYMBOL PARAMETER Crystal oscillator (pins XTAL1 and XTAL2 external capacitance on XTAL1 C pins XTAL1 and XTAL2 XTAL2 f crystal frequency XTAL f frequency applied on XTAL1 pin XTAL1 V LOW-level input voltage ...

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Philips Semiconductors IC card interface SYMBOL PARAMETER Data lines to microcontroller (pins I/OUC, AUX1UC and AUX2UC; with integrated 11 k pull-up resistors LOW-level output voltage OL V HIGH-level output voltage OH V LOW-level input voltage ...

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Philips Semiconductors IC card interface SYMBOL PARAMETER t fall time f duty factor (except for f ) XTAL SR slew rate Control inputs (pins CLKDIV1, CLKDIV2, CMDVCC, RSTIN and 5V/3V); note 6 V LOW-level input voltage IL V HIGH-level input ...

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Philips Semiconductors IC card interface Notes 1. All parameters remain within limits but are tested only statistically for the temperature range. When a parameter is specifi function external bridge is used then, ...

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Philips Semiconductors IC card interface handbook, full pagewidth 100 (1) 100 nF (1) 100 nF 100 k 3.3 V (1) These capacitors must be of the low ESR-type and be placed near the IC (within ...

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Philips Semiconductors IC card interface 14 PACKAGE OUTLINES SO28: plastic small outline package; 28 leads; body width 7 pin 1 index 1 DIMENSIONS (inch dimensions are derived from the original mm dimensions) A UNIT A A ...

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Philips Semiconductors IC card interface TSSOP28: plastic thin shrink small outline package; 28 leads; body width 4 pin 1 index 1 DIMENSIONS (mm are the original dimensions) A UNIT max. ...

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Philips Semiconductors IC card interface 15 SOLDERING 15.1 Introduction to soldering surface mount packages This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in our “Data Handbook IC26; ...

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Philips Semiconductors IC card interface 15.5 Suitability of surface mount IC packages for wave and reflow soldering methods PACKAGE (3) BGA, HTSSON..T , LBGA, LFBGA, SQFP, SSOP..T USON, VFBGA DHVQFN, HBCC, HBGA, HLQFP, HSO, HSOP, HSQFP, HSSON, HTQFP, HTSSOP, HVQFN, ...

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Philips Semiconductors IC card interface 16 DATA SHEET STATUS DATA SHEET PRODUCT LEVEL (1) STATUS STATUS I Objective data Development II Preliminary data Qualification III Product data Production Notes 1. Please consult the most recently issued data sheet before initiating ...

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Philips Semiconductors – a worldwide company Contact information For additional information please visit http://www.semiconductors.philips.com. For sales offices addresses send e-mail to: sales.addresses@www.semiconductors.philips.com. © Koninklijke Philips Electronics N.V. 2004 All rights are reserved. Reproduction in whole or in part is prohibited ...

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